Abstract: A chassis having a bypass channel for air flow is disclosed. The chassis include a bypass channel that is proximate one side of the chassis. The bypass channel may be formed by the side of the chassis and a module of the computing system, such as the processor module of the computing system. A second module exists in the rear of the chassis. A physical barrier may be used to direct air from the bypass channel to the second module, which may be an I/O module. A plenum is placed on the opposite side of I/O module from the air flow. The presence of the plenum creates a negative pressure on the opposite side of the second module, causing air to cross the second module into the plenum. A fan in the rear of the chassis causes air to leave the plenum and exit the chassis.

Abstract: A system and method of reporting and managing real-time air flow within an information handling system is disclosed. In one form, a method of managing airflow can include obtaining airflow data using a range of fan speeds of a first cooling fan within a first information handling system. The method can also include storing the airflow data within a memory accessible to a management controller. The method can further include accessing the airflow data to identify a first airflow output level, and altering an operating speed of the first cooling fan to output the first airflow output level.

Abstract: When a power supply of a redundant power supply array fails or is removed from the computer system, the operating speed of the processor is modulated or throttled, thereby reducing the rate of power consumption by the processor. Each power supply in the array is rated to a power delivery capacity that is less than the maximum power draw of the computer system.

Abstract: A system and method for system and method for dynamic generation of environmental operational models is disclosed. In one form, an information handling system can include a planning tool operable to enable selection of a system for use at a site. The information handling system can also include a thermal management processor operably coupled to the planning tool. The thermal management processor can include an input operable receive an attribute of a component of the system, and an output operable to output information that can be used to determine a CFD analysis. The thermal management processor can further include a CFD analysis input source operable to receive a CFD analysis to be presented in connection with the planning tool.

Abstract: A heat dissipation apparatus includes a first commponent connector defining a first component slot immediately adjacent the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member is thermally coupled to a heat producing component such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.

Abstract: A system for adjusting the operation of a cooling device includes a cooling device, an input sensory device, a control algorithm, and a controller that adjusts operation of the cooling device based on the control algorithm. An embodiment of the control algorithm approximates a plurality of substantially linear cooling curves to relate to portions of a non-linear cooling curve for the cooling device, the algorithm selects a selected cooling curve from the plurality of substantially linear cooling curves based on an input from the sensory device. The system and an associated method may be implemented to cool an information handling system.

Abstract: An information handling system can include a fan control module operable to be control a fan to cool components within a housing. The fan control module can include a communication module operable to receive configuration information associated with components disposed within a housing of an information handling system. The fan control module can also include a processor operable to determine a fan control signal using the configuration information. In particular embodiments, the fan control module can determine an idling speed that reflects the actual configuration of the information handling system.

Abstract: A system and method is disclosed for dissipating heat within the interior of an information handling system. Heat from a heat source is directed to a heat sink and is also directed in parallel to a thermoelectric cooler. The thermoelectric cooler is oriented to direct heat in the direction of a second heat sink. A feedback communications link may be provided between the thermoelectric cooler and the heat source to regulate the operation of the thermoelectric cooler so that the temperature in the vicinity of the heat source is regulated within a temperature range.

Abstract: A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is operable to engage a second chip that is located on a memory device and that is operable to operate at a second temperature, wherein the second temperature is different from the first temperature. A retaining feature is operable to couple the first heat sink and the second heat sink to a memory device. The memory device cooling apparatus may be coupled to a memory device having at least two different chips that operate at different temperatures to efficiently dissipate heat from the chips in order to cool the memory device.

Abstract: A system and method for system and method for dynamic generation of environmental operational models is disclosed. In one form, an information handling system can include a planning tool operable to enable selection of a system for use at a site. The information handling system can also include a thermal management processor operably coupled to the planning tool. The thermal management processor can include an input operable receive an attribute of a component of the system, and an output operable to output information that can be used to determine a CFD analysis. The thermal management processor can further include a CFD analysis input source operable to receive a CFD analysis to be presented in connection with the planning tool.

