Patents by Inventor Roman Sapiejewski

Roman Sapiejewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8594351
    Abstract: An earphone includes a first acoustic chamber having a reactive element and a resistive element in a parallel configuration, a second acoustic chamber separated from the first acoustic chamber by an acoustic transducer and including a unitary port to provide both pressure equalization of the second chamber and equalization of the earphone to a predetermined frequency response, and a housing to support the apparatus from the concha of a wearer's ear and to extend the second acoustic chamber into the ear canal of the wearer's ear.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: November 26, 2013
    Assignee: Bose Corporation
    Inventors: Jason Harlow, Tetsuro Oishi, Kevin P. Annunziato, Ian M. Collier, Michael Monahan, Roman Sapiejewski
  • Patent number: 8571228
    Abstract: An earpiece of an ANR device incorporates one or more of feedforward-based ANR; feedback-based ANR; passive noise reduction (PNR) of environmental noise sounds in the environment external to the casing of the earpiece in higher audible frequencies; a controlled leak acoustically coupling the front cavity to the environment external to the casing of the ANR device where the coupling may be through another cavity that is closable to the environment external to the casing with a leaky cover; a combination of an acoustically resistive port and a mass port coupling a rear cavity to the environment external to the casing where the coupling may be through another cavity that is closable to the environment external to the casing with a leaky cover; a feedforward microphone given acoustic access to the environment external to the casing through an aperture that is overlain with a leaky cover or that is enclosed within a cavity that is acoustically coupled to the environment external to the casing with a leak.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: October 29, 2013
    Assignee: Bose Corporation
    Inventors: Roman Sapiejewski, Jason Harlow, Martin David Ring
  • Patent number: 8467539
    Abstract: A headset including an earcup having a front opening adapted to be adjacent to the ear of a user, the earcup extending in a radial direction and an axial direction and defining an earcup volume; and a bellows cushion extending around the periphery of the front opening of the earcup and sized to engage the ear of the user, the bellows cushion comprising a plurality of folded segments located at an outer radial portion of the bellows cushion, and configured to be substantially compliant along an axial direction.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: June 18, 2013
    Assignee: Bose Corporation
    Inventors: Roman Sapiejewski, Eric M. Wallace
  • Publication number: 20130129106
    Abstract: A headset includes first and second earcups each having a front opening adapted to be adjacent to a respective ear of a user and including an electroacoustic transducer, a headband coupled to each of the earcups, and an active noise reduction circuit coupled to the electroacoustic transducers. The headband is configurable between at least two configurations that each press the earcups against the head of the user with different amounts of force. The active noise reduction circuit is configured to determine which of the at least two configurations the headband may be configured in, to provide a different amount of noise reduction when the headband may be configured in each of the different amounts of force, and to automatically transition between the different amounts of noise reduction in response to a change in the configuration of the headband between the at least two configurations.
    Type: Application
    Filed: October 26, 2012
    Publication date: May 23, 2013
    Inventor: Roman Sapiejewski
  • Patent number: 8374373
    Abstract: A headset including an earcup having a front opening adapted to be adjacent to the ear of the user, a baffle disposed within the earcup to define front and rear cavities, a cushion extending around the periphery of the front opening of the earcup and constructed and arranged to accommodate the ear of the user, the cushion having a first density, an inner radial portion, and an outer radial portion opposite the inner radial portion, a cushion cover substantially surrounding the cushion to form a headphone cushion assembly, and a high impedance component having a second density and located near the outer radial portion to increase the transmission loss of the cushion along a radial direction.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: February 12, 2013
    Assignee: Bose Corporation
    Inventors: Roman Sapiejewski, Kevin P. Annunziato, Ian M. Collier, Jason Harlow
  • Patent number: 8355522
    Abstract: A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to couple the cushion to acoustic elements of an earphone. The first material occupies a first volume adjacent to the interior surface. The second material occupies a second volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: January 15, 2013
    Assignee: Bose Corporation
    Inventors: Kevin P. Annunziato, Ian M. Collier, Michael Monahan, Roman Sapiejewski, William Tice
  • Patent number: 8111858
    Abstract: An earphone for a supra-aural noise reducing headphone, with a front cavity that includes a foam portion and an open passageway. The foam portion supplements the volumetric dimension of the passageway to improve passive attenuation.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: February 7, 2012
    Assignee: Bose Corporation
    Inventor: Roman Sapiejewski
  • Publication number: 20110311071
    Abstract: Power is delivered from a power source in a head-mounted device to a separate accessory that is coupled to the head-mounted device. Power and signals are delivered on a common conductor that couples the head-mounted device to an accessory. One or both of the head-mounted device and the accessory are configured based on the signals. Power may be received at an accessory from the head-mounted device through a dedicated power conductor. Power may be delivered from a power source in a portable accessory to a head-mounted device that is coupled to the portable accessory and uses the power for circuitry in the head-mounted device that delivers audio to a user.
