Patents by Inventor Roman Sapiejewski
Roman Sapiejewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8594351Abstract: An earphone includes a first acoustic chamber having a reactive element and a resistive element in a parallel configuration, a second acoustic chamber separated from the first acoustic chamber by an acoustic transducer and including a unitary port to provide both pressure equalization of the second chamber and equalization of the earphone to a predetermined frequency response, and a housing to support the apparatus from the concha of a wearer's ear and to extend the second acoustic chamber into the ear canal of the wearer's ear.Type: GrantFiled: August 16, 2010Date of Patent: November 26, 2013Assignee: Bose CorporationInventors: Jason Harlow, Tetsuro Oishi, Kevin P. Annunziato, Ian M. Collier, Michael Monahan, Roman Sapiejewski
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Patent number: 8571228Abstract: An earpiece of an ANR device incorporates one or more of feedforward-based ANR; feedback-based ANR; passive noise reduction (PNR) of environmental noise sounds in the environment external to the casing of the earpiece in higher audible frequencies; a controlled leak acoustically coupling the front cavity to the environment external to the casing of the ANR device where the coupling may be through another cavity that is closable to the environment external to the casing with a leaky cover; a combination of an acoustically resistive port and a mass port coupling a rear cavity to the environment external to the casing where the coupling may be through another cavity that is closable to the environment external to the casing with a leaky cover; a feedforward microphone given acoustic access to the environment external to the casing through an aperture that is overlain with a leaky cover or that is enclosed within a cavity that is acoustically coupled to the environment external to the casing with a leak.Type: GrantFiled: March 9, 2010Date of Patent: October 29, 2013Assignee: Bose CorporationInventors: Roman Sapiejewski, Jason Harlow, Martin David Ring
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Patent number: 8467539Abstract: A headset including an earcup having a front opening adapted to be adjacent to the ear of a user, the earcup extending in a radial direction and an axial direction and defining an earcup volume; and a bellows cushion extending around the periphery of the front opening of the earcup and sized to engage the ear of the user, the bellows cushion comprising a plurality of folded segments located at an outer radial portion of the bellows cushion, and configured to be substantially compliant along an axial direction.Type: GrantFiled: April 1, 2011Date of Patent: June 18, 2013Assignee: Bose CorporationInventors: Roman Sapiejewski, Eric M. Wallace
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Publication number: 20130129106Abstract: A headset includes first and second earcups each having a front opening adapted to be adjacent to a respective ear of a user and including an electroacoustic transducer, a headband coupled to each of the earcups, and an active noise reduction circuit coupled to the electroacoustic transducers. The headband is configurable between at least two configurations that each press the earcups against the head of the user with different amounts of force. The active noise reduction circuit is configured to determine which of the at least two configurations the headband may be configured in, to provide a different amount of noise reduction when the headband may be configured in each of the different amounts of force, and to automatically transition between the different amounts of noise reduction in response to a change in the configuration of the headband between the at least two configurations.Type: ApplicationFiled: October 26, 2012Publication date: May 23, 2013Inventor: Roman Sapiejewski
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Patent number: 8374373Abstract: A headset including an earcup having a front opening adapted to be adjacent to the ear of the user, a baffle disposed within the earcup to define front and rear cavities, a cushion extending around the periphery of the front opening of the earcup and constructed and arranged to accommodate the ear of the user, the cushion having a first density, an inner radial portion, and an outer radial portion opposite the inner radial portion, a cushion cover substantially surrounding the cushion to form a headphone cushion assembly, and a high impedance component having a second density and located near the outer radial portion to increase the transmission loss of the cushion along a radial direction.Type: GrantFiled: November 26, 2008Date of Patent: February 12, 2013Assignee: Bose CorporationInventors: Roman Sapiejewski, Kevin P. Annunziato, Ian M. Collier, Jason Harlow
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Patent number: 8355522Abstract: A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to couple the cushion to acoustic elements of an earphone. The first material occupies a first volume adjacent to the interior surface. The second material occupies a second volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.Type: GrantFiled: March 7, 2011Date of Patent: January 15, 2013Assignee: Bose CorporationInventors: Kevin P. Annunziato, Ian M. Collier, Michael Monahan, Roman Sapiejewski, William Tice
