Abstract: Methods, systems and computer devices are provided for adjusting a frame-listening cycle. The method includes: configuring, by a server, a fixed frame-listening cycle of an electronic shelf label according to a time period; and sending, by the server, a second frame-listening cycle modification command through a base station when the server is to issue the fast response service during the low power consumption time period, so that the electronic shelf label modifies the current frame-listening cycle to a fast frame-listening cycle according to the second frame-listening cycle modification command. According to the present disclosure, the electronic shelf label can not only respond to the fast response service in real time, but also keep the low power consumption of a long frame-listening cycle, thereby simultaneously satisfying the requirements of high real-time performance and low power consumption of the electronic shelf label.

Abstract: An optical transmission device includes: a control module generate a control signal output which includes a slope adjust signal and a bias voltage offset adjust signal according to an input signal indicating a dispersion amount an electrical level adjust signal; a multi-level pulse amplitude modulator; and an asymmetrical optical modulator which is controlled by the slope adjust signal to be operated at one of a positive slope and a negative slope of a transfer function of the asymmetrical optical modulator itself, and is controlled by the bias voltage offset adjust signal of the control signal output to offset a bias voltage point of the asymmetrical optical modulator itself from a quadrature point of the transfer function, and modulates the multi-level pulse amplitude modulation signal to an optical signal to generate an optical modulate signal having a chirp.

Abstract: A shelf label system and a method thereof are provided. The shelf label system includes base stations and at least one server. The at least one server may be configured to: obtain a target network topological structure according to a master base station having a shallowest topological depth and a ranging result between a base station and a superior base station of the base station, where each base station has a single superior base station; generate a transceiving time slot periodic table by allocating a transceiving time slot to each base station according to the target network topological structure; and obtain a synchronous network of the shelf label system by instructing the base stations to transmit and receive synchronous signals according to the transceiving time slot periodic table. The shelf label system further includes electronic shelf labels that receive the synchronous signals from the base stations.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: The embodiments of the present disclosure disclose a method and an apparatus for crystal growth. The method for crystal growth may include: placing a seed crystal and a target source material in a growth chamber of an apparatus for crystal growth; executing a growth of a crystal based on the seed crystal and the target source material according to physical vapor transport; determining whether a preset condition is satisfied during the crystal growth process; and in response to determining that the preset condition is satisfied, replacing a sublimated target source material with a candidate source material. In the present disclosure, by replacing the sublimated target source material with the candidate source material, a crystal with large-size and high-quality can be grown.

Abstract: A dynamic frequency allocation method for base stations, a shelf label system and a computer device are provided. The method includes: obtaining a current connectivity structure of base stations; obtaining a current weight degree of each base station based on a frequency interval weight between base stations in the current connectivity structure; performing priority classification on all current base stations to obtain a current priority type of each base station; and obtaining a current allocated frequency of each base station based on the current priority type of the base station, the current weight degree of the base station, the frequency interval weight and a current available frequency set.

Abstract: An electronic component includes a board, an electronic device, and a stiffening structure is provided. The electronic device is disposed on the board. The stiffening structure is disposed on the board. The stiffening structure includes a ring portion corresponding the edge of the board. The stiffening structure includes a core base and a cladding layer. The cladding layer covers the core base.

Abstract: A cam-driven wire mesh-type electrospinning apparatus and a use method therefor are provided. The cam-driven wire mesh-type electrospinning apparatus includes the following components: a high-voltage (HV) power supply unit, a wire mesh-type spinneret, a fiber receiving device, a cam unit, and a solution supply unit. The positions and connection relationships of all the components are as follows: any end of the wire mesh-type spinneret is connected to the HV power supply unit, and the other end of the wire mesh-type spinneret is connected to the cam unit; the wire mesh-type spinneret is installed on the solution supply unit; and the fiber receiving device is positioned right above the wire mesh-type spinneret. The cam-driven wire mesh-type electrospinning apparatus may induce a solution to be uniformly distributed on a wire mesh plane, and adjust the density of jet flow and the distribution position of the jet flow.

Abstract: According to the present disclosure, a measuring method of liquid mixture purity includes steps as follows. A storage tank is provided, wherein the storage tank is configured for storing a liquid mixture including formic acid and water. A calculating unit is provided, wherein a plurality of formic acid purity values are saved in the calculating unit. A pressure-decreasing and heating step is performed by reducing a pressure of the storage tank and heating the storage tank. A measuring step is performed by measuring in the inner space of the storage tank to obtain a pressure value, and measuring the liquid mixture simultaneously to obtain a temperature value. A calculating step is performed by inputting the pressure value and the temperature value into the calculating unit, wherein the calculating unit outputs one of the formic acid purity values corresponding thereto.

