Patents by Inventor Mizuki Ono
Mizuki Ono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20010042873Abstract: A semiconductor device comprises: a p-type semiconductor substrate (1); an insulating film (3); a gate electrode (2) formed on the substrate via the insulating film; and an n-type source/drain region (5) formed on both sides of a channel forming region (4) located under the gate electrode (2) formed on the substrate (1). In particular, the thickness (Tox) of the insulating film (3) is determined to be less than 2.5 nm at conversion rate of silicon oxide film (silicon oxide equivalent thickness); a gate length (Lg) of the gate electrode (2) is determined to be equal to or less than 0.3 &mgr;m; and further a voltage applied to the gate electrode (2) and the drain region (6) is determined to be 1.5 V or less. Therefore, in the MOSFET having the tunneling gate oxide film (3), the reliability of the transistor under the hot carrier stress can be improved, and the gate leakage current can be reduced markedly, so that the transistor characteristics can be improved markedly.Type: ApplicationFiled: April 9, 2001Publication date: November 22, 2001Inventors: Hisayo Momose, Hiroshi Iwai, Masanobu Saito, Tatsuya Ohguro, Mizuki Ono, Takashi Yoshitomi, Shinichi Nakamura
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Publication number: 20010030350Abstract: In a MIS transistor, the top surfaces of source/drain regions (S/D diffusion layers) formed on a semiconductor substrate 1 are arranged nearer to a gate electrode than a channel plane on the semiconductor substrate, and the top surfaces of the source/drain regions are arranged nearer than the channel plane than the interface between a gate insulator film provided on the upper side of the channel plane and the gate electrode. In this transistor, a groove is selectively formed in the surface of the semiconductor substrate, and a polycrystalline silicon deposited in the groove may be used as a mask to form impurity diffusion layers serving as source/drain regions to laminate and form a gate insulator film of a high dielectric film and a gate electrode. Alternatively, the polycrystalline silicon may be selectively formed to be used as a mask to elevate and form the impurity diffusion layer to laminate and form the gate insulator film and the gate electrode.Type: ApplicationFiled: June 13, 2001Publication date: October 18, 2001Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Yukihito Oowaki, Mizuki Ono, Mitsuhiro Noguchi, Daisaburo Takashima, Akira Nishiyama
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Patent number: 6278165Abstract: In a MIS transistor, the top surfaces of source/drain regions (S/D diffusion layers) formed on a semiconductor substrate 1 are arranged nearer to a gate electrode than a channel plane on the semiconductor substrate, and the top surfaces of the source/drain regions are arranged nearer than the channel plane than the interface between a gate insulator film provided on the upper side of the channel plane and the gate electrode. In this transistor, a groove is selectively formed in the surface of the semiconductor substrate, and a polycrystalline silicon deposited in the groove may be used as a mask to form impurity diffusion layers serving as source/drain regions to laminate and form a gate insulator film of a high dielectric film and a gate electrode. Alternatively, the polycrystalline silicon may be selectively formed to be used as a mask to elevate and form the impurity diffusion layer to laminate and form the gate insulator film and the gate electrode.Type: GrantFiled: June 28, 1999Date of Patent: August 21, 2001Assignee: Kabushiki Kaisha ToshibaInventors: Yukihito Oowaki, Mizuki Ono, Mitsuhiro Noguchi, Daisaburo Takashima, Akira Nishiyama
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Patent number: 6229164Abstract: A semiconductor device comprises: a p-type semiconductor substrate (1); an insulating film (3); a gate electrode (2) formed on the substrate via the insulating film; and an n-type source/drain region (5) formed on both sides of a channel forming region (4) located under the gate electrode (2) formed on the substrate (1). In particular, the thickness (TOX) of the insulating film (3) is determined to be less than 2.5 nm at conversion rate of silicon oxide film (silicon oxide equivalent thickness); a gate length (Lg) of the electrode (2) is determined to be equal to or less than 0.3 &mgr;m; and further a voltage applied to the gate electrode (2) and the drain region (6) is determined to be 1.5 V or less. Therefore, in the MOSFET having the tunneling gate oxide film (3), the reliability of the transistor under the hot carrier stress can be improved, and the gate leakage current can be reduced markedly, so that the transistor characteristics can be improved markedly.Type: GrantFiled: November 16, 1999Date of Patent: May 8, 2001Assignee: Kabushiki Kaisha ToshibaInventors: Hisayo Momose, Hiroshi Iwai, Masanobu Saito, Tatsuya Ohguro, Mizuki Ono, Takashi Yoshitomi, Shinichi Nakamura
