Abstract: A system for fusion of Wi-Fi measurements from multiple frequency bands to monitor indoor and outdoor space is provided. The system includes a multi-band wireless network comprising a set of radio devices to provide coverage in an environment, wherein the set of radio devices are configured to establish wireless communication or sensing links over multi-band wireless channels, wherein the multi-band wireless channels use a first radio band at a millimeter wavelength and a second radio band at a centimeter wavelength. The system further includes a computing processor communicatively coupled to the set of radio devices and a data storage, wherein the data storage has data comprising a parameterized model, modules and executable programs.

Abstract: A method of millimeter-wave human body security checking based on double standing postures is provided, including: scanning and checking a body of a checked person in a first standing posture by using a millimeter-wave human body security detector, so as to obtain a first millimeter-wave human body image; scanning and checking the body of the same checked person in a second standing posture by using the millimeter-wave human body security detector, so as to obtain a second millimeter-wave human body image, wherein the second standing posture is different from the first standing posture (S10); and determining whether the checked person carries contraband based on at least the first millimeter-wave human body image and the second millimeter-wave human body image (S20).

Abstract: In an embodiment, a device includes a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component. The device also includes a back-side metal layer on a back-side of the package component. The device also includes an indium thermal interface material on a back-side of the back-side metal layer. The device also includes a lid on a back-side of the indium thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.

Abstract: The present disclosure provides a method and a system for training a neural network suitable for localization of a device within an environment based on signals received by the device. The method comprises training a bi-regressor neural network to identify locations from labeled data, wherein the bi-regressor neural network includes a feature extractor and a bi-regressor including two regressors; training parameters of the bi-regressor using the labeled data and unlabeled data, such that each of the two regressors identifies the same labeled locations while processing the labeled data and identifies different locations while processing the unlabeled data; and training parameters of the feature extractor using an adversarial discriminator to extract domain invariant features from the unlabeled data with statistical properties of the labeled data according to the adversarial discriminator such that each of the two regressors identifies the same locations while processing the domain invariant features.

Abstract: A system and a method for tracking an expanded state of an object including a kinematic state indicative of a position of the object and an extended state indicative of one or combination of a dimension and an orientation of the object is provided herein. The system comprises at least one sensor configured to probe a scene including a moving object with one or multiple signal transmissions to produce one or multiple measurements of the object per the transmission, and a processor configured to execute a probabilistic filter tracking a joint probability of the expanded state of the object estimated by a motion model of the object and a measurement model of the object, wherein the measurement model includes a center-truncated distribution having predetermined truncation intervals. The system further comprises an output interface configured to output the expanded state of the object.

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

Abstract: A semiconductor package includes a redistribution structure, a plurality of semiconductor devices, and a plurality of heat dissipation films. The plurality of semiconductor devices mounted on the redistribution structure. The plurality of heat dissipation films are respectively disposed on and jointly covering upper surfaces of the plurality of semiconductor devices. A plurality of trenches are respectively extended between each two of the plurality of heat dissipations and extended between each two of the plurality of semiconductor devices.

Abstract: The present disclosure discloses a method for determining a reflective surface of a steering gear and a focusing steering gear of an external level gauge. The method includes: obtaining a focal length and a specific reflection angle (101); determining an 0th step reflective surface (102) of the reflective surface of the steering gear based on the focal length and the specific reflection angle; determining an adjacent step reflective surface (103) by a geometric method based on the 0th step reflective surface; and if a number of steps of the reflective surface of the steering gear reaches a preset value, determining the reflective surface (104) of the steering gear based on the 0th step reflective surface and the adjacent step reflective surface. According to the present disclosure, a liquid level can be measured at an outer side of a side wall of a vertical liquid storage tank.

Abstract: A package structure includes a circuit substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.

