Patents by Inventor Po Yuan
Po Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240142847Abstract: A display device includes a panel, a conductive layer, a first color filter array and a second color filter array. The panel has a display surface and multiple sub-pixel regions where the multiple sub-pixel regions and the conductive layer are on this display surface. The first color filter array including multiple first color filter elements is disposed on the conductive layer while the second color filter array including multiple second color filter elements is disposed on the first color filter array. One first overlaid region and one second overlaid region are defined by the orthogonal projections of the color filter elements within one of the sub-pixel regions. In one sub-pixel region, a section of the first overlaid region does not overlap a section of the second overlaid region.Type: ApplicationFiled: June 14, 2023Publication date: May 2, 2024Inventors: Liang-Yu LIN, Po-Yuan LO, Ian FRENCH
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Publication number: 20240146501Abstract: A method of monitoring a clock signal of a server is provided. The server includes a phase-locked loop (PLL), a baseboard management controller (BMC), and a light emitting unit. The method includes steps of: A) the server executing a time synchronization service to obtain a synchronization mode that the PLL is operating in, where the synchronization mode is one of a free-run mode, a locked mode, and a holdover mode; B) the server updating the synchronization mode to the BMC when executing the time synchronization service; and C) the BMC storing the synchronization mode and controlling the light emitting unit to display in one of a plurality of displaying manners that corresponds to the synchronization mode.Type: ApplicationFiled: July 10, 2023Publication date: May 2, 2024Inventors: Yu-Yuan Chen, Po-Wei Chang, Chi-Hua Li
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Patent number: 11973068Abstract: A micro LED display device includes: a substrate; a plurality of micro light-emitting diodes disposed on the substrate; and a reflective layer and a black layer sequentially stacked on the substrate. The reflective layer and the black layer cover a surface of the substrate, wherein a top surface of the plurality of micro light-emitting diodes is exposed through the reflective layer and the black layer. A plurality of reflective banks and a plurality of black banks are sequentially disposed on the black layer and exposing the plurality of micro light-emitting diodes; and a color-conversion material covers the top surface of at least one of the plurality of micro light-emitting diodes. The color-conversion material is laterally disposed between the plurality of reflective banks. The reflective layer, the black layer, the plurality of reflective banks, and the plurality of black banks overlap each other in a display direction.Type: GrantFiled: October 28, 2021Date of Patent: April 30, 2024Assignee: PLAYNITRIDE DISPLAY CO., LTD.Inventors: Loganathan Murugan, Sheng-Yuan Sun, Po-Wei Chiu
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Publication number: 20240134470Abstract: An electronic device includes a first insulating layer, a first conductive portion, a second conductive portion, a transistor, and an electronic unit. The first insulating layer has a first opening penetrating the first insulating layer along a first direction. The first conductive portion is disposed in the first opening. The second conductive portion is electrically connected to the first conductive portion. The transistor is electrically connected to the second conductive portion. The electronic unit is electrically connected to the first conductive portion. In a cross-sectional view of the electronic device, the electronic unit and the second conductive portion are disposed on two opposite sides of the first insulating layer respectively, the first conductive portion has a first length along a second direction perpendicular to the first direction, the second conductive portion has a second length along the second direction, and the first length is different from the second length.Type: ApplicationFiled: January 4, 2024Publication date: April 25, 2024Applicant: InnoLux CorporationInventors: Po-Yang Chen, Hsing-Yuan Hsu, Tzu-Min Yan, Chun-Hsien Lin, Kuei-Sheng Chang
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Publication number: 20240132330Abstract: Motor control architecture including a travel, a hoist, and a controller is disclosed. The travel disposed on a main rail having an auxiliary-encoder includes a master-driver and a slave-driver for driving two motors. Each motor has a main-encoder. The hoist drives a rope and calculates a rope length continuously. The controller calculates an anti-sway position command based on the rope-length and a position command. The two drivers perform a full closed-loop computation based on a feedback of one main-encoder, a feedback of the auxiliary-encoder, and the anti-sway position command. Wherein, the master-driver controls one motor based on a speed command generated by the full closed-loop computation and the slave-driver follows the speed command and a torque command of the master-driver to drive another motor; or the two drivers compensate the torque command based on an error value between the feedback of one main-encoder and the feedback of the auxiliary-encoder.Type: ApplicationFiled: October 18, 2023Publication date: April 25, 2024Inventors: Huan-Chang CHEN, Po-Jen KO, Chun-Ju WU, Lon-Jay CHENG, Wan-Ping CHEN, Chih-Yuan CHANG
