Abstract: A cap is positioned to contact a printhead when the printhead is not ejecting liquid ink. The cap and the printhead create a sealed space adjacent printhead nozzles when contacting each other. A flexible blade is positioned to contact the printhead when the printhead is not in contact with the cap. The flexible blade is adapted to fold over to spread a liquid solution on the nozzles in a first direction, and the flexible blade is adapted to remove excess amounts of the liquid solution from the nozzles in a second direction. A humidifier is connected to the cap and adapted to supply a moisture form of the liquid solution to the sealed space. A moisture sensor is connected to the cap. The humidifier is adapted to vary supply of the moisture to the sealed space based on the amount of moisture detected by the moisture sensor.

Abstract: A method of applying a coating liquid to an optical fiber is described. An optical fiber is drawn through a guide die into a pressurized coating chamber and through the pressurized coating chamber to a sizing die. The pressurized coating chamber contains a coating liquid. The method includes directing coating liquid in a direction transverse to the processing pathway of the optical fiber in the pressurized coating chamber. The transverse flow of coating liquid counteracts detrimental effects associated with gyres that form in the pressurized coating chamber during the draw process. Benefits of the transverse flow include removal of bubbles, reduction in the temperature of the gyre, improved wetting, homogenization of the properties of the coating liquid in the pressurized coating chamber, and stabilization of the meniscus.

Abstract: A method for forming a fully self-aligned via is provided. A workpiece having a pattern of features in a dielectric layer is received into a common manufacturing platform. Metal caps are deposited on the metal features, and a barrier layer is deposited on the metal caps. A first dielectric layer is added to exposed dielectric material. The barrier layer is removed and an etch stop layer is added on the exposed surfaces of the first dielectric layer and the metal caps. Additional dielectric material is added on top of the etch stop layer, then both the additional dielectric material and a portion of the etch stop layer are etched to form a feature to be filled with metal material. An integrated sequence of processing steps is executed within one or more common manufacturing platforms to provide controlled environments. Transfer modules transfer the workpiece between processing modules within and between controlled environments.

Abstract: An optical fiber coating apparatus that provides increased gyre stability and reduced gyre strength, thereby providing a more reliable coating application process during fiber drawing includes a cone-only coating die having a conical entrance portion with a tapered wall angled at a half angle ?, wherein 2°???25°, and a cone height L1 less than 2.2 mm, and a cylindrical portion having an inner diameter of d2, wherein 0.1 mm?d2?0.5 mm and a cylindrical height of L2, wherein 0.05 mm?L2?1.

Abstract: A three-dimensional (3-D) printer includes build and support material development stations positioned to transfer layers of build and support materials to an intermediate transfer surface. The intermediate transfer surface transfers a layer of the build and support materials to a platen each time the platen contacts the intermediate transfer surface. A sensor detects the thickness of the layer on the platen, and a mechanical planer is positioned to contact and level the layer on the platen as the platen moves past the mechanical planer. Additionally, a feedback loop is electrically connected to the sensor and the mechanical planer. The mechanical planer adjusts the amount of the build material and the support material removed from the layer based on the thickness of the layer on the platen, as determined by the sensor.

Abstract: Printing devices include a printing engine and a media tray connected to a frame. The media tray is adapted to hold a stack of media supplied to the printing engine for printing. A magnetic trailing edge guide that is shaped to contact a corner of the stack of media is connected to a tether that is connected to the frame. A storage device is connected to the frame, and the storage device is shaped to accommodate the magnetic trailing edge guide. The length of the tether allows the magnetic trailing edge guide to reach the corner of the stack of media and to reach the storage device. The magnetic trailing edge guide includes a magnetic element adapted to magnetically hold to at least the media tray and the storage device.

Abstract: A system and method for processing an optical fiber includes a treatment device disposed downstream of a furnace and including a treating zone. The treating zone includes a fiber inlet and fiber outlet and is configured to cool the optical fiber at a reduced pressure below ambient pressure and at a slow cooling rate less than an ambient cooling rate. A nozzle assembly is disposed at one or more of the fiber inlet, the fiber outlet, upstream of the treating zone, and downstream of the treating zone. The nozzle assembly includes multiple baffle plates defining a number of nozzle chambers, each nozzle chamber having a nozzle chamber pressure, wherein each baffle plate includes an orifice having a predetermined effective orifice diameter through which the optical fiber passes. Each nozzle chamber is configured to sequentially change a nozzle chamber pressure between the reduced pressure and ambient pressure.

Abstract: A method of processing materials on a semiconductor workpiece using an integrated sequence of processing steps executed on a common manufacturing platform hosting a plurality of processing modules including one or more film-forming modules, one or more etching modules, and one or more transfer modules is provided. A workpiece having an upper planar surface is received into the common manufacturing platform. The method further includes conformally applying a thin film over the feature pattern using one of the film-forming modules, removing the thin film from upper surfaces of the feature pattern using one of the etching modules to leave behind the thin film in the recessed feature, and removing the fill material from the upper planar surface of the workpiece. The integrated sequence of processing steps is executed in a controlled environment within the common manufacturing platform and without leaving the controlled environment.

Abstract: A method and a system for polishing a wafer is disclosed. In one aspect, the method includes generating atmospheric plasma. The method further includes treating a component of a wafer processing system with the atmospheric plasma. The method further includes delivering a slurry containing abrasive and corrosive particles to a surface of the wafer processing system which includes atmospheric plasma-treated component. The method further includes polishing a wafer with the abrasive and corrosive particles.