Abstract: A method of fabricating an integrated fan-out package is provided. A ring-shaped dummy die and a group of integrated circuit dies are mounted over a carrier, wherein the group of integrated circuit dies are surrounded by the ring-shaped dummy die. The ring-shaped dummy die and the group of integrated circuit dies over the carrier are encapsulated with an insulating encapsulation. A redistribution circuit structure is formed on the ring-shaped dummy die, the group of integrated circuit dies and the insulating encapsulation, wherein the redistribution circuit structure is electrically connected to the group of integrated circuit dies, and the ring-shaped dummy die is electrically floating.

Abstract: Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes: a bottom package; wherein an area of a contact surface between the conductor and the through via substantially equals a cross-sectional area of the through via, and the bottom package includes: a molding compound; a through via penetrating through the molding compound; a die molded in the molding compound; and a conductor on the through via. An associated method of manufacturing the semiconductor device is also disclosed.

Abstract: The present disclosure discloses a method for determining a reflective surface of a steering gear and a focusing steering gear of an external level gauge. The method includes: obtaining a focal length and a specific reflection angle (101); determining an 0th step reflective surface (102) of the reflective surface of the steering gear based on the focal length and the specific reflection angle; determining an adjacent step reflective surface (103) by a geometric method based on the 0th step reflective surface; and if a number of steps of the reflective surface of the steering gear reaches a preset value, determining the reflective surface (104) of the steering gear based on the 0th step reflective surface and the adjacent step reflective surface. According to the present disclosure, a liquid level can be measured at an outer side of a side wall of a vertical liquid storage tank.

Abstract: Methods are provided for determining properties of an anisotropic formation (including both fast and slow formations) surrounding a borehole. A logging-while-drilling tool is provided that is moveable through the borehole. The logging-while drilling tool has at least one dipole acoustic source spaced from an array of receivers. During movement of the logging-while-drilling tool, the at least one dipole acoustic source is operated to excite a time-varying pressure field in the anisotropic formation surrounding the borehole. The array of receivers is used to measure waveforms arising from the time-varying pressure field in the anisotropic formation surrounding the borehole. The waveforms are processed to determine a parameter value that represents shear directionality of the anisotropic formation surrounding the borehole.

Abstract: Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.

Abstract: A semiconductor structure includes a first semiconductor package, a second semiconductor package, a heat spreader and an dielectric layer. The first semiconductor package includes a plurality of first semiconductor chips and a first dielectric encapsulation layer disposed around the plurality of the first semiconductor chips. The second semiconductor package is disposed over and corresponds to one of the plurality of first semiconductor chips, wherein the second semiconductor package includes a plurality of second semiconductor chips and a second dielectric encapsulation layer disposed around the plurality of second semiconductor chips. The heat spreader is disposed over and corresponds to another of the plurality of first semiconductor chips. The dielectric layer is disposed over the first semiconductor package and around the second semiconductor package and the heat spreader.

Abstract: An embodiment is a device including a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a first side of the package component. The device also includes a metal layer on a second side of the package component, the second side being opposite the first side. The device also includes a thermal interface material on the metal layer. The device also includes a lid on the thermal interface material. The device also includes a retaining structure on sidewalls of the package component and the thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.

Abstract: A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component, attaching a second thermal interface material different from the first thermal interface material over the second package component, and attaching a heat sink over both of the first thermal interface material and the second thermal interface material.

Abstract: A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.

Abstract: Communication-capable devices such as commercial Wi-Fi devices can be used for integrated sensing and communications (ISAC) systems to jointly exchange data and monitor environment. Such devices typically require diverse signal processing such as machine learning inference that demands high-power operations for real-time sensing and computing. The present invention provides a way to realize energy-efficient computing by exploiting the capability of data communications to access distributed computing resources including classical computers and quantum computers over networks. The system and method are based on the realization that computationally intensive processing is offloaded to networked hybrid classical-quantum computing to build dynamic computing graphs. Some embodiments use automated classical-quantum machine learning whose circuits and hyperparameters are automatically adjusted via gradient or heuristic optimization for Wi-Fi indoor monitoring and human tracking.

Abstract: A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.