Patents by Inventor Po-Jen Cheng

Po-Jen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132330
    Abstract: Motor control architecture including a travel, a hoist, and a controller is disclosed. The travel disposed on a main rail having an auxiliary-encoder includes a master-driver and a slave-driver for driving two motors. Each motor has a main-encoder. The hoist drives a rope and calculates a rope length continuously. The controller calculates an anti-sway position command based on the rope-length and a position command. The two drivers perform a full closed-loop computation based on a feedback of one main-encoder, a feedback of the auxiliary-encoder, and the anti-sway position command. Wherein, the master-driver controls one motor based on a speed command generated by the full closed-loop computation and the slave-driver follows the speed command and a torque command of the master-driver to drive another motor; or the two drivers compensate the torque command based on an error value between the feedback of one main-encoder and the feedback of the auxiliary-encoder.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 25, 2024
    Inventors: Huan-Chang CHEN, Po-Jen KO, Chun-Ju WU, Lon-Jay CHENG, Wan-Ping CHEN, Chih-Yuan CHANG
  • Patent number: 11961808
    Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: April 16, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei-Jen Wang, Po-Jen Cheng, Fu-Yuan Chen, Yi-Hsin Cheng
  • Patent number: 11923285
    Abstract: An electronic device package and a method for manufacturing the same are provided. The electronic device package includes a circuit layer and an electronic component. The circuit layer includes a dielectric layer having an opening, and an electrical contact. A width of an aperture of the opening increases from a first surface toward a second surface. The electrical contact is at least partially disposed in the opening and exposed through the opening. The electronic component is disposed on the second surface and electrically connected to the circuit layer.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: March 5, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Po-Jen Cheng, Chien-Fan Chen
  • Publication number: 20230260957
    Abstract: An electronic structure includes a packaging structure, a circuit pattern structure, an underfill and a protrusion structure. The circuit pattern structure is disposed over the packaging structure. A gap is between the circuit pattern structure and the packaging structure. The underfill is disposed in the gap. The protrusion structure is disposed in the gap, and is configured to facilitate the distributing of the underfill in the gap.
    Type: Application
    Filed: February 11, 2022
    Publication date: August 17, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-Jen CHENG, Wei-Jen WANG, Fu-Yuan CHEN
  • Publication number: 20230187367
    Abstract: An electronic package structure includes a lower circuit pattern structure, an upper circuit pattern structure, a reflowable material and at least one core element. The upper circuit pattern structure is disposed above the lower circuit pattern structure. The reflowable material is disposed between the upper circuit pattern structure and the lower circuit pattern structure. The core element attaches to the reflowable material and is configured to inhibit displacement of the at least one core element during a reflow process.
    Type: Application
    Filed: December 10, 2021
    Publication date: June 15, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Jen WANG, Po-Jen CHENG, Fu-Yuan CHEN, Kao Hsin CHEN
  • Patent number: 11648034
    Abstract: A device, an instrument and a belt for tying the cervix are provided. The device includes the belt and the instrument. The belt is used to tie the cervix. The instrument includes a first outer pipe, a second outer pipe and two fork structures. The first outer pipe and the second outer pipe are rotatable to each other. The two fork structures are connected individually to corresponding axial ends of the first outer pipe and the second outer pipe, respectively, and insert into the belt detachably.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: May 16, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Wen Yang, Po-Jen Cheng, Ting-Hsuan Chen, Tseng-Huang Liu
  • Publication number: 20230124000
    Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.
    Type: Application
    Filed: October 14, 2021
    Publication date: April 20, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Jen WANG, Po-Jen CHENG, Fu-Yuan CHEN, Yi-Hsin CHENG
  • Publication number: 20230124933
    Abstract: An electronic package structure includes an electronic structure, a wiring structure, an electrical contact and a support layer. The wiring structure is located over the electronic structure. The electrical contact connects the wiring structure and the electronic structure. The support layer is disposed around the electrical contact and has a surface facing the electrical contact. The surface includes at least one inflection point in a cross-sectional view.
