Abstract: A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided.

Abstract: The present disclosure presents blockchain-based cyber security management systems and related methods. One such method comprises obtaining cyber intelligence input data from a cyber defender computing device, wherein the cyber defender computing device manages network security of a network, wherein the cyber intelligence input data identifies a cyber attacker or a victim of a cyber attack on the network; executing one or more Cyber Security Management (CSM) functions with the cyber intelligence input data received from the cyber defender computing device and cyber data stored in the blockchain ledger, wherein the cyber data stored in the blockchain ledger provides details on a cyber attack on a network that is managed by another cyber defender computing device; and outputting an alert to the cyber defender computing device with a potential cyber attacker or potential victim of the cyber attack on the network managed by the cyber defender computing device.

Abstract: A display assembly and a display apparatus. The display assembly comprises a display panel, a first flexible circuit board and a fingerprint sensor, wherein the first flexible circuit board is connected to the display panel in a binding manner and is positioned on the side of the display panel that faces away from a display surface; a display signal line coupled to the display panel is arranged on the first flexible circuit board; the fingerprint sensor is fixed on the side of the first flexible circuit board that is close to the display panel, and a light-sensitive surface of the fingerprint sensor is close to the display panel; and at least some sections of at least some fingerprint identification signal lines in fingerprint identification signal lines connected to the fingerprint sensor are arranged on the first flexible circuit board.

Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes conductive materials located in different levels of the apparatus, dielectric materials located in different levels of the apparatus, a first conductive contact, and a second conductive contact. One of the conductive materials is between two of the dielectric materials. One of the dielectric materials is between two of the conductive materials. The first conductive contact has a length extending through the conductive materials and the dielectric materials in a direction perpendicular to the levels of the apparatus. The first conductive contact is electrically separated from the conductive materials. The second conductive contact contacts a group of conductive materials of the conductive materials.

Abstract: Methods and systems for high-resolution image manipulation are disclosed. An original high-resolution image to be manipulated is obtained, as well as a driving signal indicating a manipulation result. The original high-resolution image is down-sampled to obtain a low-resolution image to be manipulated. Using a trained manipulation generator, a low-resolution manipulated image and a motion field are generated from the low-resolution image. The motion field represent pixel displacements of the low-resolution image to obtain the manipulation indicated by the driving signal. A high-frequency residual image is computed from the original high-resolution image. A high-frequency manipulated residual image is generated using the motion field. A high-resolution manipulated image is outputted by combining the high-frequency manipulated residual image and a low-frequency manipulated image generated from the low-resolution manipulated image by up-sampling.

Abstract: This disclosure provides a flexible circuit board and a manufacturing method therefor, and a display device. The flexible circuit board includes a main body sub-circuit board and a bridge sub-circuit board. The main body sub-circuit board includes a first substrate, as well as a first bridge connection end, a second bridge connection end, a first wiring portion, and a second wiring portion disposed on the first substrate. The bridge sub-circuit board includes a second substrate, as well as a third bridge connection end, a fourth bridge connection end, and a third wiring portion used for a first functional wiring, all disposed on the second substrate.

Abstract: A memory device includes a first substrate, a first memory array, a second substrate, and at least one first vertical transistor. The first memory array is disposed on the first substrate. The first memory array includes at least one first word line structure. The first memory array is disposed between the first substrate and the second substrate in a vertical direction. The first vertical transistor is electrically connected with the first word line structure. At least a part of the at least one first vertical transistor is disposed in the second substrate.

Abstract: A method of peak power management (PPM) is provided for two NAND memory dies. each NAND memory die comprises a PPM circuit having a PPM contact pad held at an electric potential common between the two NAND memory dies. The method includes the following steps: detecting the electric potential during a first peak power check (PPC) routine for the first NAND memory die; driving the electric potential to a second voltage level if the detected electric potential is at a first voltage level higher than the second voltage level; generating a pausing signal in the electric potential to pause a second PPC routine for the second NAND memory die if no pausing signal is detected; and generating a resuming signal in the electric potential to resume the second PPC routine for the second NAND memory die after the first NAND memory die completes a first peak power operation.

Abstract: The present disclosure provides a foldable support, and a display device. The foldable support includes at least two metal layers, where at least one of the at least two metal layers is provided with a plurality of recessed portions at the at least one bending region; and a buffer structure located at at least one of the following positions: a position between two adjacent metal layers and a position in a plurality of the recessed portions of the at least one of the at least two metal layers.

Abstract: Methods of operating a memory, and memories having a controller configured to cause the memory to perform such methods, include applying a plurality of first voltage levels to an access line, applying a plurality of second voltage levels to a control gate of a string driver connected to the access line for a first portion of the plurality of first voltage levels with each second voltage level of the plurality of second voltage levels being greater than a respective first voltage level by a first voltage differential, and applying a plurality of third voltage levels to the control gate of the string driver for a second portion of the plurality of first voltage levels with each third voltage level of the plurality of third voltage levels being greater than a respective first voltage level by a second voltage differential less than the first voltage differential.

