Patents by Inventor Roman Sapiejewski
Roman Sapiejewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090003616Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated inType: ApplicationFiled: June 25, 2008Publication date: January 1, 2009Applicant: Bose CorporationInventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
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Patent number: 7412070Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated inType: GrantFiled: March 29, 2004Date of Patent: August 12, 2008Assignee: Bose CorporationInventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
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Publication number: 20080152162Abstract: An electrical equalization module that is second order or higher. The equalization module is used to achieve a desired frequency response for audio headphones. The equalization module includes capacitors or inductors. The equalization module is a bridged-T circuit, parallel RLC circuit, or series RLC circuit.Type: ApplicationFiled: December 27, 2006Publication date: June 26, 2008Inventors: Pericles Nicholas Bakalos, Roman Sapiejewski, Jason M. Harlow
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Publication number: 20080002835Abstract: An earphone includes a first acoustic chamber including a reactive element and a resistive element in parallel, a second acoustic chamber separated from the first acoustic chamber by an acoustic transducer, and a housing to support the apparatus from the concha of a wearer's ear and to extend the second acoustic chamber into the ear canal of the wearer's ear. A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to accommodate an earphone. The first material occupies a volume adjacent to the interior surface. The second material occupies a volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.Type: ApplicationFiled: June 30, 2006Publication date: January 3, 2008Inventors: Roman Sapiejewski, Kevin P. Annunziato, Ian M. Collier, William W. Tice, Jason M. Harlow
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Publication number: 20070253568Abstract: A method and apparatus for increasing phase margin in a feedback circuit of an active noise reduction headphone. The method includes providing an acoustic block comprising an acoustic driver comprising a voice coil mechanically coupled along an attachment line to an acoustic energy radiating diaphragm, the acoustic block further comprising a microphone positioned along a line parallel to an intended direction of vibration of the acoustic diaphragm and intersecting the attachment line, the acoustic block characterized by a magnitude frequency response compensating the magnitude frequency response by a compensation pattern that has a positive slope over at least one spectral range above 10 kHz.Type: ApplicationFiled: April 24, 2006Publication date: November 1, 2007Inventor: Roman Sapiejewski
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Publication number: 20070253567Abstract: A method and apparatus for increasing phase margin in a feedback circuit of an active noise reduction headphone. The method includes providing an acoustic block comprising an acoustic driver comprising a voice coil mechanically coupled along an attachment line to an acoustic energy radiating diaphragm, the acoustic block further comprising a microphone positioned along a line parallel to an intended direction of vibration of the acoustic diaphragm and intersecting the attachment line, the acoustic block characterized by a magnitude frequency response compensating the magnitude frequency response by a compensation pattern that has a positive slope over at least one spectral range above 10 kHz.Type: ApplicationFiled: April 24, 2006Publication date: November 1, 2007Inventor: Roman Sapiejewski
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Publication number: 20070025561Abstract: Power is delivered from a power source in a head-mounted device to a separate accessory that is coupled to the head-mounted device. Power and signals are delivered on a common conductor that couples the head-mounted device to an accessory. One or both of the head-mounted device and the accessory are configured based on the signals. Power may be received at an accessory from the head-mounted device through a dedicated power conductor. Power may be delivered from a power source in a portable accessory to a head-mounted device that is coupled to the portable accessory and uses the power for circuitry in the head-mounted device that delivers audio to a user.Type: ApplicationFiled: July 28, 2005Publication date: February 1, 2007Inventors: Daniel Gauger, Roman Sapiejewski
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Publication number: 20060269090Abstract: An earphone for a supra-aural noise reducing headphone, with a front cavity that includes a foam portion and an open passageway. The foam portion supplements the volumetric dimension of the passageway.Type: ApplicationFiled: May 27, 2005Publication date: November 30, 2006Inventor: Roman Sapiejewski
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Publication number: 20050213774Abstract: A noise reducing headset has one or more of the following features: (a) pair of earcups each seated in a yoke assembly mechanically coupled by a headband enclosing a flat spring formed with a slot that runs the length of the spring accommodating electrical wires electrically interconnecting electrical elements in the earcups, (b) each earcup having active noise reducing circuitry, (c) each earcup including a loudspeaker driver located off center in the earcup to allow an internal cavity inside each earcup to accommodate a loudspeaker driver, a microphone and an electronic printed circuit board and one of a battery and plug assembly, (d) one of the earcups accommodating a detachably secured plug assembly having a sensitivity switch covered by the earcup when the plug assembly is fully seated in the earcup, (e) the other earcup having a battery door that may be opened to allow insertion and removal of the battery and covered by a yoke assembly when the headset is worn by a user with the battery fully seated inType: ApplicationFiled: March 29, 2004Publication date: September 29, 2005Inventors: David Kleinschmidt, Leonid Pavlotsky, Roman Sapiejewski
