Abstract: A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

Abstract: A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove.

Abstract: In an elevator, a drive device, a traction sheave, and a weight-side stop portion are arranged above one of a pair of left and right cage-side guide rails, and a cage-side stop portion and speed governor are arranged above the other cage-side guide rail. A wide workspace is realized in the middle of the floor of the machinery chamber, since the control panel is arranged along the middle of the inside wall surface of the front face of the machinery chamber. Furthermore, provision of an additional supporting beam mounted in the building is unnecessary, since the machine beam can extend fully in the forwards/rearwards direction in the interior of the machinery chamber.

Abstract: Rubber vibration isolators are held between a base frame supporting a driving device and an upper deflecting sheave, and a support connected to car guide rails and a counterweight guide rail. The rubber vibration isolators are held between a horizontal member and vertical members of a support frame supporting lower deflecting sheaves. Transmission of vibrations generated by the driving device, the upper deflecting sheave, and the lower deflecting sheaves to the side walls of an elevator shaft can be intercepted.

Abstract: A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove.

Abstract: A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove.

Abstract: A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1a and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u.

Abstract: An authentication system performs user authentication between a client and a server using a one-time password. Each of the client and the server generates random authentication data. The generated random authentication data is exchanged between the client and the server. In this way, authentication based on a complete random authentication data not using specific one-time password generation logic can be provided. Furthermore, by applying the method for authentication and the method for updating a one-time password according to the present invention, spoofing can be detected even when a password is stolen. As a result, unauthorized access can be prevented.

Abstract: A submount that enables the reliable mounting of a semiconductor light-emitting device on it, and a semiconductor unit incorporating the submount. A submount 3 comprises (a) a substrate 4; and (b) a solder layer 8 formed on the top surface 4f of the substrate 4. The solder layer 8 before melting has a surface roughness, Ra, of at most 0.18 ?m. It is more desirable that the solder layer 8 before melting have a surface roughness, Ra, of at most 0.15 ?m, yet more desirably at most 0.10 ?m. A semiconductor unit 1 comprises the submount 3 and a laser diode 2 mounted on the solder layer 8 of the submount 3.

Abstract: There is provided an machineroom-less elevator which can reduce the pit depth in a bottom part of an elevator shaft, mostly perform maintenance work on an upper space of a cage, and reduce a top clearance. A pair of right and left cage-side sheaves are disposed in the upper space of the cage, and the rotational axes of the traction sheave and the cage-side sheaves are extended in the longitudinal direction. A sheave supporting beam to rotatably support cage-side sheaves is disposed in a space between and upper beam of the cage frame and a ceiling of the cage, and disposed below rotary shafts of the cage-side sheaves.

Abstract: A magnetic tape comprising a substrate having on one side thereof a magnetic layer serving as a recording surface and on the other side thereof a resin layer serving as a non-recording surface, wherein said magnetic tape has a region on the side of the non-recording surface along the longitudinal direction of the tape in which a regular pattern for servo tracking having different optical properties from the other major region of the side of the non-recording surface is to be formed, and said magnetic tape has a thickness of 7 ?m or less.

Abstract: Provided are a heat sink material made of an alloy or a composite material including two or more types of elements which has an end surface that makes possible formation of an edge portion on which at least a laser element is mounted, a manufacturing method for the same, and a semiconductor laser device including the heat sink material. A heat sink material (10) is made of an alloy or a composite material including two or more types of elements, and provided with a main surface having a relatively large area and a secondary surface having a relatively small area which crosses the main surface, and the secondary surface includes a surface on which a discharging process has been carried out using a discharge wire (200) that is placed approximately parallel to the main surface.

Abstract: A magnetic tape (1) characterized by having a backcoating layer (5) which comprises a binder and fine particles having been dispersed in the binder and being capable of irreversibly changing in color on oxidation reaction, and has a sufficient number of microvoids of sufficient size to supply sufficient oxygen to cause the oxidation reaction.