Abstract: Provided is a display device, including a display screen, a transparent cover plate and a first light-shielding structure, wherein the display screen includes a display panel, a transparent bonding layer, a touch structure and a second light-shielding structure, and the display screen is provided with a through hole penetrating through the display panel, the transparent bonding layer and the touch structure. The first light-shielding structure is disposed on the transparent cover plate and surrounds the through hole, the second light-shielding structure is disposed on the touch structure and surrounds the through hole, and orthographic projections of both the first and second light-shielding structures onto the display panel are within the non-display region.

Abstract: This disclosure provides a flexible circuit board and a manufacturing method therefor, and a display device. The flexible circuit board includes a main body sub-circuit board and a bridge sub-circuit board; The main body sub-circuit board includes a first substrate, as well as a first bridge connection end, a second bridge connection end, a first wiring portion, and a second wiring portion disposed on the first substrate The bridge sub-circuit board includes a second substrate, as well as a third bridge connection end, a fourth bridge connection end, and a third wiring portion used for a first functional wiring, all disposed on the second substrate.

Abstract: Methods and systems for high-resolution image inpainting are disclosed. An original high-resolution image to be inpainted is obtained, as well as an inpainting mask indicating an inside-mask area to be inpainted. The original high-resolution image is down-sampled to obtain a low-resolution image to be inpainted. Using a trained inpainting generator, a low-resolution inpainted image and a set of attention scores are generated from the low-resolution image. The attention scores represent the similarity between inside-mask regions and outside-mask regions. A high-frequency residual image is computed from the original high-resolution image. An aggregated high-frequency residual image is generated using the attention scores, including high-frequency residual information for the inside-mask area. A high-resolution inpainted image is outputted by combining the aggregated high-frequency residual image and a low-frequency inpainted image generated from the low-resolution inpainted image.

Abstract: Memory including an array of memory cells might include an input buffer having calibration circuitry, a first input, a second input, and an output; and calibration logic having an input selectively connected to the output of the input buffer and comprising an output connected to the calibration circuitry, wherein the calibration logic is configured to cause the memory to determine whether the input buffer exhibits offset while a particular voltage level is applied to the first and second inputs of the input buffer, and, in response to determining that the selected input buffer exhibits offset, apply an adjustment to the calibration circuitry while the particular voltage level is applied to the first and second inputs until a logic level of the output of the selected input buffer transitions.

Abstract: A method of peak power management (PPM) for a storage system with multiple memory dies is provided, where each of the multiple memory dies includes a PPM circuit having a PPM contact pad and PPM contact pads of the multiple memory dies are electrically connected. The PPM method includes the following steps: switching on a pull-down driver of the PPM circuit on a selected memory die of the storage system; verifying a PPM enablement signal regulated by a pull-down current flowing through the pull-down driver; and performing a peak power operation on the selected memory die when the PPM enablement signal indicates that a total current of the storage system is less than a maximum total current allowed for the storage system.

Abstract: A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided.

Abstract: The present disclosure provides a display apparatus, a display panel of which includes a panel chip; a second bonding region of a main circuit board is provided with second display terminals coupled with first display terminals and second touch control terminals coupled with first touch control terminals; each of segment touch control lines includes a first segment coupled between one second touch control terminal and one main connector in a first region, and a segment coupled between a touch control chip and one main connector in a second region; a third region and a fourth region of a jumper connection circuit board are bonded with the first region and the second region respectively; the segment touch control lines are in one-to-one correspondence with jumper connection lines, each jumper connection line is coupled between one jumper connector in the third region and one jumper connector in the fourth region.

Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes conductive materials located in different levels of the apparatus, dielectric materials located in different levels of the apparatus, a first conductive contact, and a second conductive contact. One of the conductive materials is between two of the dielectric materials. One of the dielectric materials is between two of the conductive materials. The first conductive contact has a length extending through the conductive materials and the dielectric materials in a direction perpendicular to the levels of the apparatus. The first conductive contact is electrically separated from the conductive materials. The second conductive contact contacts a group of conductive materials of the conductive materials.

Abstract: Provided are a supporting backplane and a display apparatus. The supporting backplane is arranged at one side of a flexible display panel, and the supporting backplane at least comprises a main bending area, wherein a bending axis corresponding to the main bending area extends in a first direction; the main bending area is provided with a plurality of first hollow holes, the plurality of first hollow holes being arranged in an array in the first direction and a second direction, which is orthogonal to the first direction; each of the first hollow holes is provided with a first middle hole area, and first arc-shaped hole areas located at two sides of the first middle hole area in the first direction.

Abstract: The display device includes a display panel, a fingerprint identification module, a fingerprint identification flexible circuit board, and a frame sealant, wherein the fingerprint identification module is disposed on a non-display side of the display panel, the fingerprint identification module includes a fingerprint identification region and a peripheral region surrounding the fingerprint identification region; the frame sealant is at least partially disposed between the display panel and the peripheral region of the fingerprint identification module; and wherein at least one opening is provided on a side of an orthographic projection of the frame sealant on the display panel proximal to the fingerprint identification flexible circuit board, and the at least one opening being at least partially overlapped with an orthographic projection of the fingerprint identification flexible circuit board on the display panel.