Patents by Inventor Sandor Farkas

Sandor Farkas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230136471
    Abstract: A system for preventing crosstalk between adjacent channels comprises a crossover connector positioned along a length of one channel such that a portion of a positive trace for a first channel is positioned adjacent to a positive trace of a positive trace of an adjacent channel. The position of the crossover connector is based on preventing crosstalk and crossover connectors on adjacent channels may be staggered to further prevent crosstalk. A crossover connector may be based on capacitors or resistors to prevent crosstalk.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 4, 2023
    Inventors: Bhyrav Mutnury, Sandor Farkas
  • Publication number: 20230134420
    Abstract: A high performance differential cable comprises a bulk differential cable formed with a dielectric core having a central cavity and a plurality of wire guides on the outer perimeter. A pair of differential signal conductors (DSC) may be divided into two sets of wires. The smaller wires provide higher signal transmission speeds with lower losses. A paddle board at each end of the bulk differential cable comprises an interconnecting structure for combining signals from the two sets of wires into the two DSCs.
    Type: Application
    Filed: October 28, 2021
    Publication date: May 4, 2023
    Inventors: Bhyrav Mutnury, Sandor Farkas
  • Publication number: 20230133833
    Abstract: A system for providing signal temperature immunity to a printed circuit board (PCB) comprises moating a set of reference planes, forming a trench between a heat source and a stripline trace and positioning a perforated section of a plane on a reference plane opposite the heat source. Moating the reference planes increases thermal resistance, the trench removes dielectric material and replaces it with air and the perforated section causes heat to travel in a non-linear path. Vias positioned at the ends of the PCB route heat along the outer surfaces of the PCB to transfer heat to the ambient environment.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 4, 2023
    Inventors: Bhyrav Mutnury, Sandor Farkas
  • Publication number: 20230128773
    Abstract: A connection assembly, including: a first connector having a first end and a second end, and a first surface extending between the first end and the second end, the first connector including press fit pins extending away from the first surface, each of the press fit pins including: a rod portion; a connecting portion having a first shape; a second connector having a first end and a second end, including: a dielectric carrier having a first surface extending between the first end and the second end of the second connector, receptacles positioned within the first surface of the dielectric carrier, each of the receptacles including: a cylindrical region, a tapered region having a second shape that corresponds to the first shape of the connection portion, wherein, when the first connector is coupled to the second connector, the press fit pins are positioned within respective receptacles of the receptacles.
    Type: Application
    Filed: October 21, 2021
    Publication date: April 27, 2023
    Inventors: Bhyrav M. Mutnury, Mark A. Smith, Sanjiv C. Sinha, Sandor Farkas
  • Publication number: 20230130196
    Abstract: A memory module socket, including a first member extending between a first end and a second end of the socket, the second end of the socket opposite to the first end of the socket, the first member positioned along a first side of the socket, the first member including: a plurality of first contact pins, each of the first contact pins including a first contact point and a second contact point; a plurality of first resistive coatings connecting two or more of the first contact pins to define first groupings of contact pins; a plurality of first ribs separating each of the first groupings of first contact pins; wherein when the first contact pins are in a first position, the second contact points of the first contact pins are in contact with respective first resistive coatings to complete a termination to ground.
    Type: Application
    Filed: October 21, 2021
    Publication date: April 27, 2023
    Inventors: Bhyrav M. Mutnury, Mark A. Smith, Sandor Farkas
  • Publication number: 20230125954
    Abstract: In one or more embodiments, one or more systems, one or more methods, and/or one or more processes may receive, by a first conductive element of multiple conductive elements of an electromagnetic coupler device, a first signal; receive, by a second conductive element of the multiple conductive elements, a second signal; electromagnetically couple, by the multiple conductive elements, at least a portion of the first signal with the second signal; electromagnetically couple, by the multiple conductive elements, at least a portion of the second signal with the first signal; provide, by the first conductive element, the first signal with the at least the portion of the second signal to a first transmission line; and provide, by the second conductive element, the second signal with the at least the portion of the first signal to a second transmission line.
