Abstract: A decoupling capacitor, a wafer stack package including the decoupling capacitor, and a method of fabricating the wafer stack package are provided. The decoupling capacitor may include a first electrode formed on an upper surface of a first wafer, a second electrode formed on a lower surface of a second wafer, and an adhesive material having a high dielectric constant and combining the first wafer with the second wafer. In the decoupling capacitor the first and second electrodes operate as two electrodes of the decoupling capacitor, and the adhesive material operates as a dielectric of the decoupling capacitor.

Abstract: A chip stack may include a first chip and a second chip stacked on the first chip. Each of the first and second chips may include a substrate having an active surface and an inactive surface opposite to the active surface; an internal circuit in the active surface; an I/O chip pad on the active surface and connected to the internal circuit through an I/O buffer; and a I/O connection pad connected to the I/O chip pad through the I/O buffer by a circuit wiring. A redistributed I/O chip pad layer may be on the active surface of the first chip, the redistributed I/O chip pad layer redistributing the I/O chip pad. The I/O connection pads of the first chip and the second chip may be electrically connected to each other by an electrical connecting part.

Abstract: Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.

Abstract: In one embodiment, a semiconductor package structure includes a heat dissipative element connected to an internal circuit. The semiconductor package includes a semiconductor chip, an interconnection substrate, and a heat dissipative element. The semiconductor chip includes an internal circuit and inner pads that connect the internal circuit. The interconnection substrate is disposed below the semiconductor chip and includes input/output terminals. At least one of the inner pads is electrically connected to at least one of the input/output terminals. The heat dissipative element is disposed on the semiconductor chip and is electrically connected to at least one of the inner pads.

Abstract: An embodiment may comprise a test probe to measure electrical properties of a semiconductor package having ball-shaped terminals. The probe may include a signal tip and a ground tip. The signal tip may have a spherical lower surface allowing good contact with a ball-shaped signal terminal. The ground tip may be extended from a lower end of a ground barrel that encloses the signal tip. The ground tip may move independent of the signal tip by means of a barrel stopper and a spring. Thus, the probe can be used regardless of the size of and the distance between the package terminals.

Abstract: In one embodiment, a heat-dissipating member includes a heat-dissipating body, a heat-transferring body and an attaching member. The heat-dissipating body externally dissipates heat originating in a heat source. The heat-transferring member is interposable between the heat-dissipating body and the heat source. The attaching member is placed on a surface of the heat-dissipating body and corresponds to the heat-transferring body so as to couple the heat-transferring member to the heat-dissipating body. Thus, heat generated from the heat source, such as a semiconductor element, rapidly dissipates through the heat-transferring member and externally through the heat-dissipating body.

Abstract: An embodiment may comprise a test probe to measure electrical properties of a semiconductor package having ball-shaped terminals. The probe may include a signal tip and a ground tip. The signal tip may have a spherical lower surface allowing good contact with a ball-shaped signal terminal. The ground tip may be extended from a lower end of a ground barrel that encloses the signal tip. The ground tip may move independent of the signal tip by means of a barrel stopper and a spring. Thus, the probe can be used regardless of the size of and the distance between the package terminals.

Abstract: An embodiment includes a dual interconnection form in which power/ground pads and signal pads of a semiconductor chip are electrically connected to a package substrate in different connection manners. First connection members that electrically connect the power/ground pads with the substrate have relatively large cross-sectional dimensions in comparison to its length, for example, solder bumps or gold bumps. Second connection members that electrically connect the signal pads with the substrate have relatively small cross-sectional dimensions in comparison its length, for example, conductive wires or beam leads. Such different ways of electrically connecting different kinds of pads with the substrate realize the most suitable electrical performance, effectively meeting the needs of high speed and low power consumption of the semiconductor devices.

Abstract: The present invention relates to a three-dimensional semiconductor module having at least one unit semiconductor device connected to the outer-facing side surfaces of a multi-side ground block. The unit semiconductor device has a structure in which a semiconductor package (or semiconductor chip) is mounted on a unit wiring substrate. Ground pads to be connected to the outer-facing side surfaces of the ground block are formed on the first surface of the unit wiring substrate, the semiconductor chip is mounted on the second surface opposite to the first surface, and contact terminals electrically connected to the semiconductor chip are formed on the second surface.