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Publication number: 20040264726Abstract: A microphone has first and second differentially interconnected capsules angularly and linearly displaced from each other by a predetermined amount.Type: ApplicationFiled: June 30, 2003Publication date: December 30, 2004Inventors: Daniel M. Gauger, Clifford A. Henricksen, Kenneth Dylan Jacob, Roman Sapiejewski, Anthony J. Sarno, Michael H. Thomas
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Patent number: 6831984Abstract: A module adapted for use in a noise reduction headset earcup has an enclosure having walls separating an interior of the enclosure from an exterior of the enclosure outside the earcup. There is a driver with a diaphragm. A port connects the interior and exterior. An acoustically resistive opening connects the interior and exterior in parallel with the port.Type: GrantFiled: June 21, 2001Date of Patent: December 14, 2004Assignee: Bose CorporationInventor: Roman Sapiejewski
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Patent number: 6683965Abstract: An in-the-ear earphone which is placed on a user's ear including a cushion and a shell body defining an internal cavity. The shell body has an extended portion shaped and sized to fit into a concha of the user's ear. The extended portion includes an aperture at an end thereof which aligns with the user's ear when the earphone is being worn by the user. The extended portion defines a passageway extending from the aperture to the internal cavity. The cushion covers at least part of the extended portion of the shell body and has an opening aligned with the aperture.Type: GrantFiled: October 20, 1995Date of Patent: January 27, 2004Assignee: Bose CorporationInventor: Roman Sapiejewski
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Patent number: 6597792Abstract: A headset has an earcup with front opening adjacent to an annular cushion formed with a plurality of openings facing the inside of the earcup that acoustically couples the earcup volume to the cushion volume. A driver is seated inside the earcup with a microphone adjacent to the driver. Active noise reducing circuitry intercouples the driver and microphone. An acoustic load that may comprise a wire mesh resistive cover and/or air mass adjacent the microphone is constructed and arranged to reduce the effect of resonances in the earcup volume.Type: GrantFiled: July 15, 1999Date of Patent: July 22, 2003Assignee: Bose CorporationInventors: Roman Sapiejewski, Michael J. Monahan
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Patent number: 6567525Abstract: A supra aural headphone including an earphone that includes a shell body, a cushion mounted on the shell to thereby define an internal cavity behind the cushion, and an acoustical driver mounted within the internal cavity to reproduce sound for the user when driven by an audio signal. The cushion has a passageway extending therethrough which acoustically connects the internal cavity with a user's ear cavity when the cushion is resting on the user's ear while being worn by the user. The internal cavity has a total volume that is larger than about 10 cubic centimeters, and the driver is mounted in such a way as to avoid obstructing the passageway.Type: GrantFiled: June 17, 1994Date of Patent: May 20, 2003Assignee: Bose CorporationInventor: Roman Sapiejewski
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Publication number: 20020015501Abstract: A module adapted for use in a noise reduction headset earcup has an enclosure having walls separating an interior of the enclosure from an exterior of the enclosure outside the earcup. There is a driver with a diaphragm. A port connects the interior and exterior. An acoustically resistive opening connects the interior and exterior in parallel with the port.Type: ApplicationFiled: June 21, 2001Publication date: February 7, 2002Inventor: Roman Sapiejewski
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Patent number: 6333982Abstract: A headset has a headband and at least a first earphone. A coupler comprising a pivot having a torque resistance opposing the rotation of said pivot intercouples the headband and first earphone. The pivot includes a torque adjuster establishing said torque resistance.Type: GrantFiled: April 1, 1996Date of Patent: December 25, 2001Assignee: Bose CorporationInventors: Roman Sapiejewski, Michael J. Monahan
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Patent number: 5305387Abstract: An earphone for use in an active noise reduction system includes a shell accommodating a microphone closely adjacent to a driver shaped and sized to fit in the concha of an ear.Type: GrantFiled: October 27, 1989Date of Patent: April 19, 1994Assignee: Bose CorporationInventor: Roman Sapiejewski
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Patent number: 5208868Abstract: Apparatus for reducing pressure inside a headphone includes a port between front and back cavities. Preferably there is a resistive element and a high compliance diaphragm.Type: GrantFiled: March 6, 1991Date of Patent: May 4, 1993Assignee: Bose CorporationInventor: Roman Sapiejewski
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Patent number: 5181252Abstract: An active noise reducing headset has a high compliance diaphragm. Structure limits the maximum excursion of the diaphragm so that the voice coil does not escape the air gap. Structure, such as indentations in the diaphragm, prevent unrecoverable diaphragm collapse.Type: GrantFiled: October 16, 1991Date of Patent: January 19, 1993Assignee: Bose CorporationInventors: Roman Sapiejewski, John J. Breen
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Patent number: 4989271Abstract: An improved cushion for use on a heater has a thin front skin formed with a circumferential groove. A thin flexible ring is attached to the circumferential groove. A flexible rear skin supports a foam ring and is sealed to the front skin so as to form a gel space. Structure, such as a retaining ring and mating holes and pins, attaches the cushion to the headset.Type: GrantFiled: August 24, 1989Date of Patent: February 5, 1991Assignee: Bose CorporationInventors: Roman Sapiejewski, John J. Breen