Abstract: A method of processing an optical fiber includes drawing the optical fiber from a heated glass source, reheating the optical fiber, and cooling the optical fiber under vacuum at a cooling rate less than the cooling rate of the optical fiber in air at 25° C. and 1 atm. Cooling the optical fiber under vacuum is conducted after reheating the optical fiber. Cooling the optical fiber under vacuum reduces the rate of heat transfer from the optical fiber, which may enable further relaxation of the glass and reduction in the fictive temperature of the optical fiber. A system for processing an optical fiber includes a furnace containing a fiber preform, a first positioner, a reheating device, and a treatment device downstream of the reheating device, the treatment device operable to cool the optical fiber under vacuum to reduce the rate of heat transfer from the optical fiber.

Abstract: A mitochondrial-targeted PARP inhibitor is provided herein, as well as methods of making and using the mitochondrial-targeted PARP inhibitor.

Abstract: A system for processing optical fiber includes a draw furnace, a fiber conveyance pathway extending between an upstream end positioned at the draw furnace and a downstream end positioned opposite the upstream end, where optical fiber is conveyed along the fiber conveyance pathway from the upstream end to the downstream end in a fiber conveyance direction, a muffle in communication with the draw furnace and positioned downstream of the draw furnace, a second cooling device annularly surrounding the fiber conveyance pathway downstream from the draw furnace, the second cooling device including one or more second cooling device heating elements and a first cooling device positioned between the draw furnace and the second cooling device, wherein the first cooling device directs a fluid to contact the optical fiber.

Abstract: Present embodiments are directed to a system and method for generating a flame effect. An embodiment includes a nozzle assembly with an outer nozzle and an inner nozzle. At least a portion of the inner nozzle is nested within at least a portion of the outer nozzle. The system also includes a fuel source with two or more separate types of fuel.

Abstract: A method for filling recessed features with a low-resistivity metal. The method includes providing a patterned substrate containing a recessed feature formed in a first layer and a second layer that is exposed in the recessed feature, and pre-treating the substrate with a surface modifier that increases metal deposition selectivity on the second layer relative to on the first layer, depositing a metal layer on the substrate by vapor phase deposition, where the metal layer is preferentially deposited on the second layer in the recessed feature, and removing metal nuclei deposited on the first layer, including on a field area and on sidewalls of the first layer in the recessed feature, to selectively form the metal layer on the second layer in the recessed feature. The steps of pre-treating, depositing and removing may be repeated at least once to increase a thickness of the metal layer in the recessed feature.

Abstract: A method for representing an intended prosody in synthesized speech includes receiving a text utterance having at least one word, and selecting an utterance embedding for the text utterance. Each word in the text utterance has at least one syllable and each syllable has at least one phoneme. The utterance embedding represents an intended prosody. For each syllable, using the selected utterance embedding, the method also includes: predicting a duration of the syllable by encoding linguistic features of each phoneme of the syllable with a corresponding prosodic syllable embedding for the syllable; predicting a pitch contour of the syllable based on the predicted duration for the syllable; and generating a plurality of fixed-length predicted pitch frames based on the predicted duration for the syllable. Each fixed-length predicted pitch frame represents part of the predicted pitch contour of the syllable.

Abstract: A method of preparing a self-aligned via on a semiconductor workpiece includes using an integrated sequence of processing steps executed on a common manufacturing platform hosting a plurality of processing modules including one or more film-forming modules, one or more etching modules, and one or more transfer modules. The integrated sequence of processing steps include receiving the workpiece into the common manufacturing platform, the workpiece having a pattern of metal features in a dielectric layer wherein exposed surfaces of the metal features and exposed surfaces of the dielectric layer together define an upper planar surface; selectively etching the metal features to form a recess pattern by recessing the exposed surfaces of the metal features beneath the exposed surfaces of the dielectric layer using one of the one or more etching modules; and depositing an etch stop layer over the recess pattern using one of the one or more film-forming modules.