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Patent number: 5990516Abstract: A semiconductor device comprises: a p-type semiconductor substrate (1); an insulating film (3); a gate electrode (2) formed on the substrate via the insulating film; and an n-type source/drain region (5) formed on both sides of a channel forming region (4) located under the gate electrode (2) formed on the substrate (1). In particular, the thickness (T.sub.OX) of the insulating film (3) is determined to be less than 2.5 nm at conversion rate of silicon oxide film (silicon oxide equivalent thickness); a gate length (L.sub.g) of the gate electrode (2) is determined to be equal to or less than 0.3 .mu.m; and further a voltage applied to the gate electrode (2) and the drain region (6) is determined to be 1.5 V or less. Therefore, in the MOSFET having the tunneling gate oxide film (3), the reliability of the transistor under the hot carrier stress can be improved, and the gate leakage current can be reduced markedly, so that the transistor characteristics can be improved markedly.Type: GrantFiled: September 13, 1995Date of Patent: November 23, 1999Assignee: Kabushiki Kaisha ToshibaInventors: Hisayo Momose, Hiroshi Iwai, Masanobu Saito, Tatsuya Ohguro, Mizuki Ono, Takashi Yoshitomi, Shinichi Nakamura
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Patent number: 5965918Abstract: An insulating film having a low dielectric constant lower than that of silicon oxide is arranged between a silicon support layer and a silicon active layer. A channel region, source/drain regions, and a device isolation region are formed in the active layer. A gate electrode is arranged on the channel region through a gate insulating film. The active layer is covered with a TEOS film in which contact holes are formed. The contact holes are filled with wiring layers connected to the source/drain regions and the gate electrode.Type: GrantFiled: March 18, 1999Date of Patent: October 12, 1999Assignee: Kabushiki Kaisha ToshibaInventor: Mizuki Ono
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Patent number: 5955761Abstract: A semiconductor device capable of restraining a short channel effect and obtaining a current drivability that is as high as possible includes a semiconductor substrate, a gate insulating film formed on the surface of this substrate, a gate electrode formed on this gate insulating film and side wall insulating films formed on this gate electrode and along side walls of the gate insulating film. The semiconductor device further includes side wall conductor films formed adjacent to the side wall insulating films and a source/drain region formed in a surface region of the substrate under the side wall conductivity film and in a surface region, adjacent to the side wall conductivity film, of the semiconductor substrate. An impurity concentration in a depthwise direction of the substrate with the surface of the side wall conductor film serving as a starting point exhibits one maximum value in a predetermined depth but decreases in a portion deeper than the predetermined depth.Type: GrantFiled: April 30, 1998Date of Patent: September 21, 1999Assignee: Kabushiki Kaisha ToshibaInventors: Takashi Yoshitomi, Hiroshi Iwai, Masanobu Saito, Hisayo Momose, Tatsuya Ohguro, Mizuki Ono
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Patent number: 5933719Abstract: The proposed semiconductor device can provide a capacitor having an excellent capacitance controllability thereof and a high reliability thereof. A method of manufacturing a semiconductor device comprises the steps of: forming a first insulating film on a semiconductor substrate on which a lower capacitor electrode has been formed; removing the first insulating film at a capacitor forming region on the lower capacitor electrode; forming a second insulating film on the semiconductor substrate; forming a conductive film on the formed second insulating film; patterning the conductive film and the second insulating film, to leave both the films at least at the capacitor forming region; patterning the first insulating film, to form a contact hole with the lower capacitor electrode at a region other than the capacitor forming region; and dry etching the lower capacitor electrode, to remove a natural oxide film formed at a bottom of the contact hole.Type: GrantFiled: March 11, 1997Date of Patent: August 3, 1999Assignee: Kabushiki Kaisha ToshibaInventors: Hideaki Nii, Mizuki Ono
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Patent number: 5903027Abstract: A MOS type semiconductor device has a gate whose length is 170 nm (0.17 .mu.m) or less, a junction depth of source and drain diffusion layers in the vicinity of a channel is 22 nm or less, and a concentration of impurities at the surface in the source and drain diffusion layers is made to 10.sup.20 cm.sup.-3 or more. Such structure is obtained using solid phase diffusion using heat range from 950.degree. C. to 1050.degree. C. and/or narrowing gate width by ashing or etching. The other MOS type semiconductor device is characterized in that the relationship between the junction depth x.sub.j ?nm! in the source and drain diffusion layer regions and the effective channel length L.sub.eff ?nm! is determined by L.sub.eff >0.69 x.sub.j -6.17.Type: GrantFiled: August 13, 1997Date of Patent: May 11, 1999Assignee: Kabushiki Kaisha ToshibaInventors: Takashi Yoshitomi, Masanobu Saito, Hisayo Momose, Hiroshi Iwai, Yukihiro Ushiku, Mizuki Ono, Yasushi Akasaka, Hideaki Nii, Satoshi Matsuda, Yasuhiro Katsumata, Tatsuya Ooguro, Claudio Fiegna
