Patents by Inventor Pu Wang

Pu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11804468
    Abstract: A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: October 31, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hao Chen, Chih-Chien Pan, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20230345451
    Abstract: A multi-user scheduling method based on reinforcement learning for 5G IoT, including: calculating the achievable rate of each user in a set according to a communication scenario model; generating an initial scheduled users set according to the achievable rate of each user; according to the achievable rate of each user and the number of times each user is scheduled, evaluating the estimated value of each user's action value under the current scheduling period by using the Q-learning method; determining the upper bound value of the confidence interval of each user's action value; determining the set of scheduled users under the current scheduling period according to the upper bound of the confidence interval of each user's action value; according to the set of scheduled users under the current scheduling period, recalculating the actual achievable rate value of each selected user under the current scheduling period.
    Type: Application
    Filed: January 13, 2023
    Publication date: October 26, 2023
    Applicant: State Grid Jiangsu Electric Power Co., LTD, Nanjing Power Supply Branch
    Inventors: Wendi WANG, Hong ZHU, Pu WANG, Honghua XU, Su PAN, Dongxu ZHOU, Xin QIAN, Zibo LI, Xuanxuan SHI, Junkang WANG, Zhongzhong XU, Jun ZHAO
  • Publication number: 20230319539
    Abstract: A computer-implemented method is provided for discovering heterogenous neighbors in coexisting IoT networks including at least one Wi-Fi device and at least one of Zigbee coordinators, ZigBee routers and ZigBee end devices. The method includes generating a broadcast packet such that the broadcast packet emulates a ZigBee broadcast frame, transmitting the emulated broadcast packet using a transceiver of the at least one Wi-Fi device according to cross-technology communication (CTC) method, wherein the emulated broadcast packet is configured to trigger the at least one of the Zigbee coordinators and ZigBee routers having received the emulated broadcast packet to rebroadcast the received packet.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Inventors: Jianlin Guo, Shuai Wang, Pu Wang, Kieran Parsons, Philip Orlik, Yukimasa Nagai, Takenori Sumi
  • Publication number: 20230317552
    Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.
    Type: Application
    Filed: June 2, 2023
    Publication date: October 5, 2023
    Inventors: Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20230305136
    Abstract: The present disclosure provides a system and a method for detecting and tracking objects. The method includes permuting an order of frames in a sequence of radar image frames to produce multiple permuted sequences with different frames at a dominant position in a corresponding permuted sequence of radar image frames. Each permuted sequence of radar image frames is processed with a first neural network to produce temporally enhanced features for each of the frames in the sequence of radar image frames. Further a feature map is reconstructed from the temporally enhanced features of each of the frames in the sequence of radar image frames to produce a sequence of feature maps. The method further includes processing a list of feature vectors from each feature map with a second neural network to produce temporally enhanced heatmaps.
    Type: Application
    Filed: March 25, 2022
    Publication date: September 28, 2023
    Inventors: Pu Wang, Peizhao Li, Karl Berntorp
  • Publication number: 20230296725
    Abstract: A radar system for tracking an object in a scene by transmitting frequency modulated continuous wave (FMCW) is provided. The radar system is configured to collect radar measurements of the scene sampled in a time-frequency domain within an intermediate frequency (IF) bandwidth to which reflection of the transmitted FMCW is shifted by mixing with a copy of the FMCW, where a frequency dimension of the time-frequency domain is quantized into multiple frequency bins forming the frequency bandwidth, where a time dimension of the time-frequency domain is quantized into multiple time instances forming a time interval corresponding to the PRI, count a number of amplitude peaks of the radar measurements for each frequency bin at different instances of time, identify a number of frequency bins with their counts of the number of peaks above a predetermined threshold, and determine at least a distance to the object based on frequency analysis of the radar measurements.
    Type: Application
    Filed: March 18, 2022
    Publication date: September 21, 2023
    Inventors: Pu Wang, Sian Jin
  • Publication number: 20230290704
    Abstract: A package structure includes first and second package components, an underfill layer disposed between the first and second package components, and a metallic layer. The first package component includes semiconductor dies, a first insulating encapsulation laterally encapsulating the semiconductor dies, and a redistribution structure underlying first surfaces of the semiconductor dies and the first insulating encapsulation. The second package component underlying the first package component is electrically coupled to the semiconductor dies through the redistribution structure. The underfill layer extends to cover a sidewall of the first package component, the metallic layer overlying second surfaces of the semiconductor dies and the first insulating encapsulation, and a peripheral region of the second surface of the first insulating encapsulation is accessibly exposed by the metallic layer, where the first surfaces are opposite to the second surfaces.
