Patents by Inventor Roman Sapiejewski

Patent number: 8374373
Abstract: A headset including an earcup having a front opening adapted to be adjacent to the ear of the user, a baffle disposed within the earcup to define front and rear cavities, a cushion extending around the periphery of the front opening of the earcup and constructed and arranged to accommodate the ear of the user, the cushion having a first density, an inner radial portion, and an outer radial portion opposite the inner radial portion, a cushion cover substantially surrounding the cushion to form a headphone cushion assembly, and a high impedance component having a second density and located near the outer radial portion to increase the transmission loss of the cushion along a radial direction.
Type: Grant
Filed: November 26, 2008
Issued: February 12, 2013
Assignee: Bose Corporation
Inventors: Roman Sapiejewski, Kevin P. Annunziato, Ian M. Collier, Jason Harlow
Patent number: 8355522
Abstract: A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to couple the cushion to acoustic elements of an earphone. The first material occupies a first volume adjacent to the interior surface. The second material occupies a second volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.
Type: Grant
Filed: March 7, 2011
Issued: January 15, 2013
Assignee: Bose Corporation
Inventors: Kevin P. Annunziato, Ian M. Collier, Michael Monahan, Roman Sapiejewski, William Tice
Patent number: 8111858
Abstract: An earphone for a supra-aural noise reducing headphone, with a front cavity that includes a foam portion and an open passageway. The foam portion supplements the volumetric dimension of the passageway to improve passive attenuation.
Type: Grant
Filed: October 9, 2009
Issued: February 7, 2012
Assignee: Bose Corporation
Inventor: Roman Sapiejewski
Application number: 20110311071
Abstract: Power is delivered from a power source in a head-mounted device to a separate accessory that is coupled to the head-mounted device. Power and signals are delivered on a common conductor that couples the head-mounted device to an accessory. One or both of the head-mounted device and the accessory are configured based on the signals. Power may be received at an accessory from the head-mounted device through a dedicated power conductor. Power may be delivered from a power source in a portable accessory to a head-mounted device that is coupled to the portable accessory and uses the power for circuitry in the head-mounted device that delivers audio to a user.
Type: Application
Filed: August 29, 2011
Issued: December 22, 2011
Inventors: Daniel M. Gauger, JR., Roman Sapiejewski
Patent number: 8077874
Abstract: A method and apparatus for increasing phase margin in a feedback circuit of an active noise reduction headphone. The method includes providing an acoustic block comprising an acoustic driver comprising a voice coil mechanically coupled along an attachment line to an acoustic energy radiating diaphragm, the acoustic block further comprising a microphone positioned along a line parallel to an intended direction of vibration of the acoustic diaphragm and intersecting the attachment line, the acoustic block characterized by a magnitude frequency response compensating the magnitude frequency response by a compensation pattern that has a positive slope over at least one spectral range above 10 kHz.
Type: Grant
Filed: April 24, 2006
Issued: December 13, 2011
Assignee: Bose Corporation
Inventor: Roman Sapiejewski
Patent number: 8073181
Abstract: An electrical equalization module that is second order or higher. The equalization module is used to achieve a desired frequency response for audio headphones. The equalization module includes capacitors or inductors. The equalization module is a bridged-T circuit, parallel RLC circuit, or series RLC circuit.
Type: Grant
Filed: December 27, 2006
Issued: December 6, 2011
Assignee: Bose Corporation
Inventors: Pericles Nicholas Bakalos, Roman Sapiejewski, Jason M. Harlow
Patent number: 8054992
Abstract: A method and apparatus for increasing phase margin in a feedback circuit of an active noise reduction headphone. The method includes providing an acoustic block comprising an acoustic driver comprising a voice coil mechanically coupled along an attachment line to an acoustic energy radiating diaphragm, the acoustic block further comprising a microphone positioned along a line parallel to an intended direction of vibration of the acoustic diaphragm and intersecting the attachment line, the acoustic block characterized by a magnitude frequency response compensating the magnitude frequency response by a compensation pattern that has a positive slope over at least one spectral range above 10 kHz.
Type: Grant
Filed: April 24, 2006
Issued: November 8, 2011
Assignee: Bose Corporation
Inventor: Roman Sapiejewski
Patent number: 8031878
Abstract: Power is delivered from a power source in a head-mounted device to a separate accessory that is coupled to the head-mounted device. Power and signals are delivered on a common conductor that couples the head-mounted device to an accessory. One or both of the head-mounted device and the accessory are configured based on the signals. Power may be received at an accessory from the head-mounted device through a dedicated power conductor. Power may be delivered from a power source in a portable accessory to a head-mounted device that is coupled to the portable accessory and uses the power for circuitry in the head-mounted device that delivers audio to a user.
Type: Grant
Filed: July 28, 2005
Issued: October 4, 2011
Inventors: Daniel M. Gauger, Jr., Roman Sapiejewski
Application number: 20110216909
Abstract: A headset including an earcup having a front opening adapted to be adjacent to the ear of a user, the earcup extending in a radial direction and an axial direction and defining an earcup volume; and a bellows cushion extending around the periphery of the front opening of the earcup and sized to engage the ear of the user, the bellows cushion comprising a plurality of folded segments located at an outer radial portion of the bellows cushion, and configured to be substantially compliant along an axial direction.
Type: Application
Filed: April 1, 2011
Issued: September 8, 2011
Inventors: Roman Sapiejewski, Eric M. Wallace
Application number: 20110211723
Abstract: A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to couple the cushion to acoustic elements of an earphone. The first material occupies a first volume adjacent to the interior surface. The second material occupies a second volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.