    Type: Application
    Filed: October 22, 2021
    Publication date: April 27, 2023
    Inventors: Bhyrav Mutnury, Sandor Farkas
  • Patent number: 11604745
    Abstract: An information handling system may include a processor, a device communicatively coupled to a processor via a communications link including a cable assembly, and a management controller communicatively coupled to the processor and communicatively coupled to the device and the cable assembly via a sideband interface, and configured to: retrieve, via the sideband interface, self-describing signal integrity critical parameters from non-transitory computer-readable media integral to the device; retrieve, via the sideband interface, self-describing signal integrity critical parameters from non-transitory computer-readable media integral to the cable assembly; combine the self-describing signal integrity critical parameters from non-transitory computer-readable media integral to the device and the self-describing signal integrity critical parameters from non-transitory computer-readable media integral to the cable assembly into aggregate signal integrity critical parameters; and perform an action relevant to the co
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: March 14, 2023
    Assignee: Dell Products L.P.
    Inventors: Timothy M. Lambert, Bhyrav M. Mutnury, Sandor Farkas
  • Patent number: 11602043
    Abstract: A system may include a circuit board comprising a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together, wherein the plurality of electrically-conductive layers comprises a ground plane and the layers of insulating material comprise a surface layer having one or more openings through which the ground plane is exposed through the one or more openings. The system may also include a plurality of electrically-conductive pads formed on a surface of the surface layer and a cable comprising a first signal conductor mechanically contacted to a first pad of the plurality of electrically-conductive pads and a first drain conductor mechanically contacted to the ground plane through the one or more openings.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: March 7, 2023
    Assignee: Dell Products L.P.
    Inventors: Sandor Farkas, Bhyrav Mutnury
  • Patent number: 11592795
    Abstract: In one or more embodiments, a liquid management system may include multiple impellers; multiple liquid transfer lines; a first impeller system that includes a first impeller of the multiple impellers; a second impeller system that includes a second impeller of the multiple impellers; and a shaft, coupled to the first impeller system and coupled to the second impeller system and configured to transfer the at least the portion of the energy to the second impeller system. The liquid management system may be configured to be coupled to an information handling system. The first impeller system may be configured to harvest, via rotation of the first impeller, energy from a flow of a liquid. The second impeller system may be configured to create pressure difference between two of the multiple liquid transfer lines coupled to the second impeller system.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: February 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Sandor Farkas, Kevin Warren Mundt, Michael J. Stumpf
  • Patent number: 11593530
    Abstract: An information handling system includes an intrusion detection circuit having two inductors and an amplifier circuit. The amplifier circuit is configured to identify an increase in inductive coupling between the inductors in response to a change in position of a cover.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: February 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Sandor Farkas, Bhyrav M. Mutnury
  • Publication number: 20230059860
    Abstract: An information handing system includes a transmitter, a receiver, and a differential signal channel. The transmitter provides a differential signal on a pair of differential outputs. The receiver receives the differential signal on a pair of differential inputs. The differential signal channel carries the differential signal from the differential outputs to the differential inputs. The differential signal is provided on the differential signal channel as a voltage swing between a first positive voltage and a first negative voltage with reference to a ground plane of the information handling system.
    Type: Application
    Filed: August 18, 2021
    Publication date: February 23, 2023
    Inventors: Sandor Farkas, Bhyrav Mutnury
  • Patent number: 11582864
    Abstract: A printed circuit board for an information handling system includes a trace, a routing component, and one or more intermediate components. The trace has a first impedance, and the routing component has a second impedance. The intermediate components have respective intermediate impedances. Each of the intermediate impedances has a corresponding value in a range between a value of the first impedance and a value of the second impedance. The one or more intermediate impedances reduce an impedance discontinuity between the trace and the routing component.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: February 14, 2023
    Assignee: Dell Products L.P.
    Inventors: Sandor Farkas, Bhyrav Mutnury
  • Patent number: 11579074
    Abstract: An information handling system includes a corrosion controller that may monitor a corrosion sensor array, and determine a type of the corrosion based on a location of a corrosion sensor. The corrosion type may include humidity driven corrosion and non-humidity driven corrosion.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: February 14, 2023
    Assignee: Dell Products L.P.
    Inventors: Jon T. Fitch, Steven Embleton, Sandor Farkas, Danny King
  • Publication number: 20230036814
    Abstract: A contact for a high-speed data communication interface includes a first portion configured to be coupled to a first component associated with the high-speed data communication interface, a second portion configured to be coupled to a mating contact of a second component associated with the high-speed data communication interface, and a third portion configured to provide a sliding surface when coupled to the mating contact. The sliding surface is coated with a ferromagnetic coating.
