Abstract: The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation. A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.

Abstract: An elevator system having no machineroom is provided in which a height of a pit in a bottom of an elevator shaft can be reduced, a maintenance operation can be carried out at one on an upper part of the cage, and cage-side sheaves and cage-side guide rails can be disposed symmetrically with respect to the center of gravity of the cage. The elevator system having no machineroom includes a pair of right and left cage-side sheaves 16L and 16R disposed above a cage 10, and a traction sheave 17 disposed behind a cage-side guide rail 11L. The pair of right and left cage-side sheaves 16L and 16R are disposed such that each rotational angle of the pair of right and left cage-side sheaves 16L and 16R is extended parallel to a rotational axis of the traction sheave, or extended at a direction angle close to that of the rotational axis of the traction sheave.

Abstract: A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1a and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u.

Abstract: In a structure and a method for connecting a braid of a shielding wire to a terminal in which the terminal is pressure-jointed onto the braid, the terminal is firstly jointed to the braid with a conductive adhering member to be electrically connected to the braid. The conductive adhering member includes a conductive tape and a conductive adhesive coated on both front and rear surfaces of the conductive tape. Alternatively, the conductive adhering member includes a nonconductive tape and a conductive adhesive coated on a periphery of the conductive tape. Alternatively, the conductive adhering member includes a nonconductive tape and a conductive adhesive penetrating into the nonconductive tape.

Abstract: A golf shaft made of fiber reinforced plastic and including a tip portion attached to a head, a butt portion attached to a grip, and a middle portion located between the tip portion and the butt portion. The golf shaft has a generally tapered shape in which the outer diameter generally increases gradually from the tip portion to the butt portion. The golf shaft includes a first portion in which linear density is generally uniform. A second portion is defined by the part of the shaft excluding the first portion. The first portion occupies 30% or more of the entire shaft length, and the linear density of the first portion is greater than that of the linear density.

Abstract: A submount can mount on it a semiconductor light-emitting device with high bonding strength, and a semiconductor unit incorporates the submount. The submount comprises (a) a submount substrate, (b) a solder layer formed at the top surface of the submount substrate, and (c) a solder intimate-contact layer that is formed between the submount substrate and the solder layer and that has a structure in which a transition element layer consisting mainly of at least one type of transition element and a precious metal layer consisting mainly of at least one type of precious metal are piled up. In the above structure, the transition element layer is formed at the submount-substrate side. The semiconductor unit is provided with a semiconductor light-emitting device mounted on the solder layer of the submount.

Abstract: An elevator comprises a cage (2) suspended in an elevator shaft (5) and provided with cage-side sheaves (2a, 2b); a counterweight (3) suspended in the elevator shaft (5) and provided with a counterweight-side sheave (3a); a diverting sheave (11) disposed at a position above the counterweight (3) in an upper part of the elevator shaft (5); first and second upper sheaves (9, 12) disposed in an upper part of the elevator shaft (5); and a main rope (4) wound around the first and the second upper sheaves (9, 12), and having a first part wound around the cage-side sheaves (2a, 2b) and having a first end fastened to a fixed structure in an upper part of the elevator shaft (5), and a second part passed successively via the counterweight-side sheave (3a) of the counterweight (3) and the diverting sheave (11) and having a second end fastened to the counterweight (3).

Abstract: When an operator applies a removing force to turn a switch portion b in a direction C2, a projection a4 abuts against a slope b71 so that the removing force as a reaction is applied to the slope. The removing force is divided into a component working along the slope b71 and a component F working in a same direction as a center axis X. Thus, the removing force is converted into a force F in the same direction as the center axis X. By means of the force F in the same direction as the center axis X, a pushbutton support b6 is moved downward as accordingly moving a movable contacts b9 away from a fixed contacts b12 via a contact axis b5.

Abstract: The present invention provides a submount that allows a semiconductor light-emitting element to be attached with a high bonding strength. A submount 3 is equipped with a substrate 3 and a solder layer 8 formed on a primary surface 4f of the substrate 4. The density of the solder layer 8 is at least 50% and no more than 99.9% of the theoretical density of the material used in the solder layer 8. The solder layer 8 contains at least one of the following list: gold-tin alloy; silver-tin alloy; and lead-tin alloy. The solder layer 8 before it is melted is formed on the substrate 4 and includes an Ag film 8b and an Sn film 8a formed on the Ag film 8b. The submount 3 further includes an Au film 6 formed between the substrate 4 and the solder layer 8.

Abstract: Endoscopic system 40 comprises composite optical fiber 34 that consists of a large-diameter, laser light transmitting optical fiber surrounded by a large number of image transmitting fibers that are bundled together to form an integral assembly with the central fiber, laser applying and image observing optical unit 42 that is connected to the eyepiece portion of said composite optical fiber such that it launches laser light into said large-diameter optical fiber and that the image being transmitted through said image transmitting optical fiber is focused on a camera to become observable, and an illuminating light transmitting unit that transmits illuminating light to the tip of the objective portion of said composite optical fiber for irradiation purposes.