    Type: Application
    Filed: August 29, 2011
    Publication date: December 22, 2011
    Inventors: Daniel M. Gauger, JR., Roman Sapiejewski
  • Patent number: 8077874
    Abstract: A method and apparatus for increasing phase margin in a feedback circuit of an active noise reduction headphone. The method includes providing an acoustic block comprising an acoustic driver comprising a voice coil mechanically coupled along an attachment line to an acoustic energy radiating diaphragm, the acoustic block further comprising a microphone positioned along a line parallel to an intended direction of vibration of the acoustic diaphragm and intersecting the attachment line, the acoustic block characterized by a magnitude frequency response compensating the magnitude frequency response by a compensation pattern that has a positive slope over at least one spectral range above 10 kHz.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: December 13, 2011
    Assignee: Bose Corporation
    Inventor: Roman Sapiejewski
  • Patent number: 8073181
    Abstract: An electrical equalization module that is second order or higher. The equalization module is used to achieve a desired frequency response for audio headphones. The equalization module includes capacitors or inductors. The equalization module is a bridged-T circuit, parallel RLC circuit, or series RLC circuit.
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: December 6, 2011
    Assignee: Bose Corporation
    Inventors: Pericles Nicholas Bakalos, Roman Sapiejewski, Jason M. Harlow
  • Patent number: 8054992
    Abstract: A method and apparatus for increasing phase margin in a feedback circuit of an active noise reduction headphone. The method includes providing an acoustic block comprising an acoustic driver comprising a voice coil mechanically coupled along an attachment line to an acoustic energy radiating diaphragm, the acoustic block further comprising a microphone positioned along a line parallel to an intended direction of vibration of the acoustic diaphragm and intersecting the attachment line, the acoustic block characterized by a magnitude frequency response compensating the magnitude frequency response by a compensation pattern that has a positive slope over at least one spectral range above 10 kHz.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: November 8, 2011
    Assignee: Bose Corporation
    Inventor: Roman Sapiejewski
  • Patent number: 8031878
    Abstract: Power is delivered from a power source in a head-mounted device to a separate accessory that is coupled to the head-mounted device. Power and signals are delivered on a common conductor that couples the head-mounted device to an accessory. One or both of the head-mounted device and the accessory are configured based on the signals. Power may be received at an accessory from the head-mounted device through a dedicated power conductor. Power may be delivered from a power source in a portable accessory to a head-mounted device that is coupled to the portable accessory and uses the power for circuitry in the head-mounted device that delivers audio to a user.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: October 4, 2011
    Inventors: Daniel M. Gauger, Jr., Roman Sapiejewski
  • Publication number: 20110216909
    Abstract: A headset including an earcup having a front opening adapted to be adjacent to the ear of a user, the earcup extending in a radial direction and an axial direction and defining an earcup volume; and a bellows cushion extending around the periphery of the front opening of the earcup and sized to engage the ear of the user, the bellows cushion comprising a plurality of folded segments located at an outer radial portion of the bellows cushion, and configured to be substantially compliant along an axial direction.
    Type: Application
    Filed: April 1, 2011
    Publication date: September 8, 2011
    Inventors: Roman Sapiejewski, Eric M. Wallace
  • Publication number: 20110211723
    Abstract: A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to couple the cushion to acoustic elements of an earphone. The first material occupies a first volume adjacent to the interior surface. The second material occupies a second volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.