    Type: Application
    Filed: July 21, 2021
    Publication date: February 2, 2023
    Inventors: Sandor Farkas, Bhyrav Mutnury
  • Publication number: 20230032371
    Abstract: A paddle card includes a printed circuit board and a twin-axial cable. The PCB includes a first signal pad on a top surface of the PCB and a second signal pad on a bottom surface of the PCB. The second signal pad is directly below the first signal pad. The twin-axial cable includes a first signal conductor coupled to the first signal pad and a second signal conductor coupled to the second signal pad.
    Type: Application
    Filed: July 27, 2021
    Publication date: February 2, 2023
    Inventors: Sandor Farkas, Bhyrav Mutnury
  • Publication number: 20230031615
    Abstract: A printed circuit board (PCB) is provided for transmitting a differential signal. The PCB includes first and second conductive signal layers. The first conductive signal layer includes a first positive trace of the differential signal and a first negative trace of the differential signal. The second conductive signal layer includes a second positive trace of the differential signal and a second negative trace of the differential signal. The first positive trace is adjacent to the first negative trace, and the second positive trace is adjacent to the second negative trace and directly below the first negative trace.
    Type: Application
    Filed: July 27, 2021
    Publication date: February 2, 2023
    Inventors: Sandor Farkas, Bhyrav Mutnury
  • Publication number: 20230028514
    Abstract: A cable such as a server cable may have a tapered termination portion that when connected to other information handling system components reduces the loss of signal between the cable and the information handling system component. A method of making a cable with a tapered termination portion comprising heating a wire having an end and a body portion, the body portion having a first diameter; pulling the end relative to the body portion, for example with a clamp coupled to the end under tension, to obtain a location between the end and the body portion having a second diameter smaller than the first diameter; and cutting the wire at the location.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 26, 2023
    Applicant: Dell Products L.P.
    Inventors: Kevin Warren Mundt, Bhyrav Murthy Mutnury, Sandor Farkas
  • Publication number: 20230028314
    Abstract: A twin-axial cable is provided for high-speed data communication. The twin-axial cable includes a first conductor surrounded by a first portion of an incompressible insulating material and a second conductor surrounded by a second portion of the incompressible insulating material. The first and second conductors are arranged in line in a first axis at a distance apart. A profile of the first and second portions is an elongated profile along a second axis perpendicular to the first axis, such that a first height of the profile is greater than the distance.
    Type: Application
    Filed: July 21, 2021
    Publication date: January 26, 2023
    Inventors: Sandor Farkas, Bhyrav Mutnury
  • Publication number: 20230026653
    Abstract: An apparatus includes an interface with a plurality of channels; a multiplexer coupled to the interface and configured to couple transmit circuitry to a first channel mapped as a transmit path in a channel configuration and to couple receive circuitry to a second channel mapped as a receive path in the channel configuration; and a controller coupled to the multiplexer. The controller may be configured to perform the steps including determining a figure of merit of at least one channel of the plurality of channels of the interface; determining the channel configuration mapping transmit and receive paths to the plurality of the channels of the interface; and controlling the multiplexer to couple transmit circuitry to the first channel mapped as a transmit path in the channel configuration and to couple receive circuitry to the second channel mapped as a receive path in the channel configuration for dynamic channel swap(s).
    Type: Application
    Filed: July 21, 2021
    Publication date: January 26, 2023
    Applicant: Dell Products L.P.
    Inventors: Timothy M. Lambert, Bhyrav Murthy Mutnury, Sandor Farkas
  • Publication number: 20220408546
    Abstract: A system may include a circuit board comprising a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together, wherein the plurality of electrically-conductive layers comprises a ground plane and the layers of insulating material comprise a surface layer having one or more openings through which the ground plane is exposed through the one or more openings. The system may also include a plurality of electrically-conductive pads formed on a surface of the surface layer and a cable comprising a first signal conductor mechanically contacted to a first pad of the plurality of electrically-conductive pads and a first drain conductor mechanically contacted to the ground plane through the one or more openings.
    Type: Application
    Filed: June 22, 2021
    Publication date: December 22, 2022
    Applicant: Dell Products L.P.
    Inventors: Sandor FARKAS, Bhyrav MUTNURY