Patents by Inventor Roman Sapiejewski

Roman Sapiejewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090003616
    Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated in
    Type: Application
    Filed: June 25, 2008
    Publication date: January 1, 2009
    Applicant: Bose Corporation
    Inventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
  • Patent number: 7412070
    Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated in
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: August 12, 2008
    Assignee: Bose Corporation
    Inventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
  • Publication number: 20080152162
    Abstract: An electrical equalization module that is second order or higher. The equalization module is used to achieve a desired frequency response for audio headphones. The equalization module includes capacitors or inductors. The equalization module is a bridged-T circuit, parallel RLC circuit, or series RLC circuit.
    Type: Application
    Filed: December 27, 2006
    Publication date: June 26, 2008
    Inventors: Pericles Nicholas Bakalos, Roman Sapiejewski, Jason M. Harlow
  • Publication number: 20080002835
    Abstract: An earphone includes a first acoustic chamber including a reactive element and a resistive element in parallel, a second acoustic chamber separated from the first acoustic chamber by an acoustic transducer, and a housing to support the apparatus from the concha of a wearer's ear and to extend the second acoustic chamber into the ear canal of the wearer's ear. A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to accommodate an earphone. The first material occupies a volume adjacent to the interior surface. The second material occupies a volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Roman Sapiejewski, Kevin P. Annunziato, Ian M. Collier, William W. Tice, Jason M. Harlow
  • Publication number: 20070253568
    Abstract: A method and apparatus for increasing phase margin in a feedback circuit of an active noise reduction headphone. The method includes providing an acoustic block comprising an acoustic driver comprising a voice coil mechanically coupled along an attachment line to an acoustic energy radiating diaphragm, the acoustic block further comprising a microphone positioned along a line parallel to an intended direction of vibration of the acoustic diaphragm and intersecting the attachment line, the acoustic block characterized by a magnitude frequency response compensating the magnitude frequency response by a compensation pattern that has a positive slope over at least one spectral range above 10 kHz.
    Type: Application
    Filed: April 24, 2006
    Publication date: November 1, 2007
    Inventor: Roman Sapiejewski
  • Publication number: 20070253567
    Abstract: A method and apparatus for increasing phase margin in a feedback circuit of an active noise reduction headphone. The method includes providing an acoustic block comprising an acoustic driver comprising a voice coil mechanically coupled along an attachment line to an acoustic energy radiating diaphragm, the acoustic block further comprising a microphone positioned along a line parallel to an intended direction of vibration of the acoustic diaphragm and intersecting the attachment line, the acoustic block characterized by a magnitude frequency response compensating the magnitude frequency response by a compensation pattern that has a positive slope over at least one spectral range above 10 kHz.
    Type: Application
    Filed: April 24, 2006
    Publication date: November 1, 2007
    Inventor: Roman Sapiejewski
  • Publication number: 20070025561
    Abstract: Power is delivered from a power source in a head-mounted device to a separate accessory that is coupled to the head-mounted device. Power and signals are delivered on a common conductor that couples the head-mounted device to an accessory. One or both of the head-mounted device and the accessory are configured based on the signals. Power may be received at an accessory from the head-mounted device through a dedicated power conductor. Power may be delivered from a power source in a portable accessory to a head-mounted device that is coupled to the portable accessory and uses the power for circuitry in the head-mounted device that delivers audio to a user.
    Type: Application
    Filed: July 28, 2005
    Publication date: February 1, 2007
    Inventors: Daniel Gauger, Roman Sapiejewski
  • Publication number: 20060269090
    Abstract: An earphone for a supra-aural noise reducing headphone, with a front cavity that includes a foam portion and an open passageway. The foam portion supplements the volumetric dimension of the passageway.
    Type: Application
    Filed: May 27, 2005
    Publication date: November 30, 2006
    Inventor: Roman Sapiejewski
  • Publication number: 20050213774
    Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated in
    Type: Application
    Filed: March 29, 2004
    Publication date: September 29, 2005
    Inventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
  • Publication number: 20040264726
    Abstract: A microphone has first and second differentially interconnected capsules angularly and linearly displaced from each other by a predetermined amount.
