Abstract: A method, system, and computer program product for simulating potential consequences and possible solutions due to a release of stored energy using augmented reality. The method may include aggregating IoT feeds from devices in a surrounding area. The method may also include calculating amounts of stored energy in the surrounding area based on the IoT feeds. The method may also include predicting contextual situations that could result due to a release of the stored energy in the surrounding area. The method may also include determining one or more consequences for each of the contextual situations. The method may also include calculating a degree of severity of the one or more consequences for each contextual situation. The method may also include determining one or more proposed solutions based on the degree of severity. The method may also include transmitting a recommendation of at least one proposed solution for implementation.

Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.

Abstract: A cloud extension agent can be provided on a customer premise for interfacing, via an outbound secure connection, cloud based services.

Abstract: Methods and systems for generating a plurality of matching items that match a reference item are disclosed. The method includes first determining reference attribute data for the reference item, where the reference attribute data is multimodal. Next, selecting a deep learning multimodal matching model from a plurality of candidate multimodal matching models. The selected deep learning multimodal matching model has a first deep learning neural network (DLNN) for processing data having a first data mode and a second DLNN analyzer for processing data having a second data mode. Then, matching a potential matching item to the reference item using the selected deep learning multimodal matching model to generate a match score, where the match score is computed based on the reference attribute data for the reference item and attribute data for the potential matching item. Finally, adding the potential matching item to the plurality of matching items based on the match score.

Abstract: A coreless semiconductor package comprises a plurality of horizontal layers of dielectric material. A magnetic inductor is situated at least partly in a first group of the plurality of layers. A plated laser stop is formed to protect the magnetic inductor against subsequent acidic processes. An EMIB is situated above the magnetic inductor within a second group of the plurality of layers. Vias and interconnections are configured within the horizontal layers to connect a die of the EMIB to other circuitry. A first level interconnect is formed on the top side of the package to connect to the interconnections. BGA pockets and BGA pads are formed on the bottom side of the package. In a second embodiment a polymer film is used as additional protection against subsequent acidic processes. The magnetic inductor comprises a plurality of copper traces encapsulated in magnetic material.

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: Some embodiments provide a centralized overlay-network cloud gateway and a set of centralized services in a transit virtual private cloud (VPC) connected to multiple other compute VPCs hosting compute nodes (VMs, containers, etc.) that are part of (belong to) the overlay network. The centralized overlay-network cloud gateway provides connectivity between compute nodes of the overlay network (e.g., a logical network spanning multiple VPCs) and compute nodes in external networks. Some embodiments use the centralized overlay-network cloud gateway to provide transitive routing (e.g., routing through a transit VPC) in the absence of direct peering between source and destination VPCs. The overlay network, of some embodiments, uses the same subnetting and default gateway address for each compute node as the cloud provider network provided by the virtual private cloud provider.

Abstract: A system and method for connecting virtual computer networks in a public cloud computing environment using a transit virtual computer network uses a cloud gateway device in the transit virtual computer network that includes a first-tier logical router and a plurality of second-tier logical routers connected to the virtual computer networks. A source Internet Protocol (IP) address of outgoing data packets from a particular virtual computer network is translated at a particular second-tier logical router of the cloud gateway device from an IP address of the particular virtual computer network to an internal IP address from a particular pool of IP addresses. The outgoing data packets are then routed to the first-tier logical router of the cloud gateway device, where the outgoing data packets are transmitted a destination network from a particular interface of the first-tier logical router of the cloud gateway device.

Abstract: A cloud extension agent can be provided on a customer premise for interfacing, via an outbound secure connection, cloud based services.

Abstract: A software upgrade to be deployed by a cloud extension agent is received by a remote network management platform, the cloud extension agent running locally on a network and initiating an outbound connection to the remote network management platform through a firewall of the network. A command is generated for the software upgrade, the command comprising an identification of a source of the software upgrade. The command is provided to the cloud extension agent, wherein providing the command causes the cloud extension agent to acquire the software upgrade from the identified source and deploy the software upgrade.

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.

Abstract: A computerized method for implementing an optimal supply chain configuration includes the step of implementing an optimal supply chain configuration for a business. The method includes the step of modelling costs for minimization in an optimal supply chain configuration. The method includes the step of modelling constraints in an optimal supply chain configuration. The method includes the step of, based on the modelled cost for minimization and the modelled constraints, optimizing a supply chain for the business.