Abstract: A thermal dissipation apparatus includes a primary heat sink. The primary heat sink includes a first base member having a component coupling surface and a secondary heat sink coupling surface, and a plurality of fins extending from the first base member. A secondary heat sink may be provided such that the primary heat sink is operable to provide thermal dissipation in a low profile form factor chassis while the secondary heat sink may be coupled with the primary heat sink to provide more optimal thermal dissipation in a high profile form factor chassis.

Abstract: A heat dissipation apparatus includes a first thermal conducting member including a first thermal transfer surface. A second thermal conducting member including a second thermal transfer surface that is located adjacent the first thermal transfer surface. A thermal interface material engages the first thermal transfer surface and the second thermal transfer surface. A channel is defined adjacent the first thermal transfer surface and the second thermal transfer surface, whereby an excess of the thermal interface material is located in the channel. The first thermal conducting member may be thermally coupled to an information handling system processor and the channel may prevent the thermal interface material from engaging sensitive surfaces adjacent the processor.

Abstract: A heat dissipation apparatus includes a heat transfer base that is operable to couple to a heat producing component that is operable to couple to a first component connector and be located in a first component slot defined by the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member extends from the heat transfer base such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.

Abstract: An information handling system and method of operating an information handling system are disclosed. In one embodiment the method comprises operating a component coupled to the system at a first steady state average power consumption, measuring the temperature of the component to produce a first temperature measurement, operating the component at a second, higher power consumption for a first time period, and measuring the temperature of the component at the end of the first time period to produce a second temperature measurement. A transient thermal metric is calculated based at least in part on the first and second temperature measurements, and the transient thermal metric is used to infer the thermal coupling status of a heat dissipation appliance that is nominally thermally coupled to the component.

Abstract: An information handling system including a system fan control for maintaining operating temperatures of electronics within the information handling system is disclosed. The information handling system can include a power trace provided in association with a power circuit that can power electronics within the information handling system. The power trace can include a reduced trace width region that may be operable to provide a temperature differential in response to a current change within the reduced trace width region. A thermistor may be provided in close proximity to the reduced trace width region and can be operable to detect the temperature differential provided in response to the current change. The thermistor may provide an input to a fan controller that may be operable to alter a fan speed to maintain an operating temperature of the electronics that may be coupled to the power trace.

Abstract: An information handling system including a system fan control for maintaining operating temperatures of electronics within the information handling system is disclosed. The information handling system can include a power trace provided in association with a power circuit that can power electronics within the information handling system. The power trace can include a reduced trace width region that may be operable to provide a temperature differential in response to a current change within the reduced trace width region. A thermistor may be provided in close proximity to the reduced trace width region and can be operable to detect the temperature differential provided in response to the current change. The thermistor may provide an input to a fan controller that may be operable to alter a fan speed to maintain an operating temperature of the electronics that may be coupled to the power trace.

Abstract: A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is operable to engage a second chip that is located on a memory device and that is operable to operate at a second temperature, wherein the second temperature is different from the first temperature. A retaining feature is operable to couple the first heat sink and the second heat sink to a memory device. The memory device cooling apparatus may be coupled to a memory device having at least two different chips that operate at different temperatures to efficiently dissipate heat from the chips in order to cool the memory device.

Abstract: An information handling system (“IHS”) including an enclosure is provided. A dust detection circuit, located inside the enclosure, is also provided. The dust detection circuit determines whether an amount of dust present inside the enclosure is greater than a predetermined amount.

Abstract: An active heat sink is disclosed that includes a fan elements between two sets of fins. When activated the fan forces air through the fins in a transverse direction across the length of the fins. Because the blades of the fan are bracketed on both sides by the fins of the heat sink, a fan guard is not necessary or installed over the blades of the fan.

Abstract: Information handling system component cooling is enhanced with an airflow shroud that directs a primary airflow by a primary fan across the component, the airflow shroud having an opening proximate the component so that a secondary airflow is directed at the component by a secondary fan mounted on the airflow shroud at the opening. The secondary fan removably mounts to the airflow shroud to support hot swapping of a replacement fan and the airflow shroud pivots about a hinge to expose processing components, such as a central processing unit and memory. A finger guard mounted to the airflow shroud across the opening prevents accidental contact with an installed fan.