Abstract: The method may include: in a first measurement phase, generating a first input signal to the first input terminal of a leak detection cable interface circuit and receiving a first response signal in response the first input signal; in a second measurement phase, generating a second input signal to the second input terminal of the leak detection cable interface circuit and receiving a second response signal in response the second input signal; and based on at least the first response signal and the second response signal, determining a state of a leak detection cable communicatively coupled to the leak detection cable interface circuit.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may receive a digital voltage value from an analog to digital converter; may determine a resistance value of a device that includes a plurality of conductors separated from each other by a distance and a material that includes a substance that forms an electrically conductive solution when dissolved by a polar solvent and that is configured to receive a liquid that removes heat from one or more components of the information handling system; may determine that the resistance value of the device is at or below a threshold resistance value; and in response to determining that the resistance value of the device is at or below the threshold resistance value, may provide information that indicates a leak of the liquid.

Abstract: An improved electrical cable design for high-speed, low loss signal transmission. The improved cable design may be a three-conductor cable having a center conductor, a middle conductor and an outer conductor, where each conductor is separated by a dielectric layer. The electrical cable provides an inverted cable design, in which signal transmission occurs within the middle conductor, the center conductor is used as a return or drain line to ground and the outer conductor is used as a shield. The middle conductor of the electrical cable provides a larger surface area for signal conductance than the center conductor, thereby transmitting signals with significantly less loss (e.g., at least 50% less loss).

Abstract: An information handling system includes first and second lines of a differential pair. A baseboard management controller (BMC) periodically determines a resistance of the first line and a resistance of the second line. If the first resistance is substantially equal to the second resistance, then the BMC provides a corrosion signal to a remote diagnostic system.

Abstract: A printed circuit board includes first and second signal pads, and first, second, and third ground pads. The first and second signal pads and the first and second ground pads are arranged in a line with the first and second signal pads between the first and second ground pads. The third ground pad is arranged between the first and second signal pads but is not in line with the first and second signal pads.

Abstract: An apparatus includes a transmitter circuit configured to provide a transmitted waveform at a transmitter output, and a first microstrip differential trace extending from a first microstrip differential trace first end to a first microstrip differential trace second end. A first resistor has a first resistor first end coupled to the transmitter output and a first resistor second end coupled to the first microstrip differential trace first end. A second microstrip differential trace extends from a second microstrip differential trace first end to a second microstrip differential trace second end. A second resistor has a second resistor first end coupled to the transmitter output and a second resistor second end coupled to the second microstrip differential trace first end. A first receiver circuit has a first receiver circuit input coupled to the first microstrip differential trace second end, the first receiver configured to provide a first received signal.

Abstract: A printed circuit board (PCB) includes a plurality of layers and electronic components connected to its top surface. The PCB also includes a plurality of trace layers, each located at a respective depth within the layers of the PCB. A plurality of vias provide signal pathways for the trace layer. Upon their manufacture, the vias include a stub portion not necessary for the signal pathways and causing degradation of the integrity of these signal pathways. Embodiments mill the bottom of the PCB to form a variable-depth cavity. The different milling depths of the variable-depth cavity are selected to remove the stub portions of the plurality of vias and the dielectric material between the stubs. By configuring the PCB power planes as the topmost trace layers, decoupling capacitors may be located at the greatest depth of the variable-depth cavity, thus reducing the loop inductance in the power circuit of the PCB.

Abstract: An apparatus includes a transmitter circuit configured to provide a transmitted waveform at a transmitter output, and a first microstrip differential trace extending from a first microstrip differential trace first end to a first microstrip differential trace second end. A first resistor has a first resistor first end coupled to the transmitter output and a first resistor second end coupled to the first microstrip differential trace first end. A second microstrip differential trace extends from a second microstrip differential trace first end to a second microstrip differential trace second end. A second resistor has a second resistor first end coupled to the transmitter output and a second resistor second end coupled to the second microstrip differential trace first end. A first receiver circuit has a first receiver circuit input coupled to the first microstrip differential trace second end, the first receiver configured to provide a first received signal.

Abstract: A printed circuit board includes first and second signal pads, and first, second, and third ground pads. The first and second signal pads and the first and second ground pads are arranged in a line with the first and second signal pads between the first and second ground pads. The third ground pad is arranged between the first and second signal pads but is not in line with the first and second signal pads.

Abstract: An information handling system may include a central processing unit (CPU) and a device. The CPU may have an I/O system and be configured to host a BIOS. The device may be communicatively connected to the I/O system of the CPU by a connection. The BIOS may determine a communication protocol used by the device for communication and set an equalization of the I/O system for communication with the device based on the communication protocol used by the device.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may determine a first height of a first eye diagram of a differential pair of circuit board traces of a circuit board of an information handling system; may determine a first width of the first eye diagram; may transfer a liquid above an area of the circuit board; may provide a differential signal to the differential pair; may determine a second height of a second eye diagram of the differential pair; may determine a second width of the second eye diagram; may determine at least one of that the second height is less than the first height by at least a first threshold and that the second width is less than the first width by at least a second threshold; and may provide information that indicates a presence of the liquid on the circuit board.

