Abstract: The present application belongs to the technical field of solar cells, and relates to a p-type bifacial solar cell with partial rear surface field passivation and a preparation method therefor. The solar cell includes a p-type silicon substrate. At the bottom portion of the p-type silicon substrate are arranged, from top to bottom, a silicon oxide passivation layer, an aluminum oxide passivation layer and a rear side silicon nitride anti-reflection layer. A plurality of boron source-doped layers are embedded in the bottom portion of the p-type silicon substrate. Connected to the bottom of each of the boron source-doped layers is a rear side metal electrode layer, which penetrates each of the silicon oxide passivation layer, the aluminum oxide passivation layer and the rear side silicon nitride anti-reflection layer.

Abstract: The invention discloses a visualization method for process monitoring based on bi-kernel t-distributed stochastic neighbor embedding. It includes two steps of offline modeling and online monitoring. In offline modeling, standard t-SNE method is used to reduce the dimension of historical normal data. The mapping parameter matrix from the input kernel matrix to the feature kernel matrix is calculated. PCA is used to reduce the feature kernel matrix to two dimensions, and then the square Mahalanobis distance is calculated as a statistic and the control limit is solved. Online monitor and calculate the kernel function to between the collected data and the modeling data; and the obtained kernel vector is multiplied by the mapping parameter matrix to obtain the mapped feature kernel vector. PCA is used to reduce the dimension of the mapped feature kernel vector to obtain two-dimensional features for visualization. Draw the scatter diagram of the feature and observe whether it is within the ellipse control limit.

Abstract: A package structure includes a circuits substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.

Abstract: A system for fusion of Wi-Fi measurements from multiple frequency bands to monitor indoor and outdoor space is provided. The system includes a multi-band wireless network comprising a set of radio devices to provide coverage in an environment, wherein the set of radio devices are configured to establish wireless communication or sensing links over multi-band wireless channels, wherein the multi-band wireless channels use a first radio band at a millimeter wavelength and a second radio band at a centimeter wavelength. The system further includes a computing processor communicatively coupled to the set of radio devices and a data storage, wherein the data storage has data comprising a parameterized model, modules and executable programs.

Abstract: A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.

Abstract: A system for a target image reconstruction includes a stepped frequency transmitter configured to emit a stepped frequency waveform having different constant frequencies at different periods of time and a modulator configured to modulate the stepped frequency waveform emitted at each period of time with a modulation signal to output a modulated stepped frequency waveform with an increased bandwidth. The system includes a transceiver configured to transmit the modulated stepped frequency waveform to a target and to accept reflection of the modulated stepped frequency waveform reflected from the target, a mixer to interfere the unmodulated stepped frequency waveform and the reflection of the modulated stepped frequency waveform to produce a beat signal of the interference of the unmodulated stepped frequency waveform with the reflection of the modulated stepped frequency waveform, and a signal processor to reconstruct an image of the target from the beat signal.

Abstract: A system for a target image reconstruction includes a stepped frequency transmitter configured to emit a stepped frequency waveform having different constant frequencies at different periods of time and a modulator configured to modulate the stepped frequency waveform emitted at each period of time with a modulation signal to output a modulated stepped frequency waveform with an increased bandwidth. The system includes a transceiver configured to transmit the modulated stepped frequency waveform to a target and to accept reflection of the modulated stepped frequency waveform reflected from the target, a mixer to interfere the unmodulated stepped frequency waveform and the reflection of the modulated stepped frequency waveform to produce a beat signal of the interference of the unmodulated stepped frequency waveform with the reflection of the modulated stepped frequency waveform, and a signal processor to reconstruct an image of the target from the beat signal.

Abstract: The invent relates to an intelligent fault monitoring method based on high-order information enhanced recurrent neural network, for real-time fault monitoring of sewage treatment process. The invent includes two phases of offline modeling and online monitoring. In offline phase, the original data is extracted into high-dimensional high-order information features using OCIA, which can effectively deal with the non Gaussian feature of the data and solve the correlation between variables. Then the extracted features are trained by DRNN. In the online phase, the data are directly mapped to new high-order feature components, and to be discriminated in category by the DRNN network after trained offline. If there is no fault, then the results get into the monitoring model composed of simple OICA for unsupervised monitoring. If no fault is detected, it is determined that there is no fault in the process.

Abstract: A package structure includes a semiconductor package, a thermal conductive gel, a thermal conductive film and a heat spreader. The thermal conductive gel is disposed over the semiconductor package. The thermal conductive film is disposed over the semiconductor package and the thermal conductive gel. A thermal conductivity of the thermal conductive film is different from a thermal conductivity of the thermal conductive gel. The thermal conductive film is surrounded by the heat spreader.