Abstract: A semiconductor chip package has a substrate that includes circuit lines provided on first and/or second surfaces, a power plane provided on the second surface, bump lands provided on the second surface and coupled to the circuit lines, and ball lands provided on the first surface. The package further has a semiconductor chip attached to the second surface of the substrate and electrically coupled to the circuit lines, and a dielectric layer provided on the second surface of the substrate. The dielectric layer surrounds laterally the chip, covers the power plane, and exposes the bump lands. The package further has a ground plane provided on both the chip and the dielectric layer, vertical connection bumps provided within the dielectric layer and on the bump lands and electrically coupled to the ground plane, and solder balls provided on the ball lands.

Abstract: A semiconductor package module having no solder balls and a method of manufacturing the semiconductor package module are provided. The semiconductor package module includes a module board on which a plurality of semiconductor devices are able to be mounted, a semiconductor package bonded on the module board using an adhesive, being wire-bondable to the module board, and having already undergone an electrical final test, second wires electrically connecting second bond pads of the semiconductor package to bond pads of the module board; and a third sealing resin enclosing the second wires and the semiconductor package. Because the semiconductor package module does not use solder balls, degradation of solder joint reliability (SJR) can be prevented. Further, the use of a semiconductor package that has already undergone an electrical test can reduce degradation of the yield of a completed semiconductor package module.

Abstract: Aspects of the subject matter described herein relate to a packaged semiconductor die which becomes a component of a finished multi-chip package. The packaged semiconductor die comprises a die substrate, a semiconductor package, and a sealant. The die substrate includes an insulating substrate and a circuit pattern formed on the insulating substrate. The semiconductor package has a semiconductor chip electrically coupled to the circuit pattern that is a known good package and is coupled to the die substrate. The sealant seals the semiconductor package. The packaged semiconductor die utilizes a known good package which has passed a series of package tests.

Abstract: An embodiment may comprise a test probe to measure electrical properties of a semiconductor package having ball-shaped terminals. The probe may include a signal tip and a ground tip. The signal tip may have a spherical lower surface allowing good contact with a ball-shaped signal terminal. The ground tip may be extended from a lower end of a ground barrel that encloses the signal tip. The ground tip may move independent of the signal tip by means of a barrel stopper and a spring. Thus, the probe can be used regardless of the size of and the distance between the package terminals.

Abstract: A semiconductor chip package has a substrate that includes circuit lines provided on first and/or second surfaces, a power plane provided on the second surface, bump lands provided on the second surface and coupled to the circuit lines, and ball lands provided on the first surface. The package further has a semiconductor chip attached to the second surface of the substrate and electrically coupled to the circuit lines, and a dielectric layer provided on the second surface of the substrate. The dielectric layer surrounds laterally the chip, covers the power plane, and exposes the bump lands. The package further has a ground plane provided on both the chip and the dielectric layer, vertical connection bumps provided within the dielectric layer and on the bump lands and electrically coupled to the ground plane, and solder balls provided on the ball lands.

Abstract: A vehicular power window safety device by which the state of a foreign object being stuck is recognized only when the foreign object makes contact with a weather strip mounted on the upper portion of a door frame, deforming the weather strip, and preventing an excessive contact between the window glass and run channel from being misjudged as an object being jammed therebetween and thereby enabling to obtain an operational trustworthiness on the power window safety device. The device comprises a motor for generating the driving power for lifting and lowering a window glass; a weather strip mounted on an upper area of a door frame and inherently provided with a sensor of which electric resistance is changed by pressure provided by a foreign object stuck in between the weather strip and the window glass due to the lifting of the window glass; and a controller for controlling the motor in response to signals supplied from the sensor.

Abstract: A vehicular power window safety device by which the state of a foreign object being stuck is recognized only when the foreign object makes contact with a weather strip mounted on the upper portion of a door frame, deforming the weather strip, and preventing an excessive contact between the window glass and run channel from being misjudged as an object being jammed therebetween and thereby enabling to obtain an operational trustworthiness on the power window safety device. The device comprises a motor for generating the driving power for lifting and lowering a window glass; a weather strip mounted on an upper area of a door frame and inherently provided with a sensor of which electric resistance is changed by pressure provided by a foreign object stuck in between the weather strip and the window glass due to the lifting of the window glass; and a controller for controlling the motor in response to signals supplied from the sensor.

Abstract: The present invention provides an outside door handle automatic locking device for automobiles which includes supports that are placed on both sides of the upper portion of a housing, levers, placed on both sides of a handle and inwards from the supports, which, because of being fixed to a hinge shaft, are able to rotate. Also, an elastic member is formed on the hinge shaft that keeps the outside handle in its original position through its elasticity. Additionally, placed on a fixed location on one of the levers is a rotating member that rotates when the vehicle receives a side impact from a collision. A hook portion is also offered which is fixed toward the outside of the rotating member and catches the rotating member when it rotates past its fixed rotation.