Abstract: A method for forming a fully self-aligned via is provided. A workpiece having a pattern of features in a dielectric layer is received into a common manufacturing platform. Metal caps are deposited on the metal features, and a barrier layer is deposited on the metal caps. A first dielectric layer is added to exposed dielectric material. The barrier layer is removed and an etch stop layer is added on the exposed surfaces of the first dielectric layer and the metal caps. Additional dielectric material is added on top of the etch stop layer, then both the additional dielectric material and a portion of the etch stop layer are etched to form a feature to be filled with metal material. An integrated sequence of processing steps is executed within one or more common manufacturing platforms to provide controlled environments. Transfer modules transfer the workpiece between processing modules within and between controlled environments.

Abstract: A method for wireless communication includes assigning a first channel and a first bandwidth to a plurality of first links formed by user equipment (UEs) communicating with access points (APs) in the mesh network. The method further includes assigning a second bandwidth to a plurality of second links formed by the APs communicating with one another, wherein the second links are assigned different channels. The method also includes acquiring link data from the UEs and determining if mesh rate requirements are met with the assigned first bandwidth and the first channel. The method also includes determining a minimum bandwidth required for the first links and assigning the minimum bandwidth if mesh rate requirements are met. The method also includes assigning a second channel to the first links if mesh rate requirements are not met.

Abstract: Optical fibers having low fictive temperature and methods of making such fibers are described. Management of the cooling rate of an optical fiber during fiber draw permits control over the fictive temperature of the fiber. Non-monotonic cooling rates are shown to promote reductions in fiber fictive temperature. The non-monotonic cooling includes slower cooling rates in upstream portions of the process pathway and faster cooling rates in downstream portions of the process pathway. Reduction in fiber fictive temperature is achieved by controlling the ambient temperature of the fiber to slow the cooling rate of the fiber in upstream portions of the process pathway that correspond to the fiber temperature regime in which the fiber viscosity is sufficiently low to permit efficient structural relaxation. Increases in cooling rate in downstream portions of the process pathway permit adjustment of fiber temperature as needed to meet entrance temperature requirements of downstream processing units.

Abstract: A method is provided for gate contact formation on a semiconductor workpiece using an integrated sequence of processing steps executed on a common manufacturing platform (CMP) hosting one or more film-forming modules, one or more etching modules, and one or more transfer modules. A workpiece having a contact feature formed therein, and inspected throughout, the contact feature having a semiconductor contact surface exposed, is received into the CMP. A plurality of metal layers is deposited at a bottom of the contact feature after the workpiece is treated to remove contamination. The integrated sequence of processing steps is executed within the CMP without leaving the controlled environment, the transfer modules used to transfer the workpiece between the modules while maintaining the workpiece within the controlled environment.

Abstract: An optical fiber coating apparatus that provides increased gyre stability and reduced gyre strength, thereby providing a more reliable coating application process during fiber drawing includes a cone-only coating die having a conical entrance portion with a tapered wall angled at a half angle ?, wherein 2°???25°, and a cone height L1 less than 2.2 mm, and a cylindrical portion having an inner diameter of d2, wherein 0.1 mm?d2?0.5 mm and a cylindrical height of L2, wherein 0.05 mm?L2?1.

Abstract: A method of applying a coating liquid to an optical fiber is described. An optical fiber is drawn through a guide die into a pressurized coating chamber and through the pressurized coating chamber to a sizing die. The pressurized coating chamber contains a coating liquid. The method includes directing coating liquid in a direction transverse to the processing pathway of the optical fiber in the pressurized coating chamber. The transverse flow of coating liquid counteracts detrimental effects associated with gyres that form in the pressurized coating chamber during the draw process. Benefits of the transverse flow include removal of bubbles, reduction in the temperature of the gyre, improved wetting, homogenization of the properties of the coating liquid in the pressurized coating chamber, and stabilization of the meniscus.