Abstract: Various aspects include methods for Transmission Control Protocol (TCP)/Internet Protocol (IP) (TCP/IP) packet transmission and compression of headers for TCP/IP packet transmission. Various embodiments may include a packet data convergence protocol (PDCP) layer of a processing device applying least significant bit (LSB) encoding to a TCP Timestamp (TS) option of a TCP/IP packet using an offset parameter of zero to generate a compressed header in response to determining that a TCP TS field of the TCP/IP packet and a TCP TS field of a last TCP/IP packet transmitted have a same value. In some embodiments, a Timestamp Value (TSVal) field or a Timestamp Echo Reply (TSEcho) field of the TCP TS option of the compressed header may have a size of one byte.

Abstract: An example operation may include one or more of identifying, via a cognitive system, that a change in a creditworthiness attribute of a cardholder has occurred with respect to a previous creditworthiness of the cardholder, in response to identifying the change in the creditworthiness attribute of the cardholder, dynamically determining a custom interchange value for the cardholder to be used in payment transactions based on a current credit data of the cardholder, transmitting the dynamically determined custom interchange value for the cardholder to one or more blockchain peer nodes, and storing the dynamically determined custom interchange value in a hash-linked chain of blocks via a distributed ledger.

Abstract: A computer-implemented method implemented by an AI onboarding system for performing trading partner onboarding. The method performs artificial intelligence (AI) training to learn onboarding information requirements. The method submits a transaction proposal to a blockchain business network (BBN) for obtaining a new business trading partner that requires trading partner onboarding. The method sends a business trading partner survey to the new business trading partner. The method monitors for queries regarding the business trading partner survey from the new business trading partner. The method provides responses to the queries based on the AI training. The method verifies using the AI training that the business trading partner survey is completed correctly by the new business trading partner.

Abstract: Example methods and systems are provided a network device to perform tunnel-based service insertion in a public cloud environment. An example method may comprise establishing a tunnel between the network device and a service path. The method may also comprise: in response to receiving a first encapsulated packet, identifying the service path specified by a service insertion rule; generating and sending a second encapsulated packet over the tunnel to cause the service path to process an inner packet according to one or more services. The method may further comprise: in response to receiving, from the service path via the tunnel, a third encapsulated packet that includes the inner packet processed by the service path, sending the inner packet processed by the service path, or a fourth encapsulated packet, towards a destination address of the inner packet.

Abstract: Example methods and computer systems are provided for east-west service insertion in a public cloud environment. An example method may comprise detecting an egress packet that is destined for a second endpoint located in the same virtual network as a first endpoint. The method may also comprise: in response to determination that service insertion is required, identifying a service path based on a service insertion rule; generating an encapsulated packet by encapsulating the egress packet with an outer header that is addressed from the first endpoint to a network device; and sending the encapsulated packet to cause the network device to send the egress packet towards the service path, thereby steering the egress packet towards the service path for processing.

Abstract: A system for analyzing a video file in a shortened time frame, said system comprising: a receiver (VFR) to receive a video file (VF) as an input; a Time Splitter (TR) to split the received video file according to set intervals of time depending on how fast said video is to be analyzed; a Frame splitter (FP) to split a Video Viewing Program (R) into a plurality of frames (F1, F2, . . . Fn); a Key Frame Identification mechanism (KFI) to identify key frames; and linking mechanism (LM) to cause a link to be formed with pre-populated databases and in-house libraries of images (D), of frames, which frames comprising associated tags, thereby determining a score of similar tags per video file in order to determine said genre, thereby determining multiplicity of instances for said time splitter.

Abstract: A substrate for an electronic device may include a first layer, a second layer, and may include a third layer. The first layer may include a capacitive material, and the capacitive material may be segmented into a first section, and a second section. Each of the first section and the second section may include a first surface and a second surface. The second layer may include a first conductor. The third layer may include a second conductor. The first surface of the second section of capacitive material may be directly coupled to the first conductor. The second surface of the second section of the capacitive material may be directly coupled to the second conductor. A first filler region may include a dielectric material and the first filler region may be located in a first gap between the first section of capacitive material and the second section of capacitive material.