    Type: Application
    Filed: October 14, 2021
    Publication date: April 20, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Jen WANG, Po-Jen CHENG, Fu-Yuan CHEN
  • Patent number: 11404386
    Abstract: A semiconductor device package and manufacturing method thereof are provided. The semiconductor device package includes a first conductive structure, a second conductive structure, a connection element, a conductive member, an encapsulant and a binding layer. The first conductive structure includes a first circuit layer. The second conductive structure is disposed over the first conductive structure. The connection element is disposed on and electrically connected to the first circuit layer. The conductive member protrudes from the second conductive structure. The encapsulant is disposed between the first conductive structure and the second conductive structure. The binding layer is disposed between the second conductive structure and the encapsulant.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: August 2, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Po-Jen Cheng, Po-Hsiang Wang, Fu-Yuan Chen, Wei-Jen Wang
  • Publication number: 20220216136
    Abstract: An electronic device package and a method for manufacturing the same are provided. The electronic device package includes a circuit layer and an electronic component. The circuit layer includes a dielectric layer having an opening, and an electrical contact. A width of an aperture of the opening increases from a first surface toward a second surface. The electrical contact is at least partially disposed in the opening and exposed through the opening. The electronic component is disposed on the second surface and electrically connected to the circuit layer.
    Type: Application
    Filed: January 5, 2021
    Publication date: July 7, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-Jen CHENG, Chien-Fan CHEN
  • Patent number: 11271207
    Abstract: An electrical or electrochemical cell, c a cathode layer, an electrolyte layer, and an anode layer is disclosed. The cathode layer includes a first material providing a cathodic electric transport, charge storage or redox function. The electrolyte layer includes a polymer, a first electrolyte salt, and/or an ionic liquid. The anode layer includes a second material providing an anodic electric transport, charge storage or redox function. At least one of the cathode and anode layers includes the ionic liquid, a second electrolyte salt, and/or a transport-enhancing additive.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: March 8, 2022
    Assignee: Imprint Energy, Inc.
    Inventors: John Devin MacKenzie, Christine Chihfan Ho, Karthik Yogeeswaran, Po-Jen Cheng
  • Publication number: 20220068840
    Abstract: A semiconductor device package and manufacturing method thereof are provided. The semiconductor device package includes a first conductive structure, a second conductive structure, a connection element, a conductive member, an encapsulant and a binding layer. The first conductive structure includes a first circuit layer. The second conductive structure is disposed over the first conductive structure. The connection element is disposed on and electrically connected to the first circuit layer. The conductive member protrudes from the second conductive structure. The encapsulant is disposed between the first conductive structure and the second conductive structure. The binding layer is disposed between the second conductive structure and the encapsulant.
    Type: Application
    Filed: August 28, 2020
    Publication date: March 3, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-Jen CHENG, Po-Hsiang WANG, Fu-Yuan CHEN, Wei-Jen WANG
  • Patent number: 11197900
    Abstract: A food composition is disclosed which comprises the acid-resistant bacterial strain Lactobacillus acetotolerans LE36. The L. acetotolerans LE36 strain has anti-inflammatory properties. The food composition can be further provided as a pharmaceutical composition.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: December 14, 2021
    Assignee: TAIWAN ENZYME VILLAGE CO. LTD.
    Inventors: Chia-Li Wei, Yu-Ting Wang, Tsung-Yi Li, Ya-Chen Huang, Po-Jen Cheng
  • Publication number: 20210128199
    Abstract: A device, an instrument and a belt for tying the cervix are provided. The device includes the belt and the instrument. The belt is used to tie the cervix. The instrument includes a first outer pipe, a second outer pipe and two fork structures. The first outer pipe and the second outer pipe are rotatable to each other. The two fork structures are connected individually to corresponding axial ends of the first outer pipe and the second outer pipe, respectively, and insert into the belt detachably.