    Type: Application
    Filed: March 14, 2022
    Publication date: September 14, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Li-Hui Cheng
  • Publication number: 20230276394
    Abstract: A Bluetooth-enabled device is provided, the Bluetooth-enabled device being configured to control a radio frequency (RF) chain during a first period to receive at a single antenna selected from a plurality of antennas, a constant tone extension (CTE) signal of multiple frames transmitted by the Bluetooth-enabled transmitter over multiple frequencies. Further the RF chain is controlled during a second period to switch among the plurality of antennas to receive the CTE signal at each of the plurality of antennas. An initial time-of-flight (ToF) data of the CTE signal is determined from first samples of the CTE signal received during the first period. Further, the Bluetooth-enabled transmitter is localized with respect to a location of the Bluetooth-enabled device using a signal model connecting samples of the CTE signal with an unknown angle-of-arrival of the CTE signal received at specific times, an unknown ToF conditioned on the initial ToF data.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Applicant: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Pu Wang, Jianyuan Yu, Toshiaki Koike-Akino, Philip Orlik
  • Patent number: 11742323
    Abstract: A semiconductor structure includes a first semiconductor package, a second semiconductor package, a heat spreader and an underfill layer. The first semiconductor package includes a plurality of lower semiconductor chips and a first dielectric encapsulation layer disposed around the plurality of the lower semiconductor chips. The second semiconductor package is disposed over and corresponds to one of the plurality of lower semiconductor chips, wherein the second semiconductor package includes a plurality of upper semiconductor chips and a second dielectric encapsulation layer disposed around the plurality of upper semiconductor chips. The heat spreader is disposed over and corresponds to another of the plurality of lower semiconductor chips. The underfill layer is disposed over the first semiconductor package and around the second semiconductor package and the heat spreader.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: August 29, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Pu Wang, Li-Hui Cheng, An-Jhih Su, Szu-Wei Lu
  • Publication number: 20230259091
    Abstract: Systems, apparatuses, methods, and computer program products are disclosed for disaggregating seasonal load from overall electricity consumption. An example method includes receiving, by a disaggregation system, historical data comprising (i) historical daily load data for a residence for a particular time period and (ii) an average temperature at the residence for each day in the particular time period. The example method further includes fitting, by the disaggregation system, a data model to the historical data, and calculating, by the disaggregation system and using the data model, an estimated seasonal load for a target time period. The example method further includes causing, by the disaggregation system, one or more notifications to be provided based on the estimated seasonal load for the target time period. Corresponding apparatuses and computer program products are also disclosed.
    Type: Application
    Filed: February 14, 2023
    Publication date: August 17, 2023
    Inventors: Pu Wang, Xihui Dong
  • Patent number: 11705381
    Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: July 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 11666224
    Abstract: A lesion detection system for use with a patient, comprising an optoacoustic guide wire assembly configured to be insertable into a patient's tissue. The optical acoustic guide wire assembly can be comprised of an optical waveguide have a first end and a second end, a light source coupled to the second end of the optical waveguide, wherein said light source configured to emit energy to the patient's tissue, at least one transducer configured to detect an ultrasound signal emitted from the patient's tissue in response to energy emitted from the light source, and a computer system.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: June 6, 2023
    Assignee: PURDUE RESEARCH FOUNDATION
    Inventors: Ji-xin Cheng, Pu Wang, Lu Lan, Yan Xia, Ke Huo
  • Publication number: 20230146692
    Abstract: A PERC solar cell selective emitter includes a silicon wafer, first and second doped regions and a laser doped region with doped layers. First doped regions are located between the doped regions of each doped layer, and each second doped region is located between two adjacent doped layers. The PERC solar cell includes the selective emitter, a front anti-reflective layer on the surface of a front passivation layer, and a positive electrode. The positive electrode includes first silver paste layers on the surfaces of the laser doped regions and second silver paste layers on the surface of the front anti-reflective layer corresponding to the first doped regions. The second silver paste layers are in electrical contact with the first silver paste layers. Damage of laser to silicon wafers is reduced, compounding in silver paste areas is reduced, an open circuit voltage is increased, and battery efficiency is improved.
    Type: Application
    Filed: December 23, 2021
    Publication date: May 11, 2023
    Applicant: TONGWEI SOLAR (CHENGDU) CO., LTD.
