Abstract: An IHS includes an IHS chassis. A processor is located in the IHS chassis. At least one fan is located in the IHS chassis and in fluid communication with the processor. A temperature sensor is located in the IHS chassis. A fan controller is coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature. The fan controller is operable to receive a first ambient temperature from the temperature sensor, determine a first processor target temperature that is associated with the first ambient temperature, receive a temperature of the processor, and operate the at least one fan in order to reduce the temperature of the processor to the first processor target temperature.

Abstract: A cooling system includes a chassis. A thermal sensor is located in the chassis. A plurality of fan zones are located in the chassis. Each of the plurality of fan zones includes at least one fan. A first mapping is provided between the thermal sensor and a first fan zone of the plurality of fans zone, and a second mapping is provided between the first fan zone and a second fan zone in the plurality of fan zones. A controller is coupled to the thermal sensor and the at least one fan in each of the plurality of fan zones. In response to receiving a signal from the thermal sensor, the controller is operable to activate the at least one fan in the first fan zone according to the first mapping and activate the at least one fan in the second fan zone according to the second mapping.

Abstract: A method includes detecting that a rate of temperature change in a server is above a threshold rate, changing the server to a lowest system performance state when the rate of the temperature change in the server is above the threshold rate, and reducing a fan speed to a minimum fan speed level when the rate of temperature change is above the threshold rate.

Abstract: A method includes detecting that a rate of temperature change in a server is above a threshold rate, changing the server to a lowest system performance state when the rate of the temperature change in the server is above the threshold rate, and reducing a fan speed to a minimum fan speed level when the rate of temperature change is above the threshold rate.

Abstract: A device comprising a temperature measurement module, a performance state module, and a fan speed module. The temperature measurement module is configured to determine a temperature in a server, and to output a first control signal when temperature in the server is above a threshold. The performance state module is configured to change a performance state of the device to a lowest system performance state in response to the first control signal, and further configured to reduce a processor power consumption and a subsystem power consumption to a minimum power level in response to reducing the performance state to the lowest system performance state. The fan speed module is configured to reduce a fan speed to a minimum fan speed level based on the first control signal.

Abstract: A synthetic air jet cooling system includes a first component. A fan is in fluid communication with the first component. A synthetic air jet is located adjacent the first component. A thermal management engine is coupled to the first component, the fan, and the synthetic air jet. The thermal management engine is operable to receive a first component operating condition, compare the first component operating condition to a target operating condition, and increase a fan fluid flow rate from the fan and a synthetic air jet fluid flow rate from the synthetic air jet in order to reduce the difference between the first component operating condition the target operating condition. The thermal management engine increases the synthetic air jet fluid flow rate from the synthetic air jet to a predetermined synthetic air jet fluid flow rate prior to increasing the fan fluid flow rate from the fan in order to provide improvements in power consumption, airflow, and acoustics.

Abstract: A device comprising a temperature measurement module, a performance state module, and a fan speed module. The temperature measurement module is configured to determine a temperature in a server, and to output a first control signal when temperature in the server is above a threshold. The performance state module is configured to change a performance state of the device to a lowest system performance state in response to the first control signal, and further configured to reduce a processor power consumption and a subsystem power consumption to a minimum power level in response to reducing the performance state to the lowest system performance state. The fan speed module is configured to reduce a fan speed to a minimum fan speed level based on the first control signal.

Abstract: In one embodiment a method includes operating a component coupled to the system at a first steady state average power consumption, measuring the temperature of the component to produce a first temperature measurement, operating the component at a second, higher power consumption for a first time period, and measuring the temperature of the component at the end of the first time period to produce a second temperature measurement. A transient thermal metric is calculated based at least in part on the first and second temperature measurements, and the transient thermal metric is used to infer the thermal coupling status of a heat dissipation appliance that is nominally thermally coupled to the component.

Abstract: A device comprising a fan controller, an encoder, a driver, a resistor/capacitor filter, and a baseboard management controller. The fan controller is configured to output a cooling fan status signal, and to output a cooling fan information data signal. The encoder is configured to encode the cooling fan status signal and the cooling fan information data signal together into a combined signal. The driver is configured to invert the combined signal and to output an inverted signal. The resistor/capacitor filter is configured to filter out the cooling fan information data signal from the inverted signal, and to output a filtered signal. The baseboard management controller is configured to determine a status of a cooling fan in response to the filtered signal, and to output a control signal to the fan controller module for the cooling fan based on the cooling fan information data signal within the inverted signal.

Abstract: A device comprising a temperature measurement module, a performance state module, a memory bandwidth module, and a fan speed module. The temperature measurement module is configured to determine a rate of temperature change in a server and to output a control signal when the rate of temperature change is above a threshold rate. The performance state module is configured to reduce a performance state of the device to a lowest system level in response to the control signal, and to reduce a processor power consumption and a subsystem power consumption to a minimum power level in response to reducing the performance state to the lowest system level. The memory bandwidth module is configured to reduce a memory bandwidth to a minimum bandwidth level based on the control signal. The fan speed module is configured to reduce a fan speed to a minimum level based on the control signal.