Abstract: A digital television including an interface to receive control signals from a remote controller; a screen; and a controller to execute an application related to a first icon within a menu when the controller receives a signal selecting the first icon within the menu from the remote controller, display a content of the executed application related to the first icon on the screen, enter into an edit mode of a second icon within the menu and display a first indicator for deleting the second icon as well as a second indicator for moving the second icon with displaying the content of the executed application related to the first icon in response to selecting an Up-key included in the remote controller, display a message verifying whether or not to delete the second icon from the menu in response to selecting an OK-key included in the remote controller after selecting the first indicator, delete the second icon from the menu and align other icons in a respective order in response to receiving a signal requesting fo

Abstract: Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.

Abstract: A package structure includes a package substrate, a first semiconductor package and a second semiconductor package, an underfill material, a gap filling structure and a heat dissipation structure. The first semiconductor package and the second semiconductor package are electrically bonded to the package substrate. The underfill material is disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate. The gap filling structure is disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package. The heat dissipation structure is disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a semiconductor package, a thermal conductive gel, a thermal conductive film, and a heat spreader. The semiconductor package has an uneven top surface. The thermal conductive gel covers the uneven top surface of the semiconductor package. The thermal conductive film is over the uneven top surface of the semiconductor package. A thermal conductivity of the thermal conductive film is higher than a thermal conductivity of the thermal conductive gel. The heat spreader is disposed over the thermal conductive film.

Abstract: Methods are provided for determining properties of an anisotropic formation (including both fast and slow formations) surrounding a borehole. A logging-while-drilling tool is provided that is moveable through the borehole. The logging-while drilling tool has at least one dipole acoustic source spaced from an array of receivers. During movement of the logging-while-drilling tool, the at least one dipole acoustic source is operated to excite a time-varying pressure field in the anisotropic formation surrounding the borehole. The array of receivers is used to measure waveforms arising from the time-varying pressure field in the anisotropic formation surrounding the borehole. The waveforms are processed to determine a parameter value that represents shear directionality of the anisotropic formation surrounding the borehole.

Abstract: An optical coherence tomography (OCT) system for profilometry measurements of a specimen with a lateral resolution across the profilometry measurements is provided. The OCT system includes a line-field generator, an interferometer, and a spectrometer. The line-field generator includes a filter arranged in a focal plane of a lens for spatially filtering extended line-field light into a line-field light of a width equal to the lateral resolution. The interferometer is configured to interfere the line-field light reflected from the specimen illuminated with a line-shaped focus with a reference signal of the line-field light to produce an interference pattern. The spectrometer configured to analyze spectral components of the interference pattern in a digital domain to produce the profilometry measurements of the specimen.

Abstract: A system for keyless entry applications using beamforming transmission in a millimeter wave spectrum in an environment. A memory with data including values indicative of link attributes associated with beam signal measurements with states of devices and states of environments. The states of the devices for each device including types of user behavior, locations and poses in each environment. Control circuitry performs beam training with a target device associated with at least one keyless entry application in the environment to measure beam signal values and environmental responses for different beams transmitted over the different beam angles. Selects, in response to the beam training, at least one dominant angle for a beamforming communication with the target device. Estimates, a state of the target device associated with the at least one keyless entry application or a state of the environment, corresponding to environmental responses for different beams estimated during the beam training.

Abstract: The invention discloses a convolution self-encoding fault monitoring method based on batch imaging, and belongs to the technical field of batch process fault monitoring. The method comprises two steps of off-line modeling and on-line monitoring. The offline modeling step comprises the following steps: firstly, normalizing three-dimensional data of intermittent process; then, taking the two-dimensional array of each batch as an image to be directly input into a convolutional auto-encoder (CAE) to carry out deep unsupervised feature learning; and finally, constructing statistics and corresponding control limits for the features learned by CAE by utilizing a support vector machine. The online monitoring step includes: normalizing the collected data, and carrying out batch filling; inputting the normalized and filled batch graph into trained CAE to learn features; and calculating an online statistic, comparing online statistic with an offline control limit.

Abstract: A method for a target image reconstruction is provided. The method includes emitting stepped frequency waveforms having different constant frequencies at different periods of time, modulating the stepped frequency waveforms into frequency ranges each having a first frequency and a second frequency, wherein each of the stepped frequency waveforms are increased from the first frequency to the second frequency based on a range function, wherein the modulated stepped frequency waveforms are arranged with some sparsity factor.

Abstract: An integrated fan out package on package architecture is utilized along with de-wetting structures in order to reduce or eliminated delamination from through vias. In embodiments the de-wetting structures are titanium rings formed by applying a first seed layer and a second seed layer in order to help manufacture the vias. The first seed layer is then patterned into a ring structure which also exposes at least a portion of the first seed layer.

Abstract: A method for determining a shear slowness of a subterranean formation includes receiving waveforms data acquired by receivers in an acoustic measurement tool in response to energy emitted by at least one dipole source. The waveforms are processed to extract a formation flexural acoustic mode and a tool flexural acoustic mode. The processing includes transforming the time domain waveforms to frequency domain waveforms, processing the frequency domain waveforms with a Capon algorithm to compute a two-dimensional spectrum over a chosen range of group slowness and phase slowness values; and processing the two-dimensional spectrum to extract the multi-mode slowness dispersion.