Abstract: A semiconductor device has a plurality of stacked semiconductor dice mounted on a substrate. Each die has similar dimensions. Each die has a first plurality of bonding pads arranged along a bonding edge of the die. A first group of the dice are mounted to the substrate with the bonding edge oriented in a first direction. A second group of the dice are mounted to the substrate with the bonding edge oriented in a second direction opposite the first direction. Each die is laterally offset in the second direction relative to the remaining dice by a respective lateral offset distance such that the bonding pads of each die are not disposed between the substrate and any portion of the remaining dice in a direction perpendicular to the substrate. A plurality of bonding wires connects the bonding pads to the substrate. A method of manufacturing a semiconductor device is also disclosed.

Abstract: A memory module that includes a buffer and a plurality of synchronous memory devices. The memory module also includes bidirectional bus lines, and each of the synchronous memory devices has bidirectional data terminals. The buffer is configured to regenerate signals received on the bus lines for receipt by the synchronous memory devices, and to regenerate signals received from any one of the synchronous memory devices for receipt by the bus lines. The memory module may further include command lines and a clock line for providing commands and a clock signal to the synchronous memory devices via a command buffer. The combined data bus width of the memory module may be greater than the data bus width of any single one of synchronous memory device, and the total address space provided by the memory module may be larger than the data space for any single synchronous memory device.

Abstract: A Phase-Change Memory (PCM) apparatus including a data field for storing a data bits representing a data value or an inversion of the data value and a polarity field for storing a plurality of polarity bits for indicating that the data bits stored in the data field represent the data value or the inversion of the data value. In one embodiment an odd number of set polarity bits indicates that the data bits represent the inversion of the data value and an even number of set polarity bits indicates that the data bits represent the data value. The PCM apparatus has enhanced endurance and improved error tolerance.

Abstract: A clock mode configuration circuit for a memory device is described. A memory system includes any number of memory devices serially connected to each other, where each memory device receives a clock signal. The clock signal can be provided either in parallel to all the memory devices or serially from memory device to memory device through a common clock input. The clock mode configuration circuit in each memory device is set to a parallel mode for receiving the parallel clock signal, and to a serial mode for receiving a source synchronous clock signal from a prior memory device. Depending on the set operating mode, the data input circuits will be configured for the corresponding data signal format, and the corresponding clock input circuits will be either enabled or disabled. The parallel mode and the serial mode is set by sensing a voltage level of a reference voltage provided to each memory device.

Abstract: In an integrated circuit (IC) adapted for use in a stack of interconnected ICs, interrupted through-silicon-vias (TSVs) are provided in addition to uninterrupted TSVs. The interrupted TSVs provide signal paths other than common parallel paths between the ICs of the stack. This permits IC identification schemes and other functionalities to be implemented using TSVs, without requiring angular rotation of alternate ICs of the stack.

Abstract: A clock applying circuit for a synchronous memory is comprised of a clock input for receiving a clock input signal, apparatus connected to the synchronous memory for receiving a driving clock signal, and a tapped delay line for receiving the clock input signal for delivering the clock driving signal to the synchronous memory in synchronism with but delayed from the clock input signal, the delay being a small fraction of the clock period of the clock input signal.

Abstract: A method, system and apparatus for sharing internal power supplies in integrated circuit devices is described. A multiple device integrated circuit 200 including multiple integrated circuits 202-205 each having internal power supplies is contained in an enclosure 201. Integrated circuits 202-205 are described showing how to make external connection to internal power supplies. Connections 208-212 are provided to the internal power supplies of each of devices 202-205. Another embodiment 500 of the system provides for disablement of regulators in multiple integrated circuits 502, 503, and 504 by another integrated circuit 501 for power consumption reduction. The method FIG. 6 includes providing devices and connecting the internal power supplies together. An integrated circuit 501 with a power supply 400 adapted to the system and method with additional circuitry 308, 404 and 402 for disabling a regulator 306 is described.

Abstract: A Phase-Change Memory (PCM) apparatus including a data field for storing a data bits representing a data value or an inversion of the data value and a polarity field for storing a plurality of polarity bits for indicating that the data bits stored in the data field represent the data value or the inversion of the data value. In one embodiment an odd number of set polarity bits indicates that the data bits represent the inversion of the data value and an even number of set polarity bits indicates that the data bits represent the data value. The PCM apparatus has enhanced endurance and improved error tolerance.

Abstract: A semiconductor device has a plurality of stacked semiconductor dice mounted on a substrate. Each die has similar dimensions. Each die has a first plurality of bonding pads arranged along a bonding edge of the die. A first group of the dice are mounted to the substrate with the bonding edge oriented in a first direction. A second group of the dice are mounted to the substrate with the bonding edge oriented in a second direction opposite the first direction. Each die is laterally offset in the second direction relative to the remaining dice by a respective lateral offset distance such that the bonding pads of each die are not disposed between the substrate and any portion of the remaining dice in a direction perpendicular to the substrate. A plurality of bonding wires connects the bonding pads to the substrate. A method of manufacturing a semiconductor device is also disclosed.