    Type: Application
    Filed: January 11, 2021
    Publication date: May 6, 2021
    Inventors: CHIH-WEN YANG, Po-Jen Cheng, Ting-Hsuan Chen, Tseng-Huang Liu
  • Patent number: 10918414
    Abstract: A device, an instrument and a belt for tying the cervix are provided. The device includes the belt and the instrument. The belt is used to tie the cervix. The instrument includes a first outer pipe, a second outer pipe and two fork structures. The first outer pipe and the second outer pipe are rotatable to each other. The two fork structures are connected individually to corresponding axial ends of the first outer pipe and the second outer pipe, respectively, and insert into the belt detachably.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: February 16, 2021
    Assignees: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, CHANG GUNG MEDICAL FOUNDATION LIN-KOU CHANG GUNG MEMORIAL HOSPITAL
    Inventors: Chih-Wen Yang, Po-Jen Cheng, Ting-Hsuan Chen, Tseng-Huang Liu
  • Publication number: 20200411866
    Abstract: An electrical or electrochemical cell, c a cathode layer, an electrolyte layer, and an anode layer is disclosed. The cathode layer includes a first material providing a cathodic electric transport, charge storage or redox function. The electrolyte layer includes a polymer, a first electrolyte salt, and/or an ionic liquid. The anode layer includes a second material providing an anodic electric transport, charge storage or redox function. At least one of the cathode and anode layers includes the ionic liquid, a second electrolyte salt, and/or a transport-enhancing additive.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 31, 2020
    Applicant: Imprint Energy, Inc.
    Inventors: John Devin MacKenzie, Christine Chihfan Ho, Karthik Yogeeswaran, Po-Jen Cheng
  • Publication number: 20200345797
    Abstract: A Lactobacillus acetotolerans LE36 that has an anti-inflammatory function. Further, the Lactobacillus acetotolerans LE36 can be further provided as a food composition or a pharmaceutical composition.
    Type: Application
    Filed: May 3, 2019
    Publication date: November 5, 2020
    Applicants: Taiwan Enzyme Village Co. Ltd., National Chiayi University
    Inventors: Chia-Li Wei, Yu-Ting Wang, Tsung-Yi Li, Ya-Chen Huang, Po-Jen Cheng
  • Patent number: 10818925
    Abstract: An electrical or electrochemical cell, including a cathode layer, an electrolyte layer, and an anode layer is disclosed. The cathode layer includes a first material providing a cathodic electric transport, charge storage or redox function. The electrolyte layer includes a polymer, a first electrolyte salt, and/or an ionic liquid. The anode layer includes a second material providing an anodic electric transport, charge storage or redox function. At least one of the cathode and anode layers includes the ionic liquid, a second electrolyte salt, and/or a transport-enhancing additive.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: October 27, 2020
    Assignee: Imprint Energy, Inc.
    Inventors: John Devin MacKenzie, Christine Chihfan Ho, Karthik Yogeeswaran, Po-Jen Cheng
  • Publication number: 20190183530
    Abstract: A device, an instrument and a belt for tying the cervix are provided. The device includes the belt and the instrument. The belt is used to tie the cervix. The instrument includes a first outer pipe, a second outer pipe and two fork structures. The first outer pipe and the second outer pipe are rotatable to each other. The two fork structures are connected individually to corresponding axial ends of the first outer pipe and the second outer pipe, respectively, and insert into the belt detachably.
    Type: Application
    Filed: December 14, 2018
    Publication date: June 20, 2019
    Inventors: CHIH-WEN YANG, Po-Jen Cheng, Ting-Hsuan Chen, Tseng-Huang Liu
  • Publication number: 20190165375
    Abstract: An electrical or electrochemical cell, including a cathode layer, an electrolyte layer, and an anode layer is disclosed. The cathode layer includes a first material providing a cathodic electric transport, charge storage or redox function. The electrolyte layer includes a polymer, a first electrolyte salt, and/or an ionic liquid. The anode layer includes a second material providing an anodic electric transport, charge storage or redox function. At least one of the cathode and anode layers includes the ionic liquid, a second electrolyte salt, and/or a transport-enhancing additive.
    Type: Application
    Filed: January 31, 2019
    Publication date: May 30, 2019
    Applicant: Imprint Energy, Inc.
    Inventors: John Devin MacKenzie, Christine Chihfan Ho, Karthik Yogeeswaran, Po-Jen Cheng