Abstract: A system for surveying a surface (2) to measure a physical or chemical property associated with the surface. The system includes a handheld probe (4) measuring a physical or chemical property at locations over a surface (2). The video camera (12) captures video data of a user (6) using the handheld probe (4) to survey the surface. The depth sensing device (14) measures the distance to the handheld probe (4). Processing circuitry identifies the handheld probe from the video data and determines the position of the handheld probe (4) relative to the surface (2). A data recorder and/or a data transmitter records and/or transmits data representative of the physical or chemical property measured by the handheld probe (4) and data representative of the associated position of the handheld probe, when the handheld probe (4) is determined to be less than a threshold distance from the surface (2) being surveyed.

Abstract: A method for determining a route from a mesh network to an external network includes identifying route segments from a user equipment (UE) to the external network. The route segments comprise at least a first route segment from the UE to a first mesh access point (AP), a second route segment from the first mesh AP to the external network through a wide area cellular wireless network (WACWN), and a third route segment from the first mesh AP to the external network through an alternative network. The method further includes determining respective bandwidth of at least the first, second and third route segments and selecting the route based on the bandwidth of the first, second and third route segments, wherein the route comprises at least two of the route segments. The method also includes routing data between the UE and the external network via the selected route.

Abstract: Devices include one or more inkjet printheads, a reusable jetting sheet that is adjacent to nozzles of the printheads, support structures (e.g., drive rollers) contacting the sheet, and a cleaning station contacting the sheet. The reusable jetting sheet includes an opening, that is at least as large as the sets of nozzles, and a jetting area spaced from the opening. The support structures are adapted to move the reusable jetting sheet relative to the sets of nozzles. The inkjet printheads are adapted to eject ink from at least some of the nozzles, through the opening, to print media when the opening is positioned adjacent to the sets of nozzles, to print on print media. The inkjet printhead is further adapted to eject ink from at least some of the nozzles to the jetting area when the jetting area is positioned adjacent to the sets of nozzles to perform maintenance jetting.

Abstract: Certain embodiments are directed to compositions and methods for non-cytotoxic hematopoietic stem cell transplantation.

Abstract: Devices include one or more inkjet printheads, a reusable jetting sheet that is adjacent to nozzles of the printheads, support structures (e.g., drive rollers) contacting the sheet, and a cleaning station contacting the sheet. The reusable jetting sheet includes an opening, that is at least as large as the sets of nozzles, and a jetting area spaced from the opening. The support structures are adapted to move the reusable jetting sheet relative to the sets of nozzles. The inkjet printheads are adapted to eject ink from at least some of the nozzles, through the opening, to print media when the opening is positioned adjacent to the sets of nozzles, to print on print media. The inkjet printhead is further adapted to eject ink from at least some of the nozzles to the jetting area when the jetting area is positioned adjacent to the sets of nozzles to perform maintenance jetting.

Abstract: A method is provided for gate contact formation on a semiconductor workpiece using an integrated sequence of processing steps executed on a common manufacturing platform (CMP) hosting one or more film-forming modules, one or more etching modules, and one or more transfer modules. A workpiece having a contact feature formed therein, and inspected throughout, the contact feature having a semiconductor contact surface exposed, is received into the CMP. A metal layer is deposited within the contact feature after the workpiece is treated to remove contamination. The integrated sequence of processing steps is executed within the CMP without leaving the controlled environment, the transfer modules used to transfer the workpiece between the modules while maintaining the workpiece within the controlled environment.

Abstract: A wireless transmitter includes a signal processing circuit configured to generate a plurality of first and second spatial streams signals. The transmitter includes a frequency shift circuit configured to selectively apply different frequency shifts to the first and second spatial streams signals. A wireless receiver includes a frequency shift circuit configured to selectively apply different frequency shifts to the received first and second spatial streams signals. The receiver also includes a signal processing circuit configured to process the first and second frequency shifted signals.

Abstract: An electromechanical lock according to the present embodiments includes a lock extension and a blocking module having an interior region. A pivot bolt is mounted in the interior region for movement between a nominal position and an unsecured position. A first blocker is disposed in the interior region for movement between its nominal position and unblocking position. A second blocker is disposed in the interior region for movement between a nominal position and unblocking position. The pivot bolt, the first blocker, and the second blocker are biased to their respective nominal positions by springs.

Abstract: A cap is positioned to contact a printhead when the printhead is not ejecting liquid ink. The cap and the printhead create a sealed space adjacent printhead nozzles when contacting each other. A flexible blade is positioned to contact the printhead when the printhead is not in contact with the cap. The flexible blade is adapted to fold over to spread a liquid solution on the nozzles in a first direction, and the flexible blade is adapted to remove excess amounts of the liquid solution from the nozzles in a second direction. A humidifier is connected to the cap and adapted to supply a moisture form of the liquid solution to the sealed space. A moisture sensor is connected to the cap. The humidifier is adapted to vary supply of the moisture to the sealed space based on the amount of moisture detected by the moisture sensor.

Abstract: A method is provided for self-aligned multi-patterning on a semiconductor workpiece using an integrated sequence of processing steps executed on a common manufacturing platform hosting film-forming modules, etching modules, and transfer modules. A workpiece having a mandrel pattern formed thereon is received into the common manufacturing platform. A sidewall spacer pattern is formed based, at least in part, on the mandrel pattern, the sidewall spacer pattern having a plurality of second features separated by a second pitch distance with the first pitch distance being greater than the second pitch distance. The integrated sequence of processing steps is executed within the common manufacturing platform without leaving the controlled environment and the transfer modules are used to transfer the workpiece between the processing modules while maintaining the workpiece within the controlled environment.