Patents by Inventor Po-Jen Cheng
Po-Jen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132330Abstract: Motor control architecture including a travel, a hoist, and a controller is disclosed. The travel disposed on a main rail having an auxiliary-encoder includes a master-driver and a slave-driver for driving two motors. Each motor has a main-encoder. The hoist drives a rope and calculates a rope length continuously. The controller calculates an anti-sway position command based on the rope-length and a position command. The two drivers perform a full closed-loop computation based on a feedback of one main-encoder, a feedback of the auxiliary-encoder, and the anti-sway position command. Wherein, the master-driver controls one motor based on a speed command generated by the full closed-loop computation and the slave-driver follows the speed command and a torque command of the master-driver to drive another motor; or the two drivers compensate the torque command based on an error value between the feedback of one main-encoder and the feedback of the auxiliary-encoder.Type: ApplicationFiled: October 18, 2023Publication date: April 25, 2024Inventors: Huan-Chang CHEN, Po-Jen KO, Chun-Ju WU, Lon-Jay CHENG, Wan-Ping CHEN, Chih-Yuan CHANG
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Patent number: 11961808Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.Type: GrantFiled: October 14, 2021Date of Patent: April 16, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wei-Jen Wang, Po-Jen Cheng, Fu-Yuan Chen, Yi-Hsin Cheng
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Patent number: 11923285Abstract: An electronic device package and a method for manufacturing the same are provided. The electronic device package includes a circuit layer and an electronic component. The circuit layer includes a dielectric layer having an opening, and an electrical contact. A width of an aperture of the opening increases from a first surface toward a second surface. The electrical contact is at least partially disposed in the opening and exposed through the opening. The electronic component is disposed on the second surface and electrically connected to the circuit layer.Type: GrantFiled: January 5, 2021Date of Patent: March 5, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Po-Jen Cheng, Chien-Fan Chen
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Publication number: 20230260957Abstract: An electronic structure includes a packaging structure, a circuit pattern structure, an underfill and a protrusion structure. The circuit pattern structure is disposed over the packaging structure. A gap is between the circuit pattern structure and the packaging structure. The underfill is disposed in the gap. The protrusion structure is disposed in the gap, and is configured to facilitate the distributing of the underfill in the gap.Type: ApplicationFiled: February 11, 2022Publication date: August 17, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-Jen CHENG, Wei-Jen WANG, Fu-Yuan CHEN
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Publication number: 20230187367Abstract: An electronic package structure includes a lower circuit pattern structure, an upper circuit pattern structure, a reflowable material and at least one core element. The upper circuit pattern structure is disposed above the lower circuit pattern structure. The reflowable material is disposed between the upper circuit pattern structure and the lower circuit pattern structure. The core element attaches to the reflowable material and is configured to inhibit displacement of the at least one core element during a reflow process.Type: ApplicationFiled: December 10, 2021Publication date: June 15, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Jen WANG, Po-Jen CHENG, Fu-Yuan CHEN, Kao Hsin CHEN
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Patent number: 11648034Abstract: A device, an instrument and a belt for tying the cervix are provided. The device includes the belt and the instrument. The belt is used to tie the cervix. The instrument includes a first outer pipe, a second outer pipe and two fork structures. The first outer pipe and the second outer pipe are rotatable to each other. The two fork structures are connected individually to corresponding axial ends of the first outer pipe and the second outer pipe, respectively, and insert into the belt detachably.Type: GrantFiled: January 11, 2021Date of Patent: May 16, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Wen Yang, Po-Jen Cheng, Ting-Hsuan Chen, Tseng-Huang Liu
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Publication number: 20230124000Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.Type: ApplicationFiled: October 14, 2021Publication date: April 20, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Jen WANG, Po-Jen CHENG, Fu-Yuan CHEN, Yi-Hsin CHENG