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Patent number: 8111858Abstract: An earphone for a supra-aural noise reducing headphone, with a front cavity that includes a foam portion and an open passageway. The foam portion supplements the volumetric dimension of the passageway to improve passive attenuation.Type: GrantFiled: October 9, 2009Date of Patent: February 7, 2012Assignee: Bose CorporationInventor: Roman Sapiejewski
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Publication number: 20110311071Abstract: Power is delivered from a power source in a head-mounted device to a separate accessory that is coupled to the head-mounted device. Power and signals are delivered on a common conductor that couples the head-mounted device to an accessory. One or both of the head-mounted device and the accessory are configured based on the signals. Power may be received at an accessory from the head-mounted device through a dedicated power conductor. Power may be delivered from a power source in a portable accessory to a head-mounted device that is coupled to the portable accessory and uses the power for circuitry in the head-mounted device that delivers audio to a user.Type: ApplicationFiled: August 29, 2011Publication date: December 22, 2011Inventors: Daniel M. Gauger, JR., Roman Sapiejewski
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Patent number: 8077874Abstract: A method and apparatus for increasing phase margin in a feedback circuit of an active noise reduction headphone. The method includes providing an acoustic block comprising an acoustic driver comprising a voice coil mechanically coupled along an attachment line to an acoustic energy radiating diaphragm, the acoustic block further comprising a microphone positioned along a line parallel to an intended direction of vibration of the acoustic diaphragm and intersecting the attachment line, the acoustic block characterized by a magnitude frequency response compensating the magnitude frequency response by a compensation pattern that has a positive slope over at least one spectral range above 10 kHz.Type: GrantFiled: April 24, 2006Date of Patent: December 13, 2011Assignee: Bose CorporationInventor: Roman Sapiejewski
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Patent number: 8073181Abstract: An electrical equalization module that is second order or higher. The equalization module is used to achieve a desired frequency response for audio headphones. The equalization module includes capacitors or inductors. The equalization module is a bridged-T circuit, parallel RLC circuit, or series RLC circuit.Type: GrantFiled: December 27, 2006Date of Patent: December 6, 2011Assignee: Bose CorporationInventors: Pericles Nicholas Bakalos, Roman Sapiejewski, Jason M. Harlow
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Patent number: 8054992Abstract: A method and apparatus for increasing phase margin in a feedback circuit of an active noise reduction headphone. The method includes providing an acoustic block comprising an acoustic driver comprising a voice coil mechanically coupled along an attachment line to an acoustic energy radiating diaphragm, the acoustic block further comprising a microphone positioned along a line parallel to an intended direction of vibration of the acoustic diaphragm and intersecting the attachment line, the acoustic block characterized by a magnitude frequency response compensating the magnitude frequency response by a compensation pattern that has a positive slope over at least one spectral range above 10 kHz.Type: GrantFiled: April 24, 2006Date of Patent: November 8, 2011Assignee: Bose CorporationInventor: Roman Sapiejewski
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Patent number: 8031878Abstract: Power is delivered from a power source in a head-mounted device to a separate accessory that is coupled to the head-mounted device. Power and signals are delivered on a common conductor that couples the head-mounted device to an accessory. One or both of the head-mounted device and the accessory are configured based on the signals. Power may be received at an accessory from the head-mounted device through a dedicated power conductor. Power may be delivered from a power source in a portable accessory to a head-mounted device that is coupled to the portable accessory and uses the power for circuitry in the head-mounted device that delivers audio to a user.Type: GrantFiled: July 28, 2005Date of Patent: October 4, 2011Inventors: Daniel M. Gauger, Jr., Roman Sapiejewski
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Publication number: 20110216909Abstract: A headset including an earcup having a front opening adapted to be adjacent to the ear of a user, the earcup extending in a radial direction and an axial direction and defining an earcup volume; and a bellows cushion extending around the periphery of the front opening of the earcup and sized to engage the ear of the user, the bellows cushion comprising a plurality of folded segments located at an outer radial portion of the bellows cushion, and configured to be substantially compliant along an axial direction.Type: ApplicationFiled: April 1, 2011Publication date: September 8, 2011Inventors: Roman Sapiejewski, Eric M. Wallace
