Patents by Inventor Rahul Jain

Rahul Jain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230343723
    Abstract: Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die. In an embodiment, the IHS comprises a main body having an outer perimeter, and one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate. In an embodiment, the electronic package further comprises a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.
    Type: Application
    Filed: June 29, 2023
    Publication date: October 26, 2023
    Inventors: Nicholas NEAL, Nicholas S. HAEHN, Sergio CHAN ARGUEDAS, Edvin CETEGEN, Jacob VEHONSKY, Steve S. CHO, Rahul JAIN, Antariksh Rao Pratap SINGH, Tarek A. IBRAHIM, Thomas HEATON
  • Publication number: 20230333775
    Abstract: Aspects of a storage device are provided that handle pairing and atomic processing of fused commands received from submission queues based on data structures such as a linked lists which the controller respectively associates with each submission queue. A memory of the storage device includes a plurality of data structures each associated with a different submission queue. A controller of the storage device receives a first command for a fused operation from a submission queue, stores the first command in a data structure, receives a second command for the fused operation from the submission queue, determines whether the second command corresponds to the fused operation, stores the second command in the data structure in response to the determination, and performs the fused operation in response to storing the second command. As a result, fused command handling may be achieved with minimal impact to queue arbitration logic and command latency.
    Type: Application
    Filed: April 13, 2022
    Publication date: October 19, 2023
    Inventors: Rahul JAIN, Arvind Kumar V M
  • Patent number: 11776864
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment an electronic package comprises a package substrate, and a first level interconnect (FLI) bump region on the package substrate. In an embodiment, the FLI bump region comprises a plurality of pads, and a plurality of bumps, where each bump is over a different one of the plurality of pads. In an embodiment, the electronic package further comprises a guard feature adjacent to the FLI bump region. In an embodiment, the guard feature comprises, a guard pad, and a guard bump over the guard pad, wherein the guard feature is electrically isolated from circuitry of the electronic package.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: October 3, 2023
    Assignee: Intel Corporation
    Inventors: Jacob Vehonsky, Nicholas S. Haehn, Thomas Heaton, Steve S. Cho, Rahul Jain, Tarek Ibrahim, Antariksh Rao Pratap Singh, Edvin Cetegen, Nicholas Neal, Sergio Chan Arguedas
  • Patent number: 11770292
    Abstract: A cloud extension agent can be provided on a customer premise for interfacing, via an outbound secure connection, cloud based services.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: September 26, 2023
    Assignee: Snowflake Inc.
    Inventors: Vineeth Narasimhan, Joshua Lambert, Thomas Herchek, Ryan Elliot Hope, Nitish Jha, Rahul Jain, Sumeet Singh
  • Patent number: 11768753
    Abstract: Methods, systems, and computer-readable media are disclosed herein for a concurrent comparative tool for assessing multiple versions of a data model in a pre-deployment environment to ensure that any subsequently deployed version will perform than a current version of the data model. In aspects, the tool extracts observed and predictive data for various versions and comparatively evaluates the performance measures of each version. The performance measures can be validated across the versions to determine and select a leading version that has demonstrated improve technological performance and predictive accuracy. The leading version can be deployed.
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: September 26, 2023
    Assignee: Cerner Innovation, Inc.
    Inventors: James Gritter, Ashwin Chhetri, Rahul Jain V, Uttam Ramamurthy, Pankaj Saxena
  • Publication number: 20230290545
    Abstract: A switch assembly including a switch and an interface physically coupled to the switch and configured to be physically coupled to an electrical component, such as a transformer. The switch assembly also includes an interface having electrical hardware electrically coupled to the switch and configured to be electrically coupled to the component. The switch assembly further includes a surge arrester having an insulation member, a grounding jacket formed over a portion of the insulation member and a conductor extending through the insulation member and being electrically coupled to the hardware and the grounding jacket. The interface further includes a releasable connector that is electrically coupled to the conductor and allows the surge arrester to be disconnected from the interface.
