Abstract: A memory circuit including: memory cells, each including a storage cell transistor; a first tracking bit line; and a tracking circuit, electrically coupled between a first tracking word line and a reference voltage node, including a first set of first tracking cells, each first tracking cell including a first cell transistor having a same transistor configuration as each storage cell transistor; and wherein: a driving capacity of the storage cell transistors of the memory cells has a storage cell statistical distribution that exhibits a weak bit current value; a driving capacity of the first cell transistors of the first set of tracking cells has a first tracking cell statistical distribution that exhibits a first strong bit current value; and a first quantity of the first tracking cells is sufficient to cause the first strong bit current value to be equal to or less than the weak bit current value.

Abstract: A method of operating a tracking circuit of a memory device includes charging a node of the tracking circuit to a first predetermined voltage level, the first node being electrically coupled with a first load device. A first plurality of tracking cell transistors are activated to discharge the first node toward a second predetermined voltage level. A reset signal is generated based on a signal at the first node. The reset signal may correspond to a waiting period for reading a memory cell of the memory device.

Abstract: A method of operating a tracking circuit of a memory device includes charging a node of the tracking circuit to a first predetermined voltage level, the first node being electrically coupled with a first load device. A first plurality of tracking cell transistors are activated to discharge the first node toward a second predetermined voltage level. A reset signal is generated based on a signal at the first node. The reset signal may correspond to a waiting period for reading a memory cell of the memory device.

Abstract: A memory device includes: memory cells arranged in rows and columns; and regulated ground circuits corresponding to the columns. Each regulated ground circuit includes: a column ground node; at least three low-side voltage sources; at least three switches, each of the at least three switches being coupled between the column ground node and a corresponding one of the at least three voltage sources; and each of the at least three switches being controlled by a corresponding one of different control signals; Each memory cell includes: a high-side voltage source; an internal ground node coupled to the column ground node; and a cross latch having output and output_bar nodes. The cross latch is coupled between the high-side voltage source and the internal ground node, and is configured to selectively connect the output and output_bar nodes to corresponding bit and bit_bar lines.

Abstract: A memory circuit layout design includes first, second, third, and fourth memory cell regions abutting one another and corresponding to respective first, second, third, and fourth memory cells of the memory circuit. A first oxide diffusion (OD) layout pattern corresponds to a first active structure for forming the first and second memory cells, extends along a first direction, and has a shared source portion overlapping the first and second memory cell regions. A second OD layout pattern corresponds to a second active structure for forming the third and fourth memory cells, extends along the first direction, and has a shared source portion overlapping the third and fourth memory cell regions. A first conductive layout pattern corresponds to a first conductive structure under a lowest via plug layer of the memory circuit, extends along a second direction, and overlaps the shared source portions of the first and second OD layout patterns.

Abstract: A method for forming an integrated circuit includes forming a deep n-well (DNW) in a substrate, and forming a PMOS transistor in the DNW. The method also includes forming an NMOS transistor in the substrate and outside the DNW, and forming a reverse-biased diode. The method further includes forming an electrical path between a drain of the PMOS transistor and a gate structure of the NMOS transistor. The dissipation device is also connected to the electrical path.

Abstract: A memory circuit includes a plurality of memory cells and a tracking circuit. Each memory cell of the plurality of memory cells includes a cell transistor corresponding to a predetermined transistor configuration. The tracking circuit includes a first tracking bit line, a first tracking word line, a reference voltage node, and a first plurality of tracking cells. Each tracking cell of the first plurality of tracking cells includes a cell transistor corresponding to the predetermined transistor configuration. The cell transistors of the first plurality of tracking cells are electrically coupled in series between the first tracking bit line and the reference voltage node, and gate terminals of the cell transistors of the first plurality of tracking cells are electrically coupled with the first tracking word line.

Abstract: A method of fabricating a memory array includes designing first layout sections in a row direction, each first layout section including first and second control lines in a first metal layer, and an upper conductive line in a third metal layer. A lower conductive line in a second metal layer is coupled to the first control line and the first control line is isolated from the second control line. A second layout section is inserted at every N-th first layout section, N being a positive integer equal to or greater than 2. The second layout section includes the first control line, the second control line and a lower conductive line in the second metal layer coupled to the second control line and to an upper conductive line in the third metal layer. The lower conductive lines in the first and second layout sections are isolated from each other.

Abstract: A memory circuit includes a first active structure extending along a first direction, a second active structure extending along the first direction, a first conductive structure extending along a second direction, and a lowest via plug layer over the first conductive structure. The first active structure has a shared source portion corresponding to a source node of a first memory cell of the memory circuit and a source node of a second memory cell of the memory circuit. The second active structure has a shared source portion corresponding to a source node of a third memory cell of the memory circuit and a source node of a fourth memory cell of the memory circuit. The first conductive structure electrically connects the shared source portion of the first active structure with the shared source portion of the second active structure.

Abstract: A method of fabricating a memory includes forming a first portion of a first line in a first metal layer, forming a first portion of a second line in the first metal layer, forming a second portion of the first line in a second metal layer, and forming a second portion of the second line in a third metal layer. The first line is over a plurality of memory cells. The second line is over the plurality of memory cells, the first line is electrically isolated from the second line, and the first line and the second line extend in a same direction. The second metal layer is over the first metal layer. The third metal layer is over the second metal layer and the third metal layer is electrically isolated from the first line.