Abstract: In an elevator according to the present invention, a driving apparatus 42, a traction sheave 41, and a counterweight-side rope hitching portion 46 are arranged above one rail 21L of the right and left cage-side guide rails, while a cage-side rope hitching portion 44 and a speed governor 47 are arranged above the other rail 21R of the right and left cage-side guide rails. Since a control panel 48 is arranged along a rear inner wall surface 34 of the machine room, a large operation space can be secured in a center part of the floor 31 of the machine room 30. Further, since a machine beam 53 can be extended at full length in the back and forth direction in the machine room 30, no additional building-side receiving beam is needed.

Abstract: Rubber vibration isolators are held between a base frame supporting a driving device and an upper deflecting sheave, and a support connected to car guide rails and a counterweight guide rail. The rubber vibration isolators are held between a horizontal member and vertical members of a support frame supporting lower deflecting sheaves. Transmission of vibrations generated by the driving device, the upper deflecting sheave, and the lower deflecting sheaves to the side walls of an elevator shaft can be intercepted.

Abstract: An accelerated fuel passage of an accelerator pump operatively connected with a throttle shaft having a throttle valve. The accelerated fuel passage is connected to an upstream side of a needle orifice, which orifice is coupled to a main nozzle. Consequently, the fuel is discharged by the accelerator pump into an area before the needle orifice. By the addition of a one-way check valve system in a fuel pick up at a metering chamber for a fuel circuit, the fuel driven by the accelerator pump piston is discharged to a venturi tube of an intake passage through the main nozzle. A self pumping effect caused by an engine pulsation is dampened or eliminated by the needle orifice. Further, a check valve is provided within a fuel pick up at a metering chamber for a fuel circuit, whereby the fuel driven by the accelerator pump piston is discharged to a venturi tube through a main nozzle without returning to the fixed fuel chamber.

Abstract: The present invention provides a submount that allows a semiconductor light-emitting element to be attached with a high bonding strength. A submount 3 is equipped with a substrate 3 and a solder layer 8 formed on a primary surface 4f of the substrate 4. The density of the solder layer 8 is at least 50% and no more than 99.9% of the theoretical density of the material used in the solder layer 8. The solder layer 8 contains at least one of the following list: gold-tin alloy; silver-tin alloy; and lead-tin alloy. The solder layer 8 before it is melted is formed on the substrate 4 and includes an Ag film 8b and an Sn film 8a formed on the Ag film 8b. The submount 3 further includes an Au film 6 formed between the substrate 4 and the solder layer 8.

Abstract: An accelerated fuel passage of an accelerator pump operatively connected with a throttle shaft having a throttle valve. The accelerated fuel passage is connected to an upstream side of a needle orifice, which orifice is coupled to a main nozzle. Consequently, the fuel is discharged by the accelerator pump into an area before the needle orifice. By the addition of a one-way check valve system in a fuel pick up at a metering chamber for a fuel circuit, the fuel driven by the accelerator pump piston is discharged to a venturi tube of an intake passage through the main nozzle. A self pumping effect caused by an engine pulsation is dampened or eliminated by the needle orifice. Further, a check valve is provided within a fuel pick up at a metering chamber for a fuel circuit, whereby the fuel driven by the accelerator pump piston is discharged to a venturi tube through a main nozzle without returning to the fixed fuel chamber.

Abstract: When an operator applies a removing force to turn a switch portion b in a direction C2, a projection a4 abuts against a slope b71 so that the removing force as a reaction is applied to the slope. The removing force is divided into a component working along the slope b71 and a component F working in a same direction as a center axis X. Thus, the removing force is converted into a force F in the same direction as the center axis X. By means of the force F in the same direction as the center axis X, a pushbutton support b6 is moved downward as accordingly moving a movable contacts b9 away from a fixed contacts b12 via a contact shaft b5.

Abstract: An optical disc device includes a conductive member of a bezel assembly with openings formed by a plurality of parting lines, and gaskets are attached to the upper and lower sides of the conductive member using conductive adhesion bond.