    Type: Application
    Filed: June 30, 2003
    Publication date: December 30, 2004
    Inventors: Daniel M. Gauger, Clifford A. Henricksen, Kenneth Dylan Jacob, Roman Sapiejewski, Anthony J. Sarno, Michael H. Thomas
  • Patent number: 6831984
    Abstract: A module adapted for use in a noise reduction headset earcup has an enclosure having walls separating an interior of the enclosure from an exterior of the enclosure outside the earcup. There is a driver with a diaphragm. A port connects the interior and exterior. An acoustically resistive opening connects the interior and exterior in parallel with the port.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: December 14, 2004
    Assignee: Bose Corporation
    Inventor: Roman Sapiejewski
  • Patent number: 6683965
    Abstract: An in-the-ear earphone which is placed on a user's ear including a cushion and a shell body defining an internal cavity. The shell body has an extended portion shaped and sized to fit into a concha of the user's ear. The extended portion includes an aperture at an end thereof which aligns with the user's ear when the earphone is being worn by the user. The extended portion defines a passageway extending from the aperture to the internal cavity. The cushion covers at least part of the extended portion of the shell body and has an opening aligned with the aperture.
    Type: Grant
    Filed: October 20, 1995
    Date of Patent: January 27, 2004
    Assignee: Bose Corporation
    Inventor: Roman Sapiejewski
  • Patent number: 6597792
    Abstract: A headset has an earcup with front opening adjacent to an annular cushion formed with a plurality of openings facing the inside of the earcup that acoustically couples the earcup volume to the cushion volume. A driver is seated inside the earcup with a microphone adjacent to the driver. Active noise reducing circuitry intercouples the driver and microphone. An acoustic load that may comprise a wire mesh resistive cover and/or air mass adjacent the microphone is constructed and arranged to reduce the effect of resonances in the earcup volume.
    Type: Grant
    Filed: July 15, 1999
    Date of Patent: July 22, 2003
    Assignee: Bose Corporation
    Inventors: Roman Sapiejewski, Michael J. Monahan
  • Patent number: 6567525
    Abstract: A supra aural headphone including an earphone that includes a shell body, a cushion mounted on the shell to thereby define an internal cavity behind the cushion, and an acoustical driver mounted within the internal cavity to reproduce sound for the user when driven by an audio signal. The cushion has a passageway extending therethrough which acoustically connects the internal cavity with a user's ear cavity when the cushion is resting on the user's ear while being worn by the user. The internal cavity has a total volume that is larger than about 10 cubic centimeters, and the driver is mounted in such a way as to avoid obstructing the passageway.
    Type: Grant
    Filed: June 17, 1994
    Date of Patent: May 20, 2003
    Assignee: Bose Corporation
    Inventor: Roman Sapiejewski
  • Publication number: 20020015501
    Abstract: A module adapted for use in a noise reduction headset earcup has an enclosure having walls separating an interior of the enclosure from an exterior of the enclosure outside the earcup. There is a driver with a diaphragm. A port connects the interior and exterior. An acoustically resistive opening connects the interior and exterior in parallel with the port.
    Type: Application
    Filed: June 21, 2001
    Publication date: February 7, 2002
    Inventor: Roman Sapiejewski
  • Patent number: 6333982
    Abstract: A headset has a headband and at least a first earphone. A coupler comprising a pivot having a torque resistance opposing the rotation of said pivot intercouples the headband and first earphone. The pivot includes a torque adjuster establishing said torque resistance.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: December 25, 2001
    Assignee: Bose Corporation
    Inventors: Roman Sapiejewski, Michael J. Monahan
  • Patent number: 5305387
    Abstract: An earphone for use in an active noise reduction system includes a shell accommodating a microphone closely adjacent to a driver shaped and sized to fit in the concha of an ear.
    Type: Grant
    Filed: October 27, 1989
    Date of Patent: April 19, 1994
    Assignee: Bose Corporation
    Inventor: Roman Sapiejewski
  • Patent number: 5208868
    Abstract: Apparatus for reducing pressure inside a headphone includes a port between front and back cavities. Preferably there is a resistive element and a high compliance diaphragm.
    Type: Grant
    Filed: March 6, 1991
    Date of Patent: May 4, 1993
    Assignee: Bose Corporation
    Inventor: Roman Sapiejewski
  • Patent number: 5181252
    Abstract: An active noise reducing headset has a high compliance diaphragm. Structure limits the maximum excursion of the diaphragm so that the voice coil does not escape the air gap. Structure, such as indentations in the diaphragm, prevent unrecoverable diaphragm collapse.
    Type: Grant
    Filed: October 16, 1991
    Date of Patent: January 19, 1993
    Assignee: Bose Corporation
    Inventors: Roman Sapiejewski, John J. Breen
  • Patent number: 4989271
    Abstract: An improved cushion for use on a heater has a thin front skin formed with a circumferential groove. A thin flexible ring is attached to the circumferential groove. A flexible rear skin supports a foam ring and is sealed to the front skin so as to form a gel space. Structure, such as a retaining ring and mating holes and pins, attaches the cushion to the headset.
    Type: Grant
    Filed: August 24, 1989
    Date of Patent: February 5, 1991
    Assignee: Bose Corporation
    Inventors: Roman Sapiejewski, John J. Breen