Abstract: An efficiency optimization method for hardware devices with adjustable clock frequencies is provided. The work current of the hardware device is measured and used to obtain the corresponding work level from a conversion table. The obtained work level is compared with the currently executing work level to make adjustments for various parameters for the hardware device and for the operation of the corresponding heat-dissipating device. Therefore, the hardware device can achieve a better performance.

Abstract: The present invention relates to a three-dimensional package and a method of making the same. The three-dimensional package comprises a first wafer, at least one first hole, a first isolation layer, a first conductive layer, a first solder, a second wafer, at least one second hole, a second isolation layer, a second conductive layer, and a second solder. The first wafer has at least one first pad and a first protection layer exposing the first pad. The first hole penetrates the first wafer. The first isolation layer is disposed on the side wall of the first hole. The lower end of the first conductive layer extends below the surface of the first wafer. The first solder is disposed in the first hole, and is electrically connected to the first pad via the first conductive layer. The second wafer has at least one second pad and a second protection layer exposing the second pad. The second hole penetrates the second wafer. The second isolation layer is disposed on the side wall of the second hole.

Abstract: A multi-chip package substrate for both flip-chip bumping and wire-bonding applications comprises a substrate body having a top surface and a bottom surface. A plurality of bumping pads and a plurality of wire-bonding pads are formed on the top surface. The bumping pads are disposed on the top surface of the substrate body and a pre-solder material is formed on the bumped pads. The wire-bonding pads are disposed on the top surface of the substrate body and a Ni/Au layer is formed on the wire-bonding pads. In order to avoid the bumping pads and the wire-bonding pads from oxidation during packaging processes. The pre-solder material fully covers the bumping pads to avoid the Au intermetallics generated in a plurality of bumps on a bumped chip during packaging processes. The reliability of the multi-chip stacked package for both flip-chip bumping and wire-bonding applications will be greatly improved.

Abstract: A bumper guard for attachment to a sports racquet. The sports racquet includes a frame having a head portion with an outer peripheral surface and a plurality of grommet holes formed into the head portion for supporting a string bed. The bumper guard includes an elongate body having a first length, an inner surface and an outer surface. The body includes a central region and first and second wings. The central region, when installed on the racquet, is generally centered about a plane defined by the string bed. The first and second wings extend from the central region. The inner surface of the body configured to generally conform with the peripheral outer surface of the head portion. Each of the first and second wings has an inner wall and an outer wall defining at least one elongate hollow cavity.

Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 ?m is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.

Abstract: A sports racquet extending along a longitudinal axis. The racquet includes a head portion and a handle portion. The head portion defines a string bed area. The handle portion has a distal end and a proximal end. The distal end of the handle portion is coupled to the head portion. The handle portion has a length and an outer surface. The handle portion includes at least two spaced apart channels. Each channel inwardly extends into the outer surface and extends generally parallel to the longitudinal axis from the distal end of the handle portion and over at least a portion of the length of the handle portion. Each channel is configured for receiving at least one string and for guiding the string along at least a portion of the length of the handle portion.

Abstract: A game racquet includes head portion and a handle portion. The head and handle portions include one or both of a fiber-reinforced thermoset material and a fiber-reinforced thermoplastic material. The handle portion is coupled to the head portion by shock and/or vibration absorbing material.

Abstract: A bumper guard for attachment to a sports racquet. The sports racquet includes a frame having a head portion with an outer peripheral surface and a plurality of grommet holes formed into the head portion for supporting a string bed. The bumper guard includes an elongate body having a first length, an inner surface and an outer surface. The body includes a central region and first and second wings. The central region, when installed on the racquet, is generally centered about a plane defined by the string bed. The first and second wings extend from the central region. The inner surface of the body configured to generally conform with the peripheral outer surface of the head portion. Each of the first and second wings has an inner wall and an outer wall defining at least one elongate hollow cavity.

Abstract: An under-bump-metallurgy layer is provided. The under-bump-metallurgy layer is formed over the contact pad of a chip and a welding lump is formed over the under-ball-metallurgy layer. The under-bump-metallurgy layer comprises an adhesion layer, a barrier layer and a wettable layer. The adhesion layer is directly formed over the contact pad. The barrier layer made from a material such as nickel-vanadium alloy is formed over the adhesion layer. The wettable layer made from a material such as copper is formed over the barrier layer. The wettable layer has an overall thickness that ranges from about 3 ?m to about 8 ?m.

Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 ?m is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.

Abstract: A game racquet includes separate head and handle portions which are separated by shock and/or vibration absorbing material. Both the head portion and the handle portion are bonded to the absorbing material and are thereby connected to each other.