Abstract: Provided are a response receiving and sending method, a retransmission method, a communication device, and a storage medium. The method includes: sending a transport block to a first communication device through a pre-configured period resource, and receiving a correct response corresponding to the transport block on a pre-configured correct response resource.

Abstract: A semiconductor structure includes a composite redistribution structure, a first interconnect device and an integrated circuit (IC) package component. The composite redistribution structure includes a first redistribution structure, a second redistribution structure and a third redistribution structure. The second redistribution structure is located between the first redistribution structure and the third redistribution structure. The first interconnect device is embedded in the second redistribution structure. The first interconnect device includes a plurality of metal connectors leveled with a surface of the second redistribution structure and electrically connected to the third redistribution structure. The IC package component is disposed over the third redistribution structure and electrically connected to the first interconnect device via the third redistribution structure.

Abstract: Provided are an information transmission method and apparatus, a storage medium and an electronic apparatus. The method includes the following step: a PDSCH traffic with a length of a second TTI is received after an error of receiving a PDSCH traffic with a length of a first TTI is made; where a first transmission unit is supported in the first TTI, a second transmission unit and a third transmission unit are supported in the second TTI, and a transmission unit of the second TTI corresponds to a transmission unit of the first TTI.

Abstract: Methods, systems and computer devices are provided for adjusting a frame-listening cycle. The method includes: configuring, by a server, a fixed frame-listening cycle of an electronic shelf label according to a time period; and sending, by the server, a second frame-listening cycle modification command through a base station when the server is to issue the fast response service during the low power consumption time period, so that the electronic shelf label modifies the current frame-listening cycle to a fast frame-listening cycle according to the second frame-listening cycle modification command. According to the present disclosure, the electronic shelf label can not only respond to the fast response service in real time, but also keep the low power consumption of a long frame-listening cycle, thereby simultaneously satisfying the requirements of high real-time performance and low power consumption of the electronic shelf label.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, a conductive pillar and a solder material is provided. The redistribution circuit structure has a first surface and a second surface opposite to the first surface and includes a first insulating layer and a first redistribution pattern in the insulating layer. The first redistribution pattern comprises a first contact pad disposed at the first surface. The wiring substrate is disposed opposite the first surface of the redistribution circuit structure and includes a second insulating layer and a second redistribution pattern in the second insulating layer. The second redistribution pattern comprises a second contact pad. The conductive pillar is disposed between the first contact pad and the second contact pad. The solder material disposed between the conductive pillar and the second contact pad.

Abstract: A method of manufacturing a semiconductor structure includes the following operations. A substrate is provided. A first conductive pillar, a second conductive pillar arid a third conductive pillar are disposed over the substrate. The first conductive pillar comprises a first height, the second conductive pillar comprises a second height, and the third conductive pillar comprises a third height. A first die is disposed over the first conductive pillar. A second die is disposed over the second conductive pillar. A first surface of the first die and a second surface of the second die are at substantially same level.

Abstract: Disclosed are a control method for electronic price tags, an electronic price tag and an electronic price tag system. The control method comprises: receiving at least one first service instruction by a wireless communication module, and receiving at least one second service instruction by a short-distance communication module; and performing, by a fusion processing module, fusion processing on the at least one first service instruction and the at least one second service instruction, which are of a same service type and have an effective duration overlap therebetween, to enable a response module to respond synchronously according to control parameters obtained after fusion processing.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes an integrated substrate and a package component. The integrated substrate includes a substrate component laterally covered by an insulating encapsulation, a redistribution structure disposed over the substrate component and the insulating encapsulation, first conductive joints coupling the redistribution structure to the substrate component, and a buffer layer disposed on a lowermost dielectric layer of the redistribution structure and extending downwardly to cover an upper portion of each of the first conductive joints. A lower portion of each of the first conductive joints connected to the upper portion is covered by the insulating encapsulation. The package component disposed over and electrically coupled to the redistribution structure includes a semiconductor die laterally covered by an encapsulant.

Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.

Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.

Abstract: Semiconductor device packages and methods of forming the same are discussed. In an embodiment, a device includes: a redistribution structure comprising an upper dielectric layer and an under-bump metallization; a buffer feature on the under-bump metallization and the upper dielectric layer, the buffer feature covering an edge of the under-bump metallization, the buffer feature bonded to the upper dielectric layer; a reflowable connector extending through the buffer feature, the reflowable connector coupled to the under-bump metallization; an interposer coupled to the reflowable connector; and an encapsulant around the interposer and the reflowable connector, the encapsulant different from the buffer feature.