Patents by Inventor Roman Sapiejewski

Roman Sapiejewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4975966
    Abstract: A low puff boom microphone includes a protective grid covering an end portion of the microphone housing, a microphone capsule near the protective grid, a layer of material between the protective grid and microphone capsule, a spacer between the layer of material, and an open area laterally of the spacer.
    Type: Grant
    Filed: August 24, 1989
    Date of Patent: December 4, 1990
    Assignee: Bose Corporation
    Inventor: Roman Sapiejewski
  • Patent number: 4922542
    Abstract: A baffle, which supports a driver for converting an input electrical signal into an acoustical output signal, is mounted to a headphone cup via a first cushion which sufficiently spaces the baffle from an outer ear to avoid contact. The baffle defines a front cavity and a rear cavity. A second cushion which forms an oval opening large enough to encompass the outer ear is mounted on the headphone cup for establishing an air seal between the front cavity and a region outside the headphone cup.
    Type: Grant
    Filed: December 28, 1987
    Date of Patent: May 1, 1990
    Inventor: Roman Sapiejewski
  • Patent number: 4856118
    Abstract: A headphone cushion comprises two concentric rings of nonliquid gelatin-like silicone on a layer of soft, slow recovery foam enclosed in a thin stretchable layer of polyurethane skin.
    Type: Grant
    Filed: February 11, 1987
    Date of Patent: August 15, 1989
    Assignee: Bose Corporation
    Inventor: Roman Sapiejewski
  • Patent number: 4644581
    Abstract: Headphones have a small cavity between the diaphragm and the ear canal with a microphone in the cavity closely adjacent to the diaphragm slightly off the axis of the ear canal and headphone diaphragm with the microphone membrane perpendicular to the headphone diaphragm. The microphone provides a feedback signal that is combined with the input electrical signal to be reproduced by the headphones to provide a combined signal that is power amplified for driving the diaphragm. The headphone transducer has a small 23 mm diameter diaphragm with a maximum excursion of 0.6 mm peak-to-peak and a low frequency resonance of 200 Hz. A disk of intracavity damping material inside the cavity isolates the microphone from the ear canal.
    Type: Grant
    Filed: June 27, 1985
    Date of Patent: February 17, 1987
    Assignee: Bose Corporation
    Inventor: Roman Sapiejewski