Abstract: A cooling system for an information handling system is provided in which a cold plate is coupled to the motherboard of the computer system. The cold plate includes a number of cold pads that are located on the pan to correspond to the location of heat-emitting components on the motherboard. Chilled water is circulated through the cold pads to remove heat from the vicinity of the heat-emitting components. A heat exchanger may be coupled to the cold plate.

Abstract: A synthetic air jet cooling system includes a first component. A fan is in fluid communication with the first component. A synthetic air jet is located adjacent the first component. A thermal management engine is coupled to the first component, the fan, and the synthetic air jet. The thermal management engine is operable to receive a first component operating condition, compare the first component operating condition to a target operating condition, and increase a fan fluid flow rate from the fan and a synthetic air jet fluid flow rate from the synthetic air jet in order to reduce the difference between the first component operating condition the target operating condition. The thermal management engine increases the synthetic air jet fluid flow rate from the synthetic air jet to a predetermined synthetic air jet fluid flow rate prior to increasing the fan fluid flow rate from the fan in order to provide improvements in power consumption, airflow, and acoustics.

Abstract: A memory heat sink system includes a base comprising a first side and a second side, wherein the first side is oriented substantially perpendicularly to the second side. A plurality of convective heat transfer members extend from the first side. At least one conductive liquid cooling coupling surface located on the second side.

Abstract: A chassis having a bypass channel for air flow is disclosed. The chassis include a bypass channel that is proximate one side of the chassis. The bypass channel may be formed by the side of the chassis and a module of the computing system, such as the processor module of the computing system. A second module exists in the rear of the chassis. A physical barrier may be used to direct air from the bypass channel to the second module, which may be an I/O module. A plenum is placed on the opposite side of I/O module from the air flow. The presence of the plenum creates a negative pressure on the opposite side of the second module, causing air to cross the second module into the plenum. A fan in the rear of the chassis causes air to leave the plenum and exit the chassis.

Abstract: A device comprising a temperature measurement module, a performance state module, a memory bandwidth module, and a fan speed module. The temperature measurement module is configured to determine a rate of temperature change in a server and to output a control signal when the rate of temperature change is above a threshold rate. The performance state module is configured to reduce a performance state of the device to a lowest system level in response to the control signal, and to reduce a processor power consumption and a subsystem power consumption to a minimum power level in response to reducing the performance state to the lowest system level. The memory bandwidth module is configured to reduce a memory bandwidth to a minimum bandwidth level based on the control signal. The fan speed module is configured to reduce a fan speed to a minimum level based on the control signal.

Abstract: A device comprising a fan controller, an encoder, a driver, a resistor/capacitor filter, and a baseboard management controller. The fan controller is configured to output a cooling fan status signal, and to output a cooling fan information data signal. The encoder is configured to encode the cooling fan status signal and the cooling fan information data signal together into a combined signal. The driver is configured to invert the combined signal and to output an inverted signal. The resistor/capacitor filter is configured to filter out the cooling fan information data signal from the inverted signal, and to output a filtered signal. The baseboard management controller is configured to determine a status of a cooling fan in response to the filtered signal, and to output a control signal to the fan controller module for the cooling fan based on the cooling fan information data signal within the inverted signal.

Abstract: AA cooling system for an information handling system is provided in which a cold plate is coupled to the motherboard of the computer system. The cold plate includes a number of cold pads that are located on the pan to correspond to the location of heat-emitting components on the motherboard. Chilled water is circulated through the cold pads to remove heat from the vicinity of the heat-emitting components. A heat exchanger may be coupled to the cold plate.

Abstract: An escape sequence coded in power commands from a system controller, such as a BMC, to a cooling fan controller directs the cooling fan to send identification information coded in tachometer readings to the system controller for use by an information handling system. Electronic confirmation of the cooling fan identification ensures compatibility of the information handling system and cooling fan at initial manufacture or subsequent repair. Communication of information over existing power and tachometer wires supports the electronic confirmation without adding additional communication lines. Further, once a communication link is established between an information handling system controller and a cooling fan, other functions are enabled, such as a reflash of the cooling fan controller firmware.

Abstract: A cooling apparatus includes a chassis, a plurality of heat producing component slots defined by the chassis, and a plurality of valve systems mounted in the chassis, whereby a valve system is positioned adjacent each heat producing component slot. A fan may be coupled to the apparatus and a plurality of heat producing components such as, for example, a plurality of information handling systems, may be positioned in the heat producing components slots and selectively cooled using the plurality of valve systems, depending on the cooling requirements of each individual heat producing component.

Abstract: A thermal dissipation apparatus includes a thermal transfer device including a heat pipe member. A temperature sensitive material is coupled to the heat pipe member and is operable to provide a visual indication of the heat transfer in the heat pipe member. The thermal dissipation apparatus may be coupled to a heat producing component in order to dissipate heat from the component, and the temperature sensitive material will allow the function of the heat pipe member to be visually determined.