    Type: Application
    Filed: March 7, 2011
    Publication date: September 1, 2011
    Inventors: Kevin P. Annunziato, Ian M. Collier, Michael Monahan, Roman Sapiejewski, William Tice
  • Patent number: 7970159
    Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated in
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: June 28, 2011
    Inventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
  • Patent number: 7916888
    Abstract: An earphone includes a first acoustic chamber including a reactive element and a resistive element in parallel, a second acoustic chamber separated from the first acoustic chamber by an acoustic transducer, and a housing to support the apparatus from the concha of a wearer's ear and to extend the second acoustic chamber into the ear canal of the wearer's ear. A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to accommodate an earphone. The first material occupies a volume adjacent to the interior surface. The second material occupies a volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: March 29, 2011
    Assignee: Bose Corporation
    Inventors: Roman Sapiejewski, William W. Tice, Jason M. Harlow, Ian M. Collier, Kevin P. Annunziato, Pericles Nicholas Bakalos, Michael J. Monahan
  • Publication number: 20110044464
    Abstract: An earpiece of an ANR device incorporates one or more of feedforward-based ANR; feedback-based ANR; passive noise reduction (PNR) of environmental noise sounds in the environment external to the casing of the earpiece in higher audible frequencies; a controlled leak acoustically coupling the front cavity to the environment external to the casing of the ANR device where the coupling may be through another cavity that is closable to the environment external to the casing with a leaky cover; a combination of an acoustically resistive port and a mass port coupling a rear cavity to the environment external to the casing where the coupling may be through another cavity that is closable to the environment external to the casing with a leaky cover; a feedforward microphone given acoustic access to the environment external to the casing through an aperture that is overlain with a leaky cover or that is enclosed within a cavity that is acoustically coupled to the environment external to the casing with a leak.
    Type: Application
    Filed: March 9, 2010
    Publication date: February 24, 2011
    Inventors: Roman Sapiejewski, Jason Harlow, Martin David Ring
  • Publication number: 20100128884
    Abstract: A headset including an earcup having a front opening adapted to be adjacent to the ear of the user, a baffle disposed within the earcup to define front and rear cavities, a cushion extending around the periphery of the front opening of the earcup and constructed and arranged to accommodate the ear of the user, the cushion having a first density, an inner radial portion, and an outer radial portion opposite the inner radial portion, a cushion cover substantially surrounding the cushion to form a headphone cushion assembly, and a high impedance component having a second density and located near the outer radial portion to increase the transmission loss of the cushion along a radial direction.
    Type: Application
    Filed: November 26, 2008
    Publication date: May 27, 2010
    Inventors: Roman Sapiejewski, Kevin P. Annunziato, Ian M. Collier, Jason Harlow
  • Publication number: 20100027803
    Abstract: An earphone for a supra-aural noise reducing headphone, with a front cavity that includes a foam portion and an open passageway. The foam portion supplements the volumetric dimension of the passageway to improve passive attenuation.
    Type: Application
    Filed: October 9, 2009
    Publication date: February 4, 2010
    Inventor: Roman Sapiejewski
  • Patent number: RE43939
    Abstract: A headset has an earcup with front opening adjacent to an annular cushion formed with a plurality of openings facing the inside of the earcup that acoustically couples the earcup volume to the cushion volume. A driver is seated inside the earcup with a microphone adjacent to the driver. Active noise reducing circuitry intercouples the driver and microphone. An acoustic load that may comprise a wire mesh resistive cover and/or air mass adjacent the microphone is constructed and arranged to reduce the effect of resonances in the earcup volume. A headset has an earcup with front opening adjacent to an annular cushion. A driver is seated inside the earcup with a microphone adjacent to the driver. Active noise reducing circuitry intercouples the driver and microphone. An acoustic load is constructed and arranged to reduce the effect of resonances in the earcup volume.
    Type: Grant
    Filed: January 8, 2004
    Date of Patent: January 22, 2013
    Assignee: Bose Corporation
    Inventors: Roman Sapiejewski, Michael J. Monahan