Abstract: An optical fiber coating apparatus that provides increased gyre stability and reduced gyre strength, thereby providing a more reliable coating application process during fiber drawing includes a cone-only coating die having a conical entrance portion with a tapered wall angled at a half angle ?, wherein 2°???25°, and a cone height L1 less than 2.2 mm, and a cylindrical portion having an inner diameter of d2, wherein 0.1 mm?d2?0.5 mm and a cylindrical height of L2, wherein 0.05 mm?L2?1.

Abstract: In certain embodiments, a method for designing a semiconductor device includes generating a two-dimensional design for fabricating chiplets on a semiconductor substrate. The chiplets are component levels for a multi-chip integrated circuit. The two-dimensional design includes a first layout for alignment features and semiconductor structures to be formed on a first surface of a first chiplet and a second layout for alignment features and semiconductor structures to be formed on a first surface of a second chiplet. The second chiplet is adjacent to the first chiplet on the semiconductor substrate. The second layout is a mirror image of the first layout across a reference line shared by the first chiplet and the second chiplet. The first surface of the first chiplet and the first surface of the second chiplet are both either top surfaces or bottom surfaces. The method further includes generating a photomask according to the design.

Abstract: An intravaginal pessary device in an applicator is provided. The device has a top and a bottom, and a sidewall that extends between the top and the bottom. The sidewall, top and bottom form an outer periphery defining a total area of the device. The pessary device has a maximum diameter that is less than about 25 mm. The pessary device and applicator exhibit a maximum expulsion force that is below 1500 grams.

Abstract: A method for representing an intended prosody in synthesized speech includes receiving a text utterance having at least one word, and selecting an utterance embedding for the text utterance. Each word in the text utterance has at least one syllable and each syllable has at least one phoneme. The utterance embedding represents an intended prosody. For each syllable, using the selected utterance embedding, the method also includes: predicting a duration of the syllable by encoding linguistic features of each phoneme of the syllable with a corresponding prosodic syllable embedding for the syllable; predicting a pitch contour of the syllable based on the predicted duration for the syllable; and generating a plurality of fixed-length predicted pitch frames based on the predicted duration for the syllable. Each fixed-length predicted pitch frame represents part of the predicted pitch contour of the syllable.

Abstract: A method for forming a fully self-aligned via is provided. A workpiece having a pattern of features in a dielectric layer is received into a common manufacturing platform. Metal caps are deposited on the metal features, and a barrier layer is deposited on the metal caps. A first dielectric layer is added to exposed dielectric material. The barrier layer is removed and an etch stop layer is added on the exposed surfaces of the first dielectric layer and the metal caps. Additional dielectric material is added on top of the etch stop layer, then both the additional dielectric material and a portion of the etch stop layer are etched to form a feature to be filled with metal material. An integrated sequence of processing steps is executed within one or more common manufacturing platforms to provide controlled environments. Transfer modules transfer the workpiece between processing modules within and between controlled environments.

Abstract: This disclosure relates to a high volume manufacturing system for processing and measuring workpieces in a semiconductor processing sequence without leaving the system's controlled environment (e.g., sub-atmospheric pressure). The system includes an active interdiction control system to implement corrective processing within the system when a non-conformity is detected. The corrective processing can include a remedial process sequence to correct the non-conformity or compensate for the non-conformity during subsequent process. The non-conformity may be associated with fabrication measurement data, process parameter data, and/or platform performance data.

Abstract: A method of operating an additive manufacturing system feeds solid extrusion material into a heater using a slip clutch coupled to an actuator of a mechanical driver to supply thermoplastic material into a manifold in an extruder head. The method sets a speed of the actuator so the actuator operates at a rotational speed that is slightly greater than the rotational speed of the mechanical mover. This method helps maintain the pressure of the thermoplastic material in the manifold of the extruder head in a predetermined range no matter how many nozzles are opened in the extruder head.