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Publication number: 20230124933Abstract: An electronic package structure includes an electronic structure, a wiring structure, an electrical contact and a support layer. The wiring structure is located over the electronic structure. The electrical contact connects the wiring structure and the electronic structure. The support layer is disposed around the electrical contact and has a surface facing the electrical contact. The surface includes at least one inflection point in a cross-sectional view.Type: ApplicationFiled: October 14, 2021Publication date: April 20, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Jen WANG, Po-Jen CHENG, Fu-Yuan CHEN
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Patent number: 11404386Abstract: A semiconductor device package and manufacturing method thereof are provided. The semiconductor device package includes a first conductive structure, a second conductive structure, a connection element, a conductive member, an encapsulant and a binding layer. The first conductive structure includes a first circuit layer. The second conductive structure is disposed over the first conductive structure. The connection element is disposed on and electrically connected to the first circuit layer. The conductive member protrudes from the second conductive structure. The encapsulant is disposed between the first conductive structure and the second conductive structure. The binding layer is disposed between the second conductive structure and the encapsulant.Type: GrantFiled: August 28, 2020Date of Patent: August 2, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Po-Jen Cheng, Po-Hsiang Wang, Fu-Yuan Chen, Wei-Jen Wang
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Publication number: 20220216136Abstract: An electronic device package and a method for manufacturing the same are provided. The electronic device package includes a circuit layer and an electronic component. The circuit layer includes a dielectric layer having an opening, and an electrical contact. A width of an aperture of the opening increases from a first surface toward a second surface. The electrical contact is at least partially disposed in the opening and exposed through the opening. The electronic component is disposed on the second surface and electrically connected to the circuit layer.Type: ApplicationFiled: January 5, 2021Publication date: July 7, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-Jen CHENG, Chien-Fan CHEN
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Patent number: 11271207Abstract: An electrical or electrochemical cell, c a cathode layer, an electrolyte layer, and an anode layer is disclosed. The cathode layer includes a first material providing a cathodic electric transport, charge storage or redox function. The electrolyte layer includes a polymer, a first electrolyte salt, and/or an ionic liquid. The anode layer includes a second material providing an anodic electric transport, charge storage or redox function. At least one of the cathode and anode layers includes the ionic liquid, a second electrolyte salt, and/or a transport-enhancing additive.Type: GrantFiled: September 16, 2020Date of Patent: March 8, 2022Assignee: Imprint Energy, Inc.Inventors: John Devin MacKenzie, Christine Chihfan Ho, Karthik Yogeeswaran, Po-Jen Cheng
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Publication number: 20220068840Abstract: A semiconductor device package and manufacturing method thereof are provided. The semiconductor device package includes a first conductive structure, a second conductive structure, a connection element, a conductive member, an encapsulant and a binding layer. The first conductive structure includes a first circuit layer. The second conductive structure is disposed over the first conductive structure. The connection element is disposed on and electrically connected to the first circuit layer. The conductive member protrudes from the second conductive structure. The encapsulant is disposed between the first conductive structure and the second conductive structure. The binding layer is disposed between the second conductive structure and the encapsulant.Type: ApplicationFiled: August 28, 2020Publication date: March 3, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-Jen CHENG, Po-Hsiang WANG, Fu-Yuan CHEN, Wei-Jen WANG
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Patent number: 11197900Abstract: A food composition is disclosed which comprises the acid-resistant bacterial strain Lactobacillus acetotolerans LE36. The L. acetotolerans LE36 strain has anti-inflammatory properties. The food composition can be further provided as a pharmaceutical composition.Type: GrantFiled: May 3, 2019Date of Patent: December 14, 2021Assignee: TAIWAN ENZYME VILLAGE CO. LTD.Inventors: Chia-Li Wei, Yu-Ting Wang, Tsung-Yi Li, Ya-Chen Huang, Po-Jen Cheng