    Inventors: Shan SUI, Yu HE, Lan WANG, Zhongyong LI, Rong SU, Pu WANG, Yi XIE
  • Publication number: 20230135987
    Abstract: A tracking system for tracking an expanded state of an object is provided. The tracking system executes, for a predetermined time period, a probabilistic filter that iteratively tracks a belief on the expanded state of the object, wherein the belief is predicted using a motion model of the object and is further updated using a compound measurement model of the object. After the predetermined time period, the updated beliefs are smoothed to generate a state-decoupled online batch of training data. The compound measurement model includes multiple probabilistic distributions constrained to lie around a contour of the object with a predetermined relative geometrical mapping to the center of the object. The compound measurement model is updated using the online batch of training data. Further, the tracking system tracks the expanded state of the object based on the updated compound measurement model.
    Type: Application
    Filed: October 28, 2021
    Publication date: May 4, 2023
    Applicant: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Pu Wang, Gang Yao, Karl Berntorp, Hassan Mansour, Petros Boufounos, Philip Orlik
  • Patent number: 11619494
    Abstract: A system and a method for tracking an expanded state of an object including a kinematic state indicative of a position of the object and an extended state indicative of one or combination of a dimension and an orientation of the object is provided herein. The system comprises at least one sensor configured to probe a scene including a moving object with one or multiple signal transmissions to produce one or multiple measurements of the object per the transmission, and a processor configured to execute a probabilistic filter tracking a joint probability of the expanded state of the object estimated by a motion model of the object and a measurement model of the object, wherein the measurement model includes a center-truncated distribution having truncation intervals. The system further comprises an output interface configured to output the expanded state of the object.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: April 4, 2023
    Inventors: Pu Wang, Yuxuan Xia, Karl Berntorp, Toshiaki Koike-Akino, Hassan Mansour, Petros Boufounos, Philip Orlik
  • Publication number: 20230092749
    Abstract: Systems and methods are provided for multi-spectral or hyper-spectral fluorescence imaging. In one example, a spectral encoding device may be positioned in a detection light path between a detection objective and an imaging sensor of a microscope. In one example, the spectral encoding device includes a first dichroic mirror having a sine transmittance profile and a second dichroic mirror having a cosine transmittance profile. In addition to collecting transmitted light, reflected light from each dichroic mirror is collected and used for total intensity normalization and image analysis.
    Type: Application
    Filed: March 12, 2021
    Publication date: March 23, 2023
    Applicant: University of Southern California
    Inventors: Francesco Cutrale, Pu Wang, Scott E. Fraser
  • Publication number: 20230092361
    Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.
    Type: Application
    Filed: November 28, 2022
    Publication date: March 23, 2023
    Inventors: Chih-Wei Wu, Ying-Ching Shih, Kung-Chen Yeh, Li-Chung Kuo, Pu Wang, Szu-Wei Lu
  • Publication number: 20230075735
    Abstract: A package structure includes a package substrate, a first semiconductor package and a second semiconductor package, an underfill material, a gap filling structure and a heat dissipation structure. The first semiconductor package and the second semiconductor package are electrically bonded to the package substrate. The underfill material is disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate. The gap filling structure is disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package. The heat dissipation structure is disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.
    Type: Application
    Filed: November 11, 2022
    Publication date: March 9, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pu Wang, Li-Hui Cheng, Szu-Wei Lu, Tsung-Fu Tsai
  • Publication number: 20230065884
    Abstract: A package structure includes a first semiconductor die, a first insulating encapsulation, a thermal coupling structure, and a heat dissipating component thermally coupled to the first semiconductor die through the thermal coupling structure. The first semiconductor die includes an active side, a rear side, and a sidewall connected to the active side and the rear side. The first insulating encapsulation extends along the sidewall of the first semiconductor die and includes a first side substantially leveled with the active side, a second side opposite to the first side, and topographic features at the second side. The thermal coupling structure includes a metallic layer overlying and the rear side of the first semiconductor die and the topographic features of the first insulating encapsulation. A manufacturing method of a package structure is also provided.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20230067933
    Abstract: A computer-executed method is provided for IEEE 802.15.4 devices based on an active carrier sense based carrier-sense multiple access with collision avoidance (ACS-CSMA/CA) control program and standard CSMA/CA control program for coexistence of an IEEE 802.15.4 network composing of IEEE 802.15.4 devices and IEEE 802.11 network composing of IEEE 802.11 devices sharing frequency spectra between the networks. The computer-executed method is provided on an IEEE 802.15.4 device, and causes a processor of the IEEE 802.15.4 device to perform steps that include estimating a severity of IEEE 802.11 interference based on a severity estimation metric, selecting the ACS-CSMA/CA control program based on the estimated severity.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 2, 2023
    Applicants: Mitsubishi Electric Research Laboratories, Inc., Mitsubishi Electric Corporation
    Inventors: Jianlin Guo, Philip Orlik, Yukimasa Nagai, Takenori Sumi, Pu Wang, Kieran Parsons