Abstract: In accordance with an embodiment, a method of adjusting quality of an image of patterns common in shape includes acquiring a first gray value and a first waveform within a reference image, acquiring a sample image, acquiring a second gray value and a second waveform from third and fourth regions within a sample image, respectively, and adjusting the brightness and contrast of the sample image. The first gray value is a standard for the brightness of the image from a first region within a reference image. The first and second waveforms represent a luminance profile of second and fourth regions including edges, respectively. The third and fourth regions correspond to the first and second regions. The brightness and contrast of the sample image are adjusted by matching the first gray value and the first waveform with the second gray value and the second waveform.

Abstract: Provided are a heat sink material made of an alloy or a composite material including two or more types of elements which has an end surface that makes possible formation of an edge portion on which at least a laser element is mounted, a manufacturing method for the same, and a semiconductor laser device including the heat sink material. A heat sink material (10) is made of an alloy or a composite material including two or more types of elements, and provided with a main surface having a relatively large area and a secondary surface having a relatively small area which crosses the main surface, and the secondary surface includes a surface on which a discharging process has been carried out using a discharge wire (200) that is placed approximately parallel to the main surface.

Abstract: The present invention provides a polycarbonate resin containing a structural unit represented by general formula (I). In formula (I), R's independently represent a halogen atom, an alkyl group having 1-9 carbon atoms, an aryl group having 6-12 carbon atoms, an alkenyl group having 2-5 carbon atoms, an alkoxy group having 1-5 carbon atoms, or an aralkyl group having 7-17 carbon atoms; n's independently mean the number of R's which substitute on the benzene ring and independently represent an integer of 0-4; Y represents an alkylene group having 1-4 carbon atoms; and p represents an integer of 0-4.

Abstract: A machineroom-less elevator in which a counterweight is vertically moved behind a cage, with the cage and the counterweight being suspended in a jig back manner through a first and second diverting sheaves. In this machineroom-less elevator, a sufficiently large vertical stroke of the counterweight can be secured, while a durability of a hoist rope is improved. In addition, since no tensile difference is generated in respective parts of the hoist rope, vertical vibrations of the cage are prevented when the cage restarts a vertical movement. A traction sheave is disposed on one of right and left sidewalls of an elevator shaft. A first diverting sheave is disposed below and sufficiently apart from the traction sheave, and a second diverting sheave is disposed on a top of a rear wall of the elevator shaft.

Abstract: An optical disc device includes a conductive member of a bezel assembly with openings formed by a plurality of parting lines, and gaskets are attached to the upper and lower sides of the conductive member using conductive adhesion bond.

Abstract: Provided are a heat sink material made of an alloy or a composite material including two or more types of elements which has an end surface that makes possible formation of an edge portion on which at least a laser element is mounted, a manufacturing method for the same, and a semiconductor laser device including the heat sink material. A heat sink material (10) is made of an alloy or a composite material including two or more types of elements, and provided with a main surface having a relatively large area and a secondary surface having a relatively small area which crosses the main surface, and the secondary surface includes a surface on which a discharging process has been carried out using a discharge wire (200) that is placed approximately parallel to the main surface.

Abstract: A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

Abstract: Provided is a process for producing bleached pulp, including subjecting unbleached pulp, which is obtained by cooking a lignocellulose substance, to alkali-oxygen bleaching treatment and then subjecting the alkali-oxygen bleached pulp to chlorine-free bleaching treatment including chlorine dioxide treatment, wherein in at least one chlorine dioxide treatment stage in which the chlorine dioxide treatment is performed, monopersulfuric acid is used in combination. The amount of chlorine dioxide to be used is reduced and the colour reversion resistance of the bleached pulp is improved by this process.

Abstract: A coil component having a core, first and second terminal electrodes provided on the core, and a conducting wire having a winding portion provided on the core and end portions electrically connected to the first and second terminal electrodes to provide first and second connecting portions. The core has one side surface at which the first and second connecting portions are provided. When viewing the one side surface, a wire portion in the winding portion extends in a first direction, and a wire portion extending from the second connecting portion extends toward the winding portion in a second direction. The first and second directions define an intersection angle of not more than 90 degrees.