Abstract: A circuit includes a first latch for generating a first latched signal; and a first comparator for comparing the first latched signal and a write address, and generating a first comparator signal. The circuit includes a first logic circuit for receiving the first comparator signal and a fourth latched signal, and generating a first logic circuit output signal; and a second latch for receiving the first logic circuit output signal and generating a second latched signal. The circuit includes a third latch for generating a third latched signal; and a second comparator for comparing the third latched signal and a read address, and generating a second comparator signal. The circuit includes a second logic circuit for receiving the second comparator signal and the second latched signal, and generating a second logic circuit signal; and a fourth latch for receiving the second logic circuit signal and generating the fourth latched signal.

Abstract: A method includes using a first tracking circuit corresponding to a first set of access ports of a memory macro to cause a signal transition of a first tracking signal based on an edge of a clock signal. Using a second tracking circuit corresponding to a second set of access ports of the memory macro, a signal transition of a second tracking signal is caused based on the edge of the clock signal. A reset signal is generated based on the signal transition of the first tracking signal and the signal transition of the second tracking signal. A read operation or a write operation on the memory macro is performed based on the edge of the clock signal and the reset signal.

Abstract: A memory device includes: memory cells arranged in rows and columns; and regulated ground circuits corresponding to the columns. Each regulated ground circuit includes: a column ground node; at least three low-side voltage sources; at least three switches, each of the at least three switches being coupled between the column ground node and a corresponding one of the at least three voltage sources; and each of the at least three switches being controlled by a corresponding one of different control signals; Each memory cell includes: a high-side voltage source; an internal ground node coupled to the column ground node; and a cross latch having output and output_bar nodes. The cross latch is coupled between the high-side voltage source and the internal ground node, and is configured to selectively connect the output and output_bar nodes to corresponding bit and bit_bar lines.

Abstract: A method of forming an integrated circuit. The method includes forming at least one transistor and at least one electrical fuse over a substrate. Forming the at least one transistor includes forming a gate dielectric structure over a substrate and a work-function metallic layer over the gate dielectric structure. Forming the at least one transistor further includes forming a conductive layer over the work-function metallic layer and a source/drain (S/D) region being disposed adjacent to each sidewall of the gate dielectric structure. Forming the at least one transistor further includes forming a diffusion barrier layer between the gate dielectric structure and the work-function layer. Forming the at least one electrical fuse includes forming a first semiconductor layer over the substrate. Forming the at least one electrical fuse includes forming a first silicide layer on the first semiconductor layer, wherein the diffusion barrier layer is formed before the first silicide layer.

Abstract: In response to a write operation to a memory cell that causes a data line of the memory cell to have a first voltage direction, causing the data line to have a second voltage direction opposite the first voltage direction.

Abstract: A method for forming an integrated circuit includes forming a deep n-well (DNW) in a substrate, and forming a PMOS transistor in the DNW. The method also includes forming an NMOS transistor in the substrate and outside the DNW, and forming a reverse-biased diode. The method further includes forming an electrical path between a drain of the PMOS transistor and a gate structure of the NMOS transistor. The dissipation device is also connected to the electrical path.

Abstract: A method of writing data to an accessed memory cell of an accessed column of an accessed section of a memory array includes, electrically coupling a first voltage source of at least three voltage sources to a column internal ground node of the accessed column; and electrically coupling the first voltage source of the at least three voltage sources to a column internal ground node of an un-accessed column of an un-accessed segment. The memory array has at least one segment. Each memory cell has an internal ground node. The at least one segment has at least one section, and each section has at least one column and at least one row. Each column has at least three switches and a column internal ground node capable of being electrically coupled to at least three voltage sources through a corresponding one of the at least three switches.

Abstract: A method of forming an integrated circuit includes forming at least one transistor over a substrate. Forming the at least one transistor includes forming a gate dielectric structure over a substrate. A work-function metallic layer is formed over the gate dielectric structure. A conductive layer is formed over the work-function metallic layer. A source/drain (S/D) region is formed adjacent to each sidewall of the gate dielectric structure. At least one electrical fuse is formed over the substrate. Forming the at least one electrical fuse includes forming a first semiconductor layer over the substrate. A first silicide layer is formed on the first semiconductor layer.

Abstract: A circuit has an operational voltage supply node that carries an operational voltage having an operational voltage value, a reference voltage supply node that carries a reference voltage having a reference voltage value, and a sub-circuit and switching circuit between the operational voltage supply node and the reference voltage supply node. The switching circuit is in series with the sub-circuit and controls a current through the sub-circuit based on a difference between the operational voltage value and a nominal operational voltage value.

Abstract: A memory macro includes a plurality of segments corresponding to a plurality of tracking circuits. Each segment of the plurality of segments thereby corresponds to one tracking circuit of the plurality of tracking circuits. In response to a read operation of a memory cell of a segment, a tracking circuit corresponding to the segment is configured to generate an edge of a tracking signal based on which a first edge of a cell signal associated with the memory cell is generated.