    Type: Application
    Filed: February 24, 2023
    Publication date: September 14, 2023
    Applicant: S&C Electric Company
    Inventors: Thomas S. Kelley, Mark Francis Muir, Andrew B. Berman, Xin Guo Zhu, Rahul Jain
  • Publication number: 20230277807
    Abstract: The microcatheter may include an elongated shaft having a distal end and a proximal end. The elongated shaft may include an outer layer which may be formed from a polymer, a middle layer which may be formed of a braid having a plurality of strands having four filaments each, wherein the four filaments may be a round metal with an outer diameter of less than 0.0009”. The braid may achieve at least a 70% surface area coverage. The elongated shaft may include an inner layer which may be formed from a polymer, and a distal polymeric tip which may be attached to the distal end of the elongated shaft.
    Type: Application
    Filed: March 6, 2023
    Publication date: September 7, 2023
    Applicant: Boston Scientific Medical Device Limited
    Inventors: ANSHUL CHABRA, JAHNAVI KONDURU, RAHUL JAIN, RUPESH KUMAR PAHWA, SHUBHAM AGRAWAL
  • Patent number: 11750452
    Abstract: A cloud extension agent can be provided on a customer premise for interfacing, via an outbound secure connection, cloud based services.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: September 5, 2023
    Assignee: Snowflake Inc.
    Inventors: Vineeth Narasimhan, Joshua Lambert, Thomas Herchek, Ryan Elliot Hope, Nitish Jha, Rahul Jain, Sumeet Singh
  • Publication number: 20230275947
    Abstract: A system may include a memory and a processor in communication with the memory. The processor may be configured to perform operations. The operations may include extracting a first multiple dimensional dataset and a second multiple dimensional dataset and encoding the first multiple dimensional dataset into a first encoded dataset and the second multiple dimensional dataset into a second encoded dataset. The operations may include combining the first encoded dataset and the second encoded dataset into a combined encoded dataset and conveying the combined encoded dataset to a user.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Inventors: Manjit Singh Sodhi, Rahul Jain, Shashank Mujumdar, Nitin Gupta, Prerna Agarwal
  • Patent number: 11736346
    Abstract: A method of monitoring status information of devices is described. The method includes establishing a first connection to a hardware resource executing a cloud extension agent on a local network, over a wide area network external from the local network and separated by at least one firewall, using a standard internet protocol. The method further includes sending, via the first connection, a first set of instructions to manage a first set of mobile devices by one or more local servers on the local network; and receiving status information via the secure network connection, wherein the status information is from the one or more local servers on the local network associated with a plurality of devices that access the one or more local servers.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: August 22, 2023
    Assignee: Snowflake Inc.
    Inventors: Vineeth Narasimhan, Joshua Lambert, Thomas Herchek, Ryan Elliot Hope, Nitish Jha, Rahul Jain, Sumeet Singh
  • Patent number: 11735537
    Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: August 22, 2023
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Kyu-Oh Lee, Junnan Zhao, Rahul Jain, Ji Yong Park, Sai Vadlamani, Seo Young Kim
  • Patent number: 11737208
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface, wherein the substrate layer includes a photo-imageable dielectric (PID) and an electroless catalyst; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the first thickness is greater than the second thickness.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: August 22, 2023
    Assignee: Intel Corporation
    Inventors: Brandon C. Marin, Andrew James Brown, Rahul Jain, Dilan Seneviratne, Praneeth Kumar Akkinepally, Frank Truong
  • Patent number: 11736345
    Abstract: A cloud extension agent can be provided on a customer premise for interfacing, via an outbound secure connection, cloud based services. The cloud extension agent can reach the cloud based services through existing firewall infrastructure, thereby providing simple, secure deployment. Furthermore, the secure connection can enable substantially real-time communication with a cloud service to provide web-based, substantially real time control or management of resources on the customer premises via the cloud extension agent.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: August 22, 2023
    Assignee: Snowflake Inc.
    Inventors: Vineeth Narasimhan, Joshua Lambert, Thomas Herchek, Ryan Elliot Hope, Nitish Jha, Rahul Jain, Sumeet Singh
  • Publication number: 20230245940
    Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: April 12, 2023
    Publication date: August 3, 2023
    Applicant: Intel Corporation
    Inventors: Rahul JAIN, Kyu Oh LEE, Siddharth K. ALUR, Wei-Lun K. JEN, Vipul V. MEHTA, Ashish DHALL, Sri Chaitra J. CHAVALI, Rahul N. MANEPALLI, Amruthavalli P. ALUR, Sai VADLAMANI
  • Publication number: 20230205665
    Abstract: Methods, systems, and computer-readable media are disclosed herein for a concurrent comparative tool for assessing multiple versions of a data model in a pre-deployment environment to ensure that any subsequently deployed version will perform than a current version of the data model. In aspects, the tool extracts observed and predictive data for various versions and comparatively evaluates the performance measures of each version. The performance measures can be validated across the versions to determine and select a leading version that has demonstrated improve technological performance and predictive accuracy. The leading version can be deployed.
