Patents by Inventor Paul T. Artman

Paul T. Artman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Processor and power supply circuit
    Patent number: 6818835
    Abstract: A circuit comprising multiple circuit boards is disclosed herein. An embodiment of the circuit may comprise first and second printed circuit boards. The first printed circuit board may comprise first and second conductive planes. The first conductive plane has a first shape and the second conductive plane has a second shape, wherein the first shape is substantially similar to the second shape. The first conductive plane is located adjacent the second conductive plane, wherein the first conductive plane is parallel to and aligned with the second conductive plane. The second printed circuit board is connected to the first printed circuit board.
    Type: Grant
    Filed: April 22, 2003
    Date of Patent: November 16, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stuart C. Haden, Shaun L. Harris, Michael C. Day, Christian L Belady, Lisa Heid Pallotti, Paul T. Artman, Eric C. Peterson
  • Multiple heat pipe heat sink
    Patent number: 6785140
    Abstract: A chassis includes a heat generating component. A base is mounted on the heat generating component. A plurality of heat pipes each have a first portion mounted in the base and a second portion extending from the base. A plurality of fins are mounted on the second portion of the heat pipes. The heat pipes are L-shaped and the first portion of each heat pipe is seated in a respective groove provided in the base.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: August 31, 2004
    Assignee: Dell Products L.P.
    Inventors: Paul T. Artman, Eric Tunks
  • Multiple heat pipe heat sink
    Publication number: 20040042169
    Abstract: A chassis includes a heat generating component. A base is mounted on the heat generating component. A plurality of heat pipes each have a first portion mounted in the base and a second portion extending from the base. A plurality of fins are mounted on the second portion of the heat pipes. The heat pipes are L-shaped and the first portion of each heat pipe is seated in a respective groove provided in the base.
    Type: Application
    Filed: August 28, 2002
    Publication date: March 4, 2004
    Applicant: Dell Products L.P.
    Inventors: Paul T. Artman, Eric Tunks
  • Processor and power supply circuit
    Publication number: 20030156398
    Abstract: A circuit comprising is disclosed herein. An embodiment of the circuit may comprise first and second printed circuit boards. The first printed circuit board may comprise first and second conductive planes. The first conductive plane has a first shape and the second conductive plane has a second shape, wherein the first shape is substantially similar to the second shape. The first conductive plane is located adjacent the second conductive plane, wherein the first conductive plane is parallel to and aligned with the second conductive plane. The second printed circuit board is connected to the first printed circuit board.
    Type: Application
    Filed: April 22, 2003
    Publication date: August 21, 2003
    Inventors: Stuart C. Haden, Shaun L. Harris, Michael C. Day, Christian L. Belady, Lisa Heid Pallotti, Paul T. Artman, Eric C. Peterson
  • Heat sink having a captive handle
    Patent number: 6374906
    Abstract: A cooling device having a handle movably attached to a heat sink. The handle is attached to the heat sink by the use of captive fasteners. The captive fasteners serve the additional function of securing the cooling device to a heat-generating device. Springs are located between the handle and the heat sink and compress when the cooling device is attached to the heat-generating device. The springs cause a spring force to be applied between the cooling device and the heat-generating device which is maintained as the heat-generating device and the cooling device undergo thermal expansion and contraction.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: April 23, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Eric C. Peterson, William K. Coxe, Paul T. Artman