Abstract: A solder preform according to the present invention has a variation in the size of high melting point metal particles which is at most 20 micrometers when the metal particle diameter is 50 micrometers, and an alloy layer of the high melting point metal particles and the main component of solder is formed around the high melting point metal particles. In addition, no voids at all are present in the solder. An electronic component according to the present invention has a semiconductor element bonded to a substrate with the above-described solder preform and has excellent resistance to heat cycles.

Abstract: A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

Abstract: A coil component having a core, first and second terminal electrodes provided on the core, and a conducting wire having a winding portion provided on the core and end portions electrically connected to the first and second terminal electrodes to provide first and second connecting portions. The core has one side surface at which the first and second connecting portions are provided. When viewing the one side surface, a wire portion in the winding portion extends in a first direction, and a wire portion extending from the second connecting portion extends toward the winding portion in a second direction. The first and second directions define an intersection angle of not more than 90 degrees.

Abstract: An electronic component having a semiconductor element bonded to a substrate with solder has a decreased bonding strength if there is not a suitable clearance between the semiconductor element and the substrate. Therefore, a solder preform having high melting point metal particles dispersed in solder has been used in the manufacture of electronic components. However, when an electronic component was manufactured using a conventional solder preform, there were cases in which the semiconductor element leaned or the bonding strength was not adequate. A solder preform according to the present invention has a variation in the size of high melting point metal particles which is at most 20 micrometers when the metal particle diameter is 50 micrometers, and an alloy layer of the high melting point metal particles and the main component of solder is formed around the high melting point metal particles. In addition, no voids at all are present in the solder.

Abstract: Endoscopic system 40 comprises composite optical fiber 34 that consists of a large-diameter, laser light transmitting optical fiber surrounded by a large number of image transmitting fibers that are bundled together to form an integral assembly with the central fiber, laser applying and image observing optical unit 42 that is connected to the eyepiece portion of said composite optical fiber such that it launches laser light into said large-diameter optical fiber and that the image being transmitted through said image transmitting optical fiber is focused on a camera to become observable, and an illuminating light transmitting unit that transmits illuminating light to the tip of the objective portion of said composite optical fiber for irradiation purposes.

Abstract: An elevator in which a driving apparatus, a traction sheave, and a counterweight-side rope hitching portion are arranged above one rail of the right and left cage-side guide rails, while a cage-side rope hitching portion and a speed governor are arranged above the other rail of the right and left cage-side guide rails. Since a control panel is arranged along a rear inner wall surface of the machine room, a large operation space can be secured in a center part of the floor of the machine room. Further, since a machine beam can be extended at full length in the back and forth direction in the machine room, no additional building-side receiving beam is needed.

Abstract: The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation. A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.

Abstract: A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove.

Abstract: [Problem to be Solved] To provide a gas-forming agent which exhibits no hydrogen embrittlement and allows gas generation to achieve a desired amount of inflation even in the presence of nitrite, and a cement composition utilizing the agent which offers improved shrinkage compensation. [Solution] The gas-forming agent for a cement composition containing nitrite comprises a substance which produces nitrogen gas through a reaction in the cement composition.

Abstract: [Problems] A conventional process for producing a solder preform in which a predetermined amount of high-melting metal particles are directly put into molten solder and stirred, requires a long time for dispersing the high-melting metal particles by stirring. Therefore, in the conventional method for producing a solder preform, dissolution of the high-melting metal particles into the molten solder occurred during stirring, and their particle diameters became small. If a semiconductor chip and a substrate are soldered with a solder preform containing metal particles having such decreased diameters, the space between portions being soldered becomes narrow, and a sufficient bonding strength is not obtained. [Means for Solving the Problems] In the present invention, a premixed master alloy having a higher proportion of the high-melting metal particles in solder is first prepared, then the premixed master alloy is put into molten solder to disperse the high-melting metal particles.

Abstract: A machineroom-less elevator in which a counterweight is vertically moved behind a cage, with the cage and the counterweight being suspended in a jig back manner through a first and second diverting sheaves. In this machineroom-less elevator, a sufficiently large vertical stroke of the counterweight can be secured, while a durability of a hoist rope is improved. In addition, since no tensile difference is generated in respective parts of the hoist rope, vertical vibrations of the cage are prevented when the cage restarts a vertical movement. A traction sheave is disposed on one of right and left sidewalls of an elevator shaft. A first diverting sheave is disposed below and sufficiently apart from the traction sheave, and a second diverting sheave is disposed on a top of a rear wall of the elevator shaft.