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Patent number: 5898203Abstract: A diffused server as a source and a drain. It is formed comprised of a deep first diffused layer and a shallow second diffused layer positioned between the first diffused layer and the channel region. In the second diffused region, a distribution in a depth direction of carriers has a profile in which the concentration is more than 5.times.10.sup.18 cm-.sup.-3 at the peak and is in correspondence with a carrier concentration of the semiconductor substrate at a depth less than 0.04 .mu.m. Since the second diffused layer has a high concentration, the short-channel effect can be suppressed. As the second diffused region, a solid phase diffusion source such as an impurity doped silicate glass is used.Type: GrantFiled: July 30, 1997Date of Patent: April 27, 1999Assignee: Kabushiki Kaisha ToshibaInventors: Takashi Yoshitomi, Masanobu Saito, Hisayo Momose, Hiroshi Iwai, Yukihiro Ushiku, Mizuki Ono, Yasushi Akasaka, Hideaki Nii, Satoshi Matsuda, Yasuhiro Katsumata
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Patent number: 5780901Abstract: A semiconductor device capable of restraining a short channel effect and obtaining a current drivability that is as high as possible includes a semiconductor substrate, a gate insulating film formed on the surface of this substrate, a gate electrode formed on this gate insulating film and side wall insulating films formed on this gate electrode and along side walls of the gate insulating film. The semiconductor device further includes side wall conductor films formed adjacent to the side wall insulating films and a source/drain region formed in a surface region of the substrate under the side wall conductivity film and in a surface region, adjacent to the side wall conductivity film, of the semiconductor substrate. An impurity concentration in a depthwise direction of the substrate with the surface of the side wall conductor film serving as a starting point exhibits one maximum value in a predetermined depth but decreases in a portion deeper than the predetermined depth.Type: GrantFiled: June 30, 1995Date of Patent: July 14, 1998Assignee: Kabushiki Kaisha ToshibaInventors: Takashi Yoshitomi, Hiroshi Iwai, Masanobu Saito, Hisayo Momose, Tatsuya Ohguro, Mizuki Ono
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Patent number: 5766965Abstract: A diffused layer serves as a source and a drain. It is formed comprised of a deep first diffused layer and a shallow second diffused layer positioned between the first diffused layer and the channel region. In the second diffused region, a distribution in a depth direction of carriers has a profile in which the concentration is more than 5.times.10.sup.18 cm.sup.-3 at the peak and is in correspondence with a carrier concentration of the semiconductor substrate at a depth less than 0.04 .mu.m. Since the second diffused layer has a high concentration, the short-channel effect can be suppressed. As the second diffused region, a solid phase diffusion source such as an impurity doped silicate glass is used.Type: GrantFiled: December 5, 1994Date of Patent: June 16, 1998Inventors: Takashi Yoshitomi, Masanobu Saito, Hisayo Momose, Hiroshi Iwai, Yukihiro Ushiku, Mizuki Ono, Yasushi Akasaka, Hideaki Nii, Satoshi Matsuda, Yasuhiro Katsumata
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Patent number: 5698881Abstract: A MOS type semiconductor device has a gate whose length is 170 nm (0.17 .mu.m) or less, a junction depth of source and drain diffusion layers in the vicinity of a channel is 22 nm or less, and a concentration of impurities at the surface in the source and drain diffusion layers is made to 10.sup.20 cm.sup.-3 or more. Such structure is obtained using solid phase diffusion using heat range from 950.degree. C. to 1050.degree. C. and/or narrowing gate width by ashing or etching. The other MOS type semiconductor device is characterized in that the relationship between the junction depth x.sub.j ?nm! in the source and drain diffusion layer regions and the effective channel length L.sub.eff ?nm! is determined by L.sub.eff >0.69 x.sub.j -6.17.Type: GrantFiled: December 2, 1994Date of Patent: December 16, 1997Assignee: Kabushiki Kaisha ToshibaInventors: Takashi Yoshitomi, Masanobu Saito, Hisayo Momose, Hiroshi Iwai, Yukihiro Ushiku, Mizuki Ono, Yasushi Akasaka, Hideaki Nii, Satoshi Matsuda, Yasuhiro Katsumata, Tatsuya Ooguro, Claudio Fiegna
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Patent number: 5434440Abstract: A diffused layer serves as a source and a drain. It is formed comprised of a deep first diffused layer and a shallow second diffused layer positioned between the first diffused layer and the channel region. In the second diffused region, a distribution in a depth direction of carriers has a profile in which the concentration is more than 5.times.10.sup.18 cm.sup.-3 at the peak and is in correspondence with a carrier concentration of the semiconductor substrate at a depth less than 0.04 .mu.m. Since the second diffused layer has a high concentration, the short-channel effect can be suppressed. As the second diffused region, a solid phase diffusion source such as an impurity doped silicate glass is used.Type: GrantFiled: May 28, 1993Date of Patent: July 18, 1995Assignee: Kabushiki Kaisha ToshibaInventors: Takashi Yoshitomi, Masanobu Saito, Hisayo Momose, Hiroshi Iwai, Yukihiro Ushiku, Mizuki Ono, Yasushi Akasaka, Hideaki Nii, Satoshi Matsuda, Yasuhiro Katsumata