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Patent number: 11967591Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.Type: GrantFiled: August 6, 2021Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin, Jyh Chwen Frank Lee
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Publication number: 20240126132Abstract: A reflective display with a color compensation layer includes a driving substrate, a display medium layer located on the driving substrate, a color filter array, an adhesive layer located on the display medium layer, and a color compensation layer. The driving substrate includes a first sub-pixel region, a second sub-pixel region, and a third sub-pixel region. The color filter array includes a red color resist, a green color resist, and a blue color resist. The color filter array and the color compensation layer are located at opposite two sides of the adhesive layer. The color compensation layer includes a first blue ink layer. A vertical projection of the green color resist on the driving substrate overlaps the second sub-pixel region. A vertical projection of the first blue ink layer on the driving substrate at least partially overlaps the second sub-pixel region.Type: ApplicationFiled: May 15, 2023Publication date: April 18, 2024Inventors: Jau-Min DING, Po-Yuan LO, Ian FRENCH
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Publication number: 20240125995Abstract: An image sensor includes a group of sensor units and a color filter layer disposed within the group of sensor units. The image sensor further includes a dielectric structure and a plurality of polarization splitters disposed corresponding to the color filter layer. Each of the plurality of polarization splitters has a first meta element extending in a first direction from top view and a second meta element extending in a second direction from top view. The second direction is perpendicular to the first direction.Type: ApplicationFiled: October 12, 2022Publication date: April 18, 2024Inventors: Chun-Yuan WANG, Yu-Chi CHANG, Po-Hsiang WANG
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Publication number: 20240126633Abstract: A method for responding to a command is adapted for a storage device. The method for responding to a command includes following steps of: sequentially receiving a first command and a second command by a bridge of the storage device from a host; executing the first command and the second command to generate a status completion signal or a status error signal by the bridge; and detecting an error state of at least one of the first command and the second command to execute a response mode or an idle mode by the bridge according to the error state so as to respond to the host.Type: ApplicationFiled: August 14, 2023Publication date: April 18, 2024Inventors: Yi Cheng TSAI, Sung-Kao LIU, Cheng-Yuan HSIAO, Po-Hao CHEN
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Patent number: 11959582Abstract: An adjustable stand for an electronic device that is operable for stable movement in two directions with the use of a single hand of a user. An ergonomic design leverages a natural and intuitive movement of a user's hand to maintain an orientation of the electronic device throughout at least 180 degrees of movement.Type: GrantFiled: June 29, 2022Date of Patent: April 16, 2024Assignee: Logitech Europe S.A.Inventors: Matthew Malone, Gaurav Bradoo, Po-Yuan Chuang, Thien-Greg Nguyen, Emma Kelp-Stebbins, Grace Hina Lee, Osagie Igbeare
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Patent number: 11961808Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.Type: GrantFiled: October 14, 2021Date of Patent: April 16, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wei-Jen Wang, Po-Jen Cheng, Fu-Yuan Chen, Yi-Hsin Cheng
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Publication number: 20240117862Abstract: An actuating device includes an actuator and a stationary portion. The actuator has at least one driving portion. The stationary portion is provided at an arbitrary position along the actuator such that the driving portion forms a first driving portion and a second driving portion. The first driving portion and the second driving portion can be provided with the same actuating ability or with different actuating abilities respectively by adjusting the position of the stationary portion.Type: ApplicationFiled: December 15, 2023Publication date: April 11, 2024Inventors: Chih CHANG, Po-Yuan LIAO
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Publication number: 20240121523Abstract: A light-adjusting device having first regions and second regions is provided. The light-adjusting device includes pillars that form several groups of meta structures. The groups of meta structures correspond to the first regions, and from a top view, the first regions and the second regions are arranged in a checkerboard pattern.Type: ApplicationFiled: October 7, 2022Publication date: April 11, 2024Inventors: Kai-Hao CHANG, Chun-Yuan WANG, Shin-Hong KUO, Zong-Ru TU, Po-Hsiang WANG, Chih-Ming WANG