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Publication number: 20110211723Abstract: A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to couple the cushion to acoustic elements of an earphone. The first material occupies a first volume adjacent to the interior surface. The second material occupies a second volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.Type: ApplicationFiled: March 7, 2011Publication date: September 1, 2011Inventors: Kevin P. Annunziato, Ian M. Collier, Michael Monahan, Roman Sapiejewski, William Tice
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Patent number: 7970159Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated inType: GrantFiled: June 25, 2008Date of Patent: June 28, 2011Inventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
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Patent number: 7916888Abstract: An earphone includes a first acoustic chamber including a reactive element and a resistive element in parallel, a second acoustic chamber separated from the first acoustic chamber by an acoustic transducer, and a housing to support the apparatus from the concha of a wearer's ear and to extend the second acoustic chamber into the ear canal of the wearer's ear. A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to accommodate an earphone. The first material occupies a volume adjacent to the interior surface. The second material occupies a volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.Type: GrantFiled: June 30, 2006Date of Patent: March 29, 2011Assignee: Bose CorporationInventors: Roman Sapiejewski, William W. Tice, Jason M. Harlow, Ian M. Collier, Kevin P. Annunziato, Pericles Nicholas Bakalos, Michael J. Monahan
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Publication number: 20110044464Abstract: An earpiece of an ANR device incorporates one or more of feedforward-based ANR; feedback-based ANR; passive noise reduction (PNR) of environmental noise sounds in the environment external to the casing of the earpiece in higher audible frequencies; a controlled leak acoustically coupling the front cavity to the environment external to the casing of the ANR device where the coupling may be through another cavity that is closable to the environment external to the casing with a leaky cover; a combination of an acoustically resistive port and a mass port coupling a rear cavity to the environment external to the casing where the coupling may be through another cavity that is closable to the environment external to the casing with a leaky cover; a feedforward microphone given acoustic access to the environment external to the casing through an aperture that is overlain with a leaky cover or that is enclosed within a cavity that is acoustically coupled to the environment external to the casing with a leak.Type: ApplicationFiled: March 9, 2010Publication date: February 24, 2011Inventors: Roman Sapiejewski, Jason Harlow, Martin David Ring
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Publication number: 20100128884Abstract: A headset including an earcup having a front opening adapted to be adjacent to the ear of the user, a baffle disposed within the earcup to define front and rear cavities, a cushion extending around the periphery of the front opening of the earcup and constructed and arranged to accommodate the ear of the user, the cushion having a first density, an inner radial portion, and an outer radial portion opposite the inner radial portion, a cushion cover substantially surrounding the cushion to form a headphone cushion assembly, and a high impedance component having a second density and located near the outer radial portion to increase the transmission loss of the cushion along a radial direction.Type: ApplicationFiled: November 26, 2008Publication date: May 27, 2010Inventors: Roman Sapiejewski, Kevin P. Annunziato, Ian M. Collier, Jason Harlow
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Publication number: 20100027803Abstract: An earphone for a supra-aural noise reducing headphone, with a front cavity that includes a foam portion and an open passageway. The foam portion supplements the volumetric dimension of the passageway to improve passive attenuation.Type: ApplicationFiled: October 9, 2009Publication date: February 4, 2010Inventor: Roman Sapiejewski
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Patent number: RE43939Abstract: A headset has an earcup with front opening adjacent to an annular cushion formed with a plurality of openings facing the inside of the earcup that acoustically couples the earcup volume to the cushion volume. A driver is seated inside the earcup with a microphone adjacent to the driver. Active noise reducing circuitry intercouples the driver and microphone. An acoustic load that may comprise a wire mesh resistive cover and/or air mass adjacent the microphone is constructed and arranged to reduce the effect of resonances in the earcup volume. A headset has an earcup with front opening adjacent to an annular cushion. A driver is seated inside the earcup with a microphone adjacent to the driver. Active noise reducing circuitry intercouples the driver and microphone. An acoustic load is constructed and arranged to reduce the effect of resonances in the earcup volume.Type: GrantFiled: January 8, 2004Date of Patent: January 22, 2013Assignee: Bose CorporationInventors: Roman Sapiejewski, Michael J. Monahan