Abstract: A lookup table for searching for a longest prefix match for a key is disclosed. The lookup table provides a match for a key in a single search cycle. The number of matches stored in the lookup table is maximized by storing each match in only one location in the lookup table. The binary tree is divided into a plurality of levels and each level has a plurality of subtrees. A subtree descriptor stored for a subtree includes a field for each node in the subtree. The state of the field indicates whether an entry for the node is stored in the table. The bit vector allows indexing of the single match stored for the key.

Abstract: A lookup table for searching for a longest prefix match for a key is disclosed. The lookup table provides a match for a key in a single search cycle. The number of matches stored in the lookup table is maximized by storing each match in only one location in the lookup table. The binary tree is divided into a plurality of levels and each level has a plurality of subtrees. A subtree descriptor stored for a subtree includes a field for each node in the subtree. The state of the field indicates whether an entry for the node is stored in the table. The bit vector allows indexing of the single match stored for the key.

Abstract: A clock mode configuration circuit for a memory device is described. A memory system includes any number of memory devices serially connected to each other, where each memory device receives a clock signal. The clock signal can be provided either in parallel to all the memory devices or serially from memory device to memory device through a common clock input. The clock mode configuration circuit in each memory device is set to a parallel mode for receiving the parallel clock signal, and to a serial mode for receiving a source synchronous clock signal from a prior memory device. Depending on the set operating mode, the data input circuits will be configured for the corresponding data signal format, and the corresponding clock input circuits will be either enabled or disabled. The parallel mode and the serial mode is set by sensing a voltage level of a reference voltage provided to each memory device.

Abstract: In an integrated circuit (IC) adapted for use in a stack of interconnected ICs, interrupted through-silicon-vias (TSVs) are provided in addition to uninterrupted TSVs. The interrupted TSVs provide signal paths other than common parallel paths between the ICs of the stack. This permits IC identification schemes and other functionalities to be implemented using TSVs, without requiring angular rotation of alternate ICs of the stack.

Abstract: A clock mode configuration circuit for a memory device is described. A memory system includes any number of memory devices serially connected to each other, where each memory device receives a clock signal. The clock signal can be provided either in parallel to all the memory devices or serially from memory device to memory device through a common clock input. The clock mode configuration circuit in each memory device is set to a parallel mode for receiving the parallel clock signal, and to a serial mode for receiving a source synchronous clock signal from a prior memory device. Depending on the set operating mode, the data input circuits will be configured for the corresponding data signal format, and the corresponding clock input circuits will be either enabled or disabled. The parallel mode and the serial mode is set by sensing a voltage level of a reference voltage provided to each memory device.

Abstract: A controller for an arrangement of memory devices may issue a write command without waiting for the receipt of a previously issued read command. An addressed memory device may read data out onto the data bus according to a read command while, simultaneously, writing data according to a write command received subsequent to the read command.

Abstract: A composite memory device including discrete memory devices and a bridge device for controlling the discrete memory devices. A configurable clock controller receives a system clock and generates a memory clock having a frequency that is a predetermined ratio of the system clock. The system clock frequency is dynamically variable between a maximum and a minimum value, and the ratio of the memory clock frequency relative to the system clock frequency is set by loading a frequency register with a Frequency Divide Ratio (FDR) code any time during operation of the composite memory device. In response to the FDR code, the configurable clock controller changes the memory clock frequency.

Abstract: A composite memory device including discrete memory devices and a bridge device for controlling the discrete memory devices. The bridge device has a virtual page buffer corresponding to each discrete memory device for storing read data from the discrete memory device, or write data from an external device. The virtual page buffer is configurable to have a size up to the maximum physical size of the page buffer of a discrete memory device. The page buffer is then logically divided into page segments, where each page segment corresponds in size to the configured virtual page buffer size. By storing read or write data in the virtual page buffer, both the discrete memory device and the external device can operate to provide or receive data at different data rates to maximize the performance of both devices.

Abstract: A lookup table for searching for a longest prefix match for a key is disclosed. The lookup table provides a match for a key in a single search cycle. The number of matches stored in the lookup table is maximized by storing each match in only one location in the lookup table. The binary tree is divided into a plurality of levels and each level has a plurality of subtrees. A subtree descriptor stored for a subtree includes a field for each node in the subtree. The state of the field indicates whether an entry for the node is stored in the table. The bit vector allows indexing of the single match stored for the key.

Abstract: A clock applying circuit for a synchronous memory is comprised of a clock input for receiving a clock input signal, apparatus connected to the synchronous memory for receiving a driving clock signal, and a tapped delay line for receiving the clock input signal for delivering the clock driving signal to the synchronous memory in synchronism with but delayed from the clock input signal, the delay being a small fraction of the clock period of the clock input signal.

Abstract: A single chip display processor comprised of a dynamic random access memory (DRAM) for storing at least one of graphics and video pixel data, a pixel data unit (PDU) for processing the pixel data, integrated in the same integrated circuit (IC) chip as the DRAM, the IC chip further comprising a massively parallel bus for transferring blocks of pixel data at the same time from the DRAM to the PDU, whereby the PDU can process the blocks of pixel data for subsequent display of processed pixel data.