Abstract: In one or more embodiments, a liquid management system may include multiple impellers; multiple liquid transfer lines; a first impeller system that includes a first impeller of the multiple impellers; a second impeller system that includes a second impeller of the multiple impellers; and a shaft, coupled to the first impeller system and coupled to the second impeller system and configured to transfer the at least the portion of the energy to the second impeller system. The liquid management system may be configured to be coupled to an information handling system. The first impeller system may be configured to harvest, via rotation of the first impeller, energy from a flow of a liquid. The second impeller system may be configured to create pressure difference between two of the multiple liquid transfer lines coupled to the second impeller system.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may receive a digital voltage value from an analog to digital converter; may determine a resistance value of a device that includes a plurality of conductors separated from each other by a distance and a material that includes a substance that forms an electrically conductive solution when dissolved by a polar solvent and that is configured to receive a liquid that removes heat from one or more components of the information handling system; may determine that the resistance value of the device is at or below a threshold resistance value; and in response to determining that the resistance value of the device is at or below the threshold resistance value, may provide information that indicates a leak of the liquid.

Abstract: A non-rectangular connection pad for coupling discrete components to connection pads reduces the capacitance in the connection pad area, and thus maintains a more uniform characteristic impedance along the length of the trace. The pad shape is changed to reduce the area of the pad. The reduced area reduces or eliminates change in characteristic impedance of the trace incorporating the connection pad and discrete component attached to the connection pad. An irregular pad shape may be used to decrease the soldering area of the discrete component, while still maintaining wettability of the solder. One example of such a non-rectangular connection pad is a C-shaped connection pad. Such connection pad shapes can be used on traces for high-speed circuits (e.g., PCIe, USB, SATA, and other traces carrying signals above 1 GHz).

Abstract: An information handling system includes an intrusion detection circuit having two inductors and an amplifier circuit. The amplifier circuit is configured to identify an increase in inductive coupling between the inductors in response to a change in position of a cover.

Abstract: A circuit board flex cable system includes a flex cable extending from a circuit board. A data transmission stack extends through the flex cable and the circuit board, and includes a first ground layer extending along its length and including a first grounding element, and a second ground layer extending along its length, spaced part from the first ground layer, and including a second grounding element. A signal layer in the data transmission stack extends along the length of the data transmission stack, is located between the first ground layer and the second ground layer, and includes a signal element that transmits signals. A third grounding element in the signal layer of the data transmission stack is provided adjacent the signal element and extends along a length of the data transmission stack adjacent to a termination of the flex cable in the circuit board.

Abstract: An information handling system (IHS) has a circuit board assembly with a dual-sided interposer substrate that is inserted between a baseboard and a processor integrated circuit having a second pattern of electrical contacts. The dual interposer substrate formed of a stack of printed circuit boards (PCBs) provides communication channels between a first coupling pad on the baseboard that has a first pattern of electrical contacts and a second coupling pad on top of the dual interposer substrate that provides the second pattern of electrical contacts. The second pattern receives another type of processor integrated circuit than a type supported by the first pattern. Stacked vias formed through the stack of PCBs electrically connect respective electrical contacts of the first and second coupling pads to form a corresponding communication channel. One or more grounded vias mitigate signal integrity (SI) anomalies on the communication channels.

Abstract: A dual-axial cable may include adjacent and substantially parallel first and second wires, each wire formed from an electrical conductor surrounded by a respective first and second electrical insulator having a lengthwise flat face outward side and having respective first and second inward sides of an interlocking structure, the first and second inward sides of the interlocking structure of the first and second electrical insulators mutually engaging to prevent a relative transverse displacement of the first and second wires and maintaining planar alignment of the flat face and electrical conductor of the first and second wires and to maintain the flat faces parallel to one another. The dual-axial cable may also include first and second drain conductors formed respectively on the flat faces of the first and second electrical insulators and running adjacent and substantially parallel to the first and second electrical conductors.

Abstract: A dual-axial cable may include adjacent and substantially parallel first and second wires, each wire formed from an electrical conductor surrounded by a respective first and second electrical insulator having a lengthwise flat face outward side and having respective first and second inward sides of an interlocking structure, the first and second inward sides of the interlocking structure of the first and second electrical insulators mutually engaging to prevent a relative transverse displacement of the first and second wires and maintaining planar alignment of the flat face and electrical conductor of the first and second wires and to maintain the flat faces parallel to one another. The dual-axial cable may also include first and second drain conductors formed respectively on the flat faces of the first and second electrical insulators and running adjacent and substantially parallel to the first and second electrical conductors.

Abstract: The method may include: in a first measurement phase, generating a first input signal to the first input terminal of a leak detection cable interface circuit and receiving a first response signal in response the first input signal; in a second measurement phase, generating a second input signal to the second input terminal of the leak detection cable interface circuit and receiving a second response signal in response the second input signal; and based on at least the first response signal and the second response signal, determining a state of a leak detection cable communicatively coupled to the leak detection cable interface circuit.