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Publication number: 20210128199Abstract: A device, an instrument and a belt for tying the cervix are provided. The device includes the belt and the instrument. The belt is used to tie the cervix. The instrument includes a first outer pipe, a second outer pipe and two fork structures. The first outer pipe and the second outer pipe are rotatable to each other. The two fork structures are connected individually to corresponding axial ends of the first outer pipe and the second outer pipe, respectively, and insert into the belt detachably.Type: ApplicationFiled: January 11, 2021Publication date: May 6, 2021Inventors: CHIH-WEN YANG, Po-Jen Cheng, Ting-Hsuan Chen, Tseng-Huang Liu
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Patent number: 10918414Abstract: A device, an instrument and a belt for tying the cervix are provided. The device includes the belt and the instrument. The belt is used to tie the cervix. The instrument includes a first outer pipe, a second outer pipe and two fork structures. The first outer pipe and the second outer pipe are rotatable to each other. The two fork structures are connected individually to corresponding axial ends of the first outer pipe and the second outer pipe, respectively, and insert into the belt detachably.Type: GrantFiled: December 14, 2018Date of Patent: February 16, 2021Assignees: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, CHANG GUNG MEDICAL FOUNDATION LIN-KOU CHANG GUNG MEMORIAL HOSPITALInventors: Chih-Wen Yang, Po-Jen Cheng, Ting-Hsuan Chen, Tseng-Huang Liu
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Publication number: 20200411866Abstract: An electrical or electrochemical cell, c a cathode layer, an electrolyte layer, and an anode layer is disclosed. The cathode layer includes a first material providing a cathodic electric transport, charge storage or redox function. The electrolyte layer includes a polymer, a first electrolyte salt, and/or an ionic liquid. The anode layer includes a second material providing an anodic electric transport, charge storage or redox function. At least one of the cathode and anode layers includes the ionic liquid, a second electrolyte salt, and/or a transport-enhancing additive.Type: ApplicationFiled: September 16, 2020Publication date: December 31, 2020Applicant: Imprint Energy, Inc.Inventors: John Devin MacKenzie, Christine Chihfan Ho, Karthik Yogeeswaran, Po-Jen Cheng
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Publication number: 20200345797Abstract: A Lactobacillus acetotolerans LE36 that has an anti-inflammatory function. Further, the Lactobacillus acetotolerans LE36 can be further provided as a food composition or a pharmaceutical composition.Type: ApplicationFiled: May 3, 2019Publication date: November 5, 2020Applicants: Taiwan Enzyme Village Co. Ltd., National Chiayi UniversityInventors: Chia-Li Wei, Yu-Ting Wang, Tsung-Yi Li, Ya-Chen Huang, Po-Jen Cheng
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Patent number: 10818925Abstract: An electrical or electrochemical cell, including a cathode layer, an electrolyte layer, and an anode layer is disclosed. The cathode layer includes a first material providing a cathodic electric transport, charge storage or redox function. The electrolyte layer includes a polymer, a first electrolyte salt, and/or an ionic liquid. The anode layer includes a second material providing an anodic electric transport, charge storage or redox function. At least one of the cathode and anode layers includes the ionic liquid, a second electrolyte salt, and/or a transport-enhancing additive.Type: GrantFiled: January 31, 2019Date of Patent: October 27, 2020Assignee: Imprint Energy, Inc.Inventors: John Devin MacKenzie, Christine Chihfan Ho, Karthik Yogeeswaran, Po-Jen Cheng
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Publication number: 20190183530Abstract: A device, an instrument and a belt for tying the cervix are provided. The device includes the belt and the instrument. The belt is used to tie the cervix. The instrument includes a first outer pipe, a second outer pipe and two fork structures. The first outer pipe and the second outer pipe are rotatable to each other. The two fork structures are connected individually to corresponding axial ends of the first outer pipe and the second outer pipe, respectively, and insert into the belt detachably.Type: ApplicationFiled: December 14, 2018Publication date: June 20, 2019Inventors: CHIH-WEN YANG, Po-Jen Cheng, Ting-Hsuan Chen, Tseng-Huang Liu
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Publication number: 20190165375Abstract: An electrical or electrochemical cell, including a cathode layer, an electrolyte layer, and an anode layer is disclosed. The cathode layer includes a first material providing a cathodic electric transport, charge storage or redox function. The electrolyte layer includes a polymer, a first electrolyte salt, and/or an ionic liquid. The anode layer includes a second material providing an anodic electric transport, charge storage or redox function. At least one of the cathode and anode layers includes the ionic liquid, a second electrolyte salt, and/or a transport-enhancing additive.Type: ApplicationFiled: January 31, 2019Publication date: May 30, 2019Applicant: Imprint Energy, Inc.Inventors: John Devin MacKenzie, Christine Chihfan Ho, Karthik Yogeeswaran, Po-Jen Cheng