Abstract: An under-ball-metallurgy layer between a bonding pad on a chip and a solder bump made with tin-based material is provided. The under-ball-metallurgy layer at least includes an adhesion layer over the bonding pad, a nickel-vanadium layer over the adhesion layer, a wettable layer over the nickel-vanadium layer and a barrier layer over the wettable layer. The barrier layer prevents the penetration of nickel atoms from the nickel-vanadium layer and reacts with tin within the solder bump to form inter-metallic compound. This invention also provides an alternative under-ball-metallurgy layer that at least includes an adhesion layer over the bonding pad, a wettable layer over the adhesion layer and a nickel-vanadium layer over the wettable layer. The nickel within the nickel-vanadium layer may react with tin within the solder bump to form an inter-metallic compound.

Abstract: A sports racquet including a frame, a yoke and a string bed. The frame includes a head portion, a handle portion, and a throat portion positioned between the head and handle portions. The head portion includes an upper region, and first and second side regions. The yoke is coupled to the first and second side regions. The head portion and the yoke define a string bed area. The string bed is formed of a number of cross and main string segments. The main string segments include at least one central main string segment and at least two peripheral main string segments. Each central main string segment has first and second ends wherein the first end engages the head portion and the second end engages the yoke. Each peripheral main string segment is coupled at a proximal end to at least one of the throat portion and the handle portion.

Abstract: A multi-chip package substrate for both flip-chip bumping and wire-bonding applications comprises a substrate body having a top surface and a bottom surface. A plurality of bumping pads and a plurality of wire-bonding pads are formed on the top surface. The bumping pads are disposed on the top surface of the substrate body and a pre-solder material is formed on the bumped pads. The wire-bonding pads are disposed on the top surface of the substrate body and a Ni/Au layer is formed on the wire-bonding pads. In order to avoid the bumping pads and the wire-bonding pads from oxidation during packaging processes. The pre-solder material fully covers the bumping pads to avoid the Au intermetallics generated in a plurality of bumps on a bumped chip during packaging processes. The reliability of the multi-chip stacked package for both flip-chip bumping and wire-bonding applications will be greatly improved.

Abstract: A sports racquet extending along a longitudinal axis. The racquet includes a head portion and a handle portion. The head portion defines a string bed area. The handle portion has a distal end and a proximal end. The distal end of the handle portion is coupled to the head portion. The handle portion has a length and an outer surface. The handle portion includes at least two spaced apart channels. Each channel inwardly extends into the outer surface and extends generally parallel to the longitudinal axis from the distal end of the handle portion and over at least a portion of the length of the handle portion. Each channel is configured for receiving at least one string and for guiding the string along at least a portion of the length of the handle portion.

Abstract: A test assembly for an integrated circuit package includes a package substrate and a test board. The package substrate is provided with a plurality of first contact pads linked in a first daisy chain pattern. The test board has a plurality of second contact pads linked in a second daisy chain pattern and a plurality of test pads. All of the second contact pads are divided into a plurality of groups each connected to one pair of test pads. All of the second contact pads in any group are arranged in a line. The present invention further provides a method of testing an integrated circuit package utilizing the aforementioned package substrate and test board.

Abstract: A test assembly for an integrated circuit package includes a package substrate and a test board. The package substrate is provided with a plurality of first contact pads linked in a first daisy chain pattern. The test board has a plurality of second contact pads linked in a second daisy chain pattern and a plurality of test pads. All of the second contact pads are divided into a plurality of groups each connected to one pair of test pads. All of the second contact pads in any group are arranged in a line. The present invention further provides a method of testing an integrated circuit package utilizing the aforementioned package substrate and test board.

Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 &mgr;m is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.

Abstract: An under-bump-metallurgy layer is provided. The under-bump-metallurgy layer is formed over the contact pad of a chip and a welding lump is formed over the under-ball-metallurgy layer. The under-bump-metallurgy layer comprises an adhesion layer, a barrier layer and a wettable layer. The adhesion layer is directly formed over the contact pad. The barrier layer made from a material such as nickel-vanadium alloy is formed over the adhesion layer. The wettable layer made from a material such as copper is formed over the barrier layer. The wettable layer has an overall thickness that ranges from about 3 &mgr;m to about 8 &mgr;m.

Abstract: An under-ball-metallurgy layer between a bonding pad on a chip and a solder bump made with tin-based material is provided. The under-ball-metallurgy layer at least includes an adhesion layer over the bonding pad, a nickel-vanadium layer over the adhesion layer, a wettable layer over the nickel-vanadium layer and a barrier layer over the wettable layer. The barrier layer prevents the penetration of nickel atoms from the nickel-vanadium layer and reacts with tin within the solder bump to form inter-metallic compound. This invention also provides an alternative under-ball-metallurgy layer that at least includes an adhesion layer over the bonding pad, a wettable over the adhesion layer and a nickel-vanadium layer over the wettable layer. The nickel within the nickel-vanadium layer may react with tin within the solder bump to form an inter-metallic compound.