Abstract: A drive device (42), a traction sheave (41) and a weight-side stop portion (46) are arranged above one (21L) of a pair of left and right cage-side guide rails and a cage-side stop portion (44) and speed governor (47) are arranged above the other (21R) cage-side guide rail. Also a wide workspace can be guaranteed in the middle of the floor (31) of the machinery chamber (30), since the control panel (48) is arranged along the middle of the inside wall surface (37) of the front face of the machinery chamber (30). Furthermore, provision of an additional supporting beam mounted in the building is unnecessary, since the machine beam (53) can extend fully in the forwards/rearwards direction in the interior of the machinery chamber (30).

Abstract: A submount can mount on it a semiconductor light-emitting device with high bonding strength, and a semiconductor unit incorporates the submount. The submount comprises (a) a submount substrate, (b) a solder layer formed at the top surface of the submount substrate, and (c) a solder intimate-contact layer that is formed between the submount substrate and the solder layer and that has a structure in which a transition element layer consisting mainly of at least one type of transition element and a precious metal layer consisting mainly of at least one type of precious metal are piled up. In the above structure, the transition element layer is formed at the submount-substrate side. The semiconductor unit is provided with a semiconductor light-emitting device mounted on the solder layer of the submount.

Abstract: A female terminal includes a terminal body, comprised of a first material having excellent corrosion resistance and an elastic piece, comprised of a second material having excellent spring properties, and the elastic piece mounting on the terminal body. An engagement portion is formed on the terminal body. A retaining portion is formed on the elastic piece. The retaining portion is engaged with the engagement portion so that the elastic piece is mounted on the terminal body.

Abstract: A submount that enables the reliable mounting of a semiconductor light-emitting device on it, and a semiconductor unit incorporating the submount. A submount 3 comprises (a) a substrate 4; and (b) a solder layer 8 formed on the top surface 4f of the substrate 4. The solder layer 8 before melting has a surface roughness, Ra, of at most 0.18 ?m. It is more desirable that the solder layer 8 before melting have a surface roughness, Ra, of at most 0.15 ?m, yet more desirably at most 0.10 ?m. A semiconductor unit 1 comprises the submount 3 and a laser diode 2 mounted on the solder layer 8 of the submount 3.

Abstract: A magnetic tape comprising a substrate having on one side thereof a magnetic layer serving as a recording surface and on the other side thereof a resin layer serving as a non-recording surface, wherein said magnetic tape has a region on the side of the non-recording surface along the longitudinal direction of the tape in which a regular pattern for servo tracking having different optical properties from the other major region of the side of the non-recording surface is to be formed, and said magnetic tape has a thickness of 7 &mgr;m or less.

Abstract: A magnetic tape (1) characterized by having a backcoating layer (5) which comprises a binder and fine particles having been dispersed in the binder and being capable of irreversibly changing in color on oxidation reaction, and has a sufficient number of microvoids of sufficient size to supply sufficient oxygen to cause the oxidation reaction.

Abstract: An elevator in which a dimension of an elevator shaft does not need to be increased when enlarging a hoist, and a position where a cage is suspended by a hoist cable can be flexibly selected. In an elevator according to the present invention, a hoist 10 is disposed such that a rotational axis thereof is vertically extended. Thus, when an axial dimension of the hoist 10 is increased to enlarge the hoist 10, a dimension of an elevator shaft does not need to be increased. Since a driving shaft 10a of the hoist 10 is vertically extended, an area occupied by the hoist is remarkably reduced when viewed in a horizontal cross-sectional view of the elevator shaft. Thus, the freedom to dispose the hoist 10 is enhanced so that a position where a cage 3 is suspended by a hoist cable 14 can be flexibly selected.

Abstract: A golf shaft made of fiber reinforced plastic and including a tip portion attached to a head, a butt portion attached to a grip, and a middle portion located between the tip portion and the butt portion. The golf shaft has a generally tapered shape in which the outer diameter generally increases gradually from the tip portion to the butt portion. The golf shaft includes a first portion in which linear density is generally uniform. A second portion is defined by the part of the shaft excluding the first portion. The first portion occupies 30% or more of the entire shaft length, and the linear density of the first portion is greater than that of the linear density.

Abstract: There is provided an machineroom-less elevator which can reduce the pit depth in a bottom part of an elevator shaft, mostly perform maintenance work on an upper space of a cage, and reduce a top clearance. A pair of right and left cage-side sheaves are disposed in the upper space of the cage, and the rotational axes of the traction sheave and the cage-side sheaves are extended in the longitudinal direction. A sheave supporting beam to rotatably support cage-side sheaves is disposed in a space between and upper beam of the cage frame and a ceiling of the cage, and disposed below rotary shafts of the cage-side sheaves.