Abstract: A frequency modulation continuous wave (FMCW)-based system configured to convert measurements of a linearly modulated wave from a time-domain into a frequency-domain to produce a non-linear frequency signal, where the non-linear frequency signal comprises a known linear component representing the desired linear modulation and an unknown non-linear component representing the non-linearity of the modulation. The FMCW-based system is further configured to determine coefficients of a basis function approximating a difference between the non-linear frequency signal and the linear frequency component in the frequency domain. The FMCW-based system is further configured to detect one or multiple spectrum peaks in the distorted beat signal with the distortion compensated according to the basis function with the determined coefficients to determine one or multiple distances to the one or multiple objects in the scene.

Abstract: A multiple input multiple output (MIMO) radar system for detecting a moving object is based on an explicit signal model. The explicit signal model accounts for waveform separation residuals by relating measurements of the virtual array to an auto-term including a Kronecker product of object-receiver signatures and transmitter-object signatures; and a cross-term including a Kronecker product of object-receiver signatures and transmitter-object residual signatures. The radar system uses a spatial MIMO object detector that is based on the explicit signal model to detect the moving object.

Abstract: A semiconductor package includes a redistribution structure, a plurality of semiconductor devices, and a plurality of heat dissipation films. The plurality of semiconductor devices mounted on the redistribution structure. The plurality of heat dissipation films are respectively disposed on and jointly covering upper surfaces of the plurality of semiconductor devices. A plurality of trenches are respectively extended between each two of the plurality of heat dissipations and extended between each two of the plurality of semiconductor devices.

Abstract: A package assembly may include a package substrate, a package lid attached to the package substrate and including a plate portion, an outer foot extending from the plate portion, and an inner foot extending from the plate portion inside the outer foot, and an adhesive that adheres the outer foot to the package substrate and the inner foot to the package substrate.

Abstract: In an embodiment, a device includes: a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component, the integrated circuit die exposed at a back-side of the package component; a heat dissipation layer on the back-side of the package component and on sidewalls of the package component; an adhesive layer on a back-side of the heat dissipation layer, a portion of a sidewall of the heat dissipation layer being free from the adhesive layer; and a package substrate connected to the conductive connectors.

Abstract: A semiconductor device includes a substrate, a package structure, a thermal interface material (TIM) structure, and a lid structure. The package structure is disposed on the substrate. The TIM structure is disposed on the package structure. The TIM structure includes a metallic TIM layer and a non-metallic TIM layer in contact with the metallic TIM layer, and the non-metallic TIM layer surrounds the metallic TIM layer. The lid structure is disposed on the substrate and the TIM structure.

Abstract: A system and method for throttling communications with consumer devices is disclosed. The consumer devices are associated with consumers and consumers are associated with preferred types of electronic correspondence. The system and method transmits to a first set of the consumer devices a first electronic correspondence including a deal from a deal program comprising an offer and an expiration date. The system and method receive responses to the first electronic correspondence and based on the responses and expiration of outstanding offers at the expiration date generates an indicator used to determine to communicate with one or more additional consumers through their consumer devices. The system and method generate additional electronic correspondence of the preferred type and transmit the additional electronic correspondence to the additional consumers. In this way, additional electronic correspondence may be throttled upward or downward.

Abstract: A semiconductor device includes a substrate, a package structure, a thermal interface material (TIM) layer, and a lid structure. The package structure is disposed on the substrate. The TIM layer is disposed on the package structure. The TIM layer includes a liquid state metal material. The lid structure is disposed on the substrate and the TIM layer. The lid structure includes a trench facing the package structure. At least a portion of the TIM layer is located in the trench.

Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

Abstract: A package structure includes a package substrate, a first semiconductor package and a second semiconductor package, an underfill material, a gap filling structure and a heat dissipation structure. The first semiconductor package and the second semiconductor package are electrically bonded to the package substrate. The underfill material is disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate. The gap filling structure is disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package. The heat dissipation structure is disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.

Abstract: Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.

Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.

Abstract: A tracking system for tracking an expanded state of an object is provided. The tracking system comprises at least one processor and a memory having instructions stored thereon that, when executed by the at least one processor, cause the tracking system to execute a probabilistic filter that iteratively tracks a belief on the expanded state of the object, wherein the belief is predicted using a motion model of the object and is further updated using a compound measurement model of the object. The compound measurement model includes multiple probabilistic distributions constrained to lie on a contour of the object with a predetermined relative geometrical mapping to the center of the object. Further, the tracking system tracks the expanded state of the object based on the updated belief on the expanded state.

Abstract: The invention is to provide a hydrogen sulfide sustained releasing dressing and a manufacturing method thereof. The hydrogen sulfide sustained releasing dressing includes a hydrocolloid, a surfactant and sodium hydro sulfide. The manufacturing method includes (a) heating and stirring a hydrocolloid material; (b) adding a surfactant and sodium hydrosulfide into the hydrocolloid material; and (c) injecting the hydrocolloid material containing the surfactant and the sodium hydrosulfide into a mold for thermoforming a hydrogen sulfide sustained releasing dressing.

Abstract: A method of fabricating an integrated fan-out package is provided. A ring-shaped dummy die and a group of integrated circuit dies are mounted over a carrier, wherein the group of integrated circuit dies are surrounded by the ring-shaped dummy die. The ring-shaped dummy die and the group of integrated circuit dies over the carrier are encapsulated with an insulating encapsulation. A redistribution circuit structure is formed on the ring-shaped dummy die, the group of integrated circuit dies and the insulating encapsulation, wherein the redistribution circuit structure is electrically connected to the group of integrated circuit dies, and the ring-shaped dummy die is electrically floating.

Abstract: A package structure includes a circuit substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.

Abstract: A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component, attaching a second thermal interface material different from the first thermal interface material over the second package component, and attaching a heat sink over both of the first thermal interface material and the second thermal interface material.

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

Abstract: A semiconductor structure includes a first semiconductor package, a second semiconductor package, a heat spreader and an underfill layer. The first semiconductor package includes a plurality of lower semiconductor chips and a first dielectric encapsulation layer disposed around the plurality of the lower semiconductor chips. The second semiconductor package is disposed over and corresponds to one of the plurality of lower semiconductor chips, wherein the second semiconductor package includes a plurality of upper semiconductor chips and a second dielectric encapsulation layer disposed around the plurality of upper semiconductor chips. The heat spreader is disposed over and corresponds to another of the plurality of lower semiconductor chips. The underfill layer is disposed over the first semiconductor package and around the second semiconductor package and the heat spreader.

Abstract: The present application belongs to the technical field of solar cells, and relates to a p-type bifacial solar cell with partial rear surface field passivation and a preparation method therefor. The solar cell includes a p-type silicon substrate. At the bottom portion of the p-type silicon substrate are arranged, from top to bottom, a silicon oxide passivation layer, an aluminum oxide passivation layer and a rear side silicon nitride anti-reflection layer. A plurality of boron source-doped layers are embedded in the bottom portion of the p-type silicon substrate. Connected to the bottom of each of the boron source-doped layers is a rear side metal electrode layer, which penetrates each of the silicon oxide passivation layer, the aluminum oxide passivation layer and the rear side silicon nitride anti-reflection layer.