    Type: Application
    Filed: July 11, 2022
    Publication date: June 29, 2023
    Inventors: James Gritter, Ashwin Chhetri, Rahul Jain V, Uttam Ramamurthy, Pankaj Saxena
  • Publication number: 20230206117
    Abstract: Methods, systems, and computer-readable media are disclosed herein for a concurrent comparative tool for aggregating computationally generated performance reports a machine-learning data model pipeline for technological performance and/or predictive accuracy. The tool may acquire multiple performance measure reports that that quantitatively asses the performance of a model pipeline based on a configuration file that facilitates validation of the technological performance and predictive accuracy of the model. Additionally, when the conditions defined by the configuration file are met for of the performance measure reports the tool may broadcast a notification to a predetermined system.
    Type: Application
    Filed: July 11, 2022
    Publication date: June 29, 2023
    Inventors: Uttam RAMAMURTHY, Ashwin Chhetri, Pankaj Saxena, Rahul Jain V
  • Publication number: 20230205668
    Abstract: Methods, systems, and computer-readable media are disclosed herein for a concurrent comparative tool for assessing sub-models of a data model pipeline in a deployed or pre-deployment environment. The tool may compute a plurality of performance measures that quantitatively asses the performance of each sub-model in the data model pipeline based on a configuration file that facilitates validation of the technological performance and predictive accuracy of the sub-model. Additionally, multiple versions of a sub-model deployed in similar data model pipelines, or in a pre-deployment environment, may be comparatively evaluated. A leading version of the sub-model may be identified and deployed.
    Type: Application
    Filed: July 11, 2022
    Publication date: June 29, 2023
    Inventors: Uttam RAMAMURTHY, Ashwin Chhetri, Pankaj Saxena, Rahul Jain V
  • Patent number: 11676051
    Abstract: A method, system, and computer program product for simulating potential consequences and possible solutions due to a release of stored energy using augmented reality. The method may include aggregating IoT feeds from devices in a surrounding area. The method may also include calculating amounts of stored energy in the surrounding area based on the IoT feeds. The method may also include predicting contextual situations that could result due to a release of the stored energy in the surrounding area. The method may also include determining one or more consequences for each of the contextual situations. The method may also include calculating a degree of severity of the one or more consequences for each contextual situation. The method may also include determining one or more proposed solutions based on the degree of severity. The method may also include transmitting a recommendation of at least one proposed solution for implementation.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: June 13, 2023
    Assignee: International Business Machines Corporation
    Inventors: Manjit Singh Sodhi, Sarbajit K. Rakshit, Rahul Jain, Raghuveer Prasad Nagar
  • Publication number: 20230171193
    Abstract: Example methods and systems are provided a network device to perform tunnel-based service insertion in a public cloud environment. An example method may comprise establishing a tunnel between the network device and a service path. The method may also comprise: in response to receiving a first encapsulated packet, identifying the service path specified by a service insertion rule; generating and sending a second encapsulated packet over the tunnel to cause the service path to process an inner packet according to one or more services. The method may further comprise: in response to receiving, from the service path via the tunnel, a third encapsulated packet that includes the inner packet processed by the service path, sending the inner packet processed by the service path, or a fourth encapsulated packet, towards a destination address of the inner packet.
    Type: Application
    Filed: January 30, 2023
    Publication date: June 1, 2023
    Inventors: Rahul Jain, Kantesh Mundaragi, Pierluigi Rolando, Jayant Jain, Mukesh Hira
  • Patent number: 11664290
    Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 30, 2023
    Assignee: Intel Corporation
    Inventors: Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun K. Jen, Vipul V. Mehta, Ashish Dhall, Sri Chaitra J. Chavali, Rahul N. Manepalli, Amruthavalli P. Alur, Sai Vadlamani