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Publication number: 20240120639Abstract: A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.Type: ApplicationFiled: August 10, 2023Publication date: April 11, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Hsiang Huang, Fong-Yuan Chang, Tsui-Ping Wang, Yi-Shin Chu
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Publication number: 20240113010Abstract: A semiconductor device is disclosed herein. The semiconductor device includes a routing structure. The routing structure has an intermediate conductive routing layer. The intermediate conductive routing layer includes a first mesh conductive layer formed in a predetermined second region of the semiconductor device and a second mesh conductive layer formed in a predetermined first region of the semiconductor device. The first mesh conductive layer and the second mesh conductive layer are electrically isolated from each other. The intermediate conductive routing layer further includes multiple first conductive islands formed in the predetermined first region and multiple second conductive islands formed in the predetermined second region.Type: ApplicationFiled: September 20, 2023Publication date: April 4, 2024Inventors: Po-Hsien Huang, Yu-Huei Lee, Hsin-Hung Lin, Chun-Yuan Shih, Lien-Chieh Yu
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Publication number: 20240113071Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.Type: ApplicationFiled: January 5, 2023Publication date: April 4, 2024Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
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Patent number: 11946559Abstract: A vessel pressure regulating system with a multidirectional control valve device includes: a pressure source; the multidirectional control valve device, which includes a housing, an actuation unit, and a working element, the housing having an interior space, an input port, and an output port, the input port being in communication with the pressure source, the actuation unit having a stationary portion and a driving portion, and the working element being controlled by the driving portion in order to open or close the output port; a vessel in communication with the output port; and a control unit for controlling the operation of the pressure source and of the driving portion. The vessel pressure regulating system enables a safety airbag of a vehicle or a similar device in a chair, bed, or the like to function effectively.Type: GrantFiled: March 21, 2022Date of Patent: April 2, 2024Assignee: KOGE MICRO TECH CO., LTD.Inventors: Chih Chang, Po-Yuan Liao
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Publication number: 20240105744Abstract: An image sensor includes a photoelectric conversion layer, a plurality of deep trench isolations, a first color filter, a first deflector, and a covering layer. The photoelectric conversion layer includes a first photodiode and a second photodiode. The deep trench isolations separate the first photodiode and the second photodiode, in which a pixel dimension is determined by a distance between two adjacent deep trench isolations. The first color filter is disposed on the first photodiode and the second photodiode. The first deflector is disposed on the first color filter. The covering layer covers and surrounds the first deflector. A refractive index of the covering layer is greater than a refractive index of the first deflector, and a difference value between the refractive index of the covering layer and the refractive index of the first deflector is in a range from 0.15 to 0.6.Type: ApplicationFiled: September 28, 2022Publication date: March 28, 2024Inventors: Ching-Hua LI, Chun-Yuan WANG, Zong-Ru TU, Po-Hsiang WANG
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Publication number: 20240105619Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.Type: ApplicationFiled: November 29, 2023Publication date: March 28, 2024Inventors: Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Sen-Bor Jan, Ming-Fa Chen, Chin-Chou Liu, Yi-Kan Cheng
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Patent number: 11942906Abstract: The present invention provides a transmitter including a mixer, a harmonic impedance adjustment circuit and an amplifier. The mixer is configured to mix a first baseband signal with a first oscillation signal to generate a first mixed signal to a first node, and to mix a second baseband signal with a second oscillation signal to generate a second mixed signal to a second node. The harmonic impedance adjustment circuit is coupled between the first node and the second node, and is configured to reduce harmonic components of the first mixed signal and the second mixed signal to generate an adjusted first mixed signal and an adjusted second mixed signal. The amplifier is coupled to the harmonic impedance adjustment circuit, and is configured to generate an amplified signal according to the adjusted first mixed signal and the adjusted second mixed signal.Type: GrantFiled: February 7, 2022Date of Patent: March 26, 2024Assignee: Realtek Semiconductor Corp.Inventors: Ting-Yao Huang, Teng-Yuan Chang, Po-Chih Wang, Ka-Un Chan