Type: Application
Filed: March 7, 2011
Issued: September 1, 2011
Inventors: Kevin P. Annunziato, Ian M. Collier, Michael Monahan, Roman Sapiejewski, William Tice
Patent number: 7970159
Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated in
Type: Grant
Filed: June 25, 2008
Issued: June 28, 2011
Inventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
Patent number: 7916888
Abstract: An earphone includes a first acoustic chamber including a reactive element and a resistive element in parallel, a second acoustic chamber separated from the first acoustic chamber by an acoustic transducer, and a housing to support the apparatus from the concha of a wearer's ear and to extend the second acoustic chamber into the ear canal of the wearer's ear. A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to accommodate an earphone. The first material occupies a volume adjacent to the interior surface. The second material occupies a volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.
Type: Grant
Filed: June 30, 2006
Issued: March 29, 2011
Assignee: Bose Corporation
Inventors: Roman Sapiejewski, William W. Tice, Jason M. Harlow, Ian M. Collier, Kevin P. Annunziato, Pericles Nicholas Bakalos, Michael J. Monahan
Application number: 20110044464
Abstract: An earpiece of an ANR device incorporates one or more of feedforward-based ANR; feedback-based ANR; passive noise reduction (PNR) of environmental noise sounds in the environment external to the casing of the earpiece in higher audible frequencies; a controlled leak acoustically coupling the front cavity to the environment external to the casing of the ANR device where the coupling may be through another cavity that is closable to the environment external to the casing with a leaky cover; a combination of an acoustically resistive port and a mass port coupling a rear cavity to the environment external to the casing where the coupling may be through another cavity that is closable to the environment external to the casing with a leaky cover; a feedforward microphone given acoustic access to the environment external to the casing through an aperture that is overlain with a leaky cover or that is enclosed within a cavity that is acoustically coupled to the environment external to the casing with a leak.
Type: Application
Filed: March 9, 2010
Issued: February 24, 2011
Inventors: Roman Sapiejewski, Jason Harlow, Martin David Ring
Application number: 20100128884
Abstract: A headset including an earcup having a front opening adapted to be adjacent to the ear of the user, a baffle disposed within the earcup to define front and rear cavities, a cushion extending around the periphery of the front opening of the earcup and constructed and arranged to accommodate the ear of the user, the cushion having a first density, an inner radial portion, and an outer radial portion opposite the inner radial portion, a cushion cover substantially surrounding the cushion to form a headphone cushion assembly, and a high impedance component having a second density and located near the outer radial portion to increase the transmission loss of the cushion along a radial direction.
Type: Application
Filed: November 26, 2008
Issued: May 27, 2010
Inventors: Roman Sapiejewski, Kevin P. Annunziato, Ian M. Collier, Jason Harlow
Application number: 20100027803
Abstract: An earphone for a supra-aural noise reducing headphone, with a front cavity that includes a foam portion and an open passageway. The foam portion supplements the volumetric dimension of the passageway to improve passive attenuation.
Type: Application
Filed: October 9, 2009
Issued: February 4, 2010
Inventor: Roman Sapiejewski
Application number: 20090003616
Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated in
Type: Application
Filed: June 25, 2008
Issued: January 1, 2009
Assignee: Bose Corporation
Inventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
Patent number: 7412070
Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated in
Type: Grant
Filed: March 29, 2004
Issued: August 12, 2008
Assignee: Bose Corporation
Inventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
Application number: 20080152162
Abstract: An electrical equalization module that is second order or higher. The equalization module is used to achieve a desired frequency response for audio headphones. The equalization module includes capacitors or inductors. The equalization module is a bridged-T circuit, parallel RLC circuit, or series RLC circuit.
Type: Application
Filed: December 27, 2006
Issued: June 26, 2008
Inventors: Pericles Nicholas Bakalos, Roman Sapiejewski, Jason M. Harlow
Application number: 20080002835
Abstract: An earphone includes a first acoustic chamber including a reactive element and a resistive element in parallel, a second acoustic chamber separated from the first acoustic chamber by an acoustic transducer, and a housing to support the apparatus from the concha of a wearer's ear and to extend the second acoustic chamber into the ear canal of the wearer's ear. A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to accommodate an earphone. The first material occupies a volume adjacent to the interior surface. The second material occupies a volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.
Type: Application
Filed: June 30, 2006
Issued: January 3, 2008
Inventors: Roman Sapiejewski, Kevin P. Annunziato, Ian M. Collier, William W. Tice, Jason M. Harlow
Patent number: RE43939
Abstract: A headset has an earcup with front opening adjacent to an annular cushion formed with a plurality of openings facing the inside of the earcup that acoustically couples the earcup volume to the cushion volume. A driver is seated inside the earcup with a microphone adjacent to the driver. Active noise reducing circuitry intercouples the driver and microphone. An acoustic load that may comprise a wire mesh resistive cover and/or air mass adjacent the microphone is constructed and arranged to reduce the effect of resonances in the earcup volume. A headset has an earcup with front opening adjacent to an annular cushion. A driver is seated inside the earcup with a microphone adjacent to the driver. Active noise reducing circuitry intercouples the driver and microphone. An acoustic load is constructed and arranged to reduce the effect of resonances in the earcup volume.
Type: Grant
Filed: January 8, 2004
Issued: January 22, 2013
Assignee: Bose Corporation
Inventors: Roman Sapiejewski, Michael J. Monahan