Abstract: There is provided an machineroom-less elevator which can reduce the pit depth in a bottom part of an elevator shaft, mostly perform maintenance work on an upper space of a cage, and reduce a top clearance. A pair of right and left cage-side sheaves are disposed in the upper space of the cage, and the rotational axes of the traction sheave and the cage-side sheaves are extended in the longitudinal direction. A sheave supporting beam to rotatably support cage-side sheaves is disposed in a space between and upper beam of the cage frame and a ceiling of the cage, and disposed below rotary shafts of the cage-side sheaves.

Abstract: A pedal apparatus for an automobile comprises a plurality of pedals attached to a bracket fixed to a vehicle body via a plurality of parallel link mechanisms, a connection parallel link mechanism that connects a pair of the plurality of parallel link mechanism, and is provided with a pair of connection portions connecting the both parallel link mechanisms with the bracket, and an adjustment mechanism attached to the bracket, that arbitrarily prescribes the forms of each parallel link mechanism and the connection parallel link mechanism.

Abstract: A method of writing servo signals on magnetic tape which comprises making a single laser beam (15) pass through a diffraction element (14) to split it into a plurality of beams (16) traveling in prescribed directions and then making the plurality of beams (16) pass through an optical convergence system (21) to form converged beam spots on a site of a magnetic tape (1) which is capable of forming servo tracks, the magnetic tape (1) being running at a prescribed speed, to cause the site to change physically or chemically thereby forming a plurality of servo tracks (S) in the longitudinal direction of the tape simultaneously.

Abstract: A method of writing servo signals on a magnetic tape which comprises irradiating one end of an optical fiber bundle (12) comprising a plurality of optical fibers (11) arrayed in parallel with each other with laser light, transmitting the laser light (24) emitted from the other end as an output light source through a condensing lens (13), and irradiating a site of a magnetic tape running at a prescribed speed, the site being capable of forming servo tracks, with the laser light passed through the condensing lens (13) to form real images (25) equal to or smaller in size than the output light source to cause the site to change physically or chemically thereby forming a plurality of servo track patterns (S) in the longitudinal direction of the tape at a smaller pitch than the pitch of the optical fibers (11) arrayed in the optical fiber bundle (12).

Abstract: Conductor portions (11) of a total of two or more wires (2) are compressively pressed uniformly over an entire periphery within one or a plurality of tubular portions (13) of a terminal (19, and are connected thereto. The terminal (1) has the pair of tubular portions (13) formed respectively at opposite sides thereof, and the conductor portions (11) of one or more wires (2) are compressively pressed uniformly over the entire periphery within each of the tubular portions, and are connected thereto. Alternatively, the terminal has one tubular portion, and the conductor portions (11) of the plurality of wires (2) are compressively pressed uniformly over the entire periphery within the tubular portion in such a manner that the conductor portions are combined together. Conductor portions (11) of a total of two or more wires (2) are inserted into one or a plurality of tubular portions (13) of a terminal (1), and the tubular portion is compressively pressed uniformly over an entire periphery thereof.

Abstract: A wafer holder for a semiconductor manufacturing apparatus has a high heat conductivity. The wafer holder includes a sintered ceramic piece, a conductive layer such as a heater circuit pattern which can be formed with high precision on at least one surface of the sintered ceramic piece, and a protective layer formed over the conductive layer on the sintered ceramic piece so as to cover a surface of the conductive layer. The protective layer may contain a glass, a non-oxide ceramic such as aluminum nitride or silicon nitride, an oxide of ytterbium, neodymium and calcium, or an oxide of yttrium and aluminum. In a method of manufacturing the wafer holder, a paste containing metal particles is applied on a surface of the sintered ceramic piece and is fired to form a heater circuit pattern as the conductive layer. Then the protective layer is formed on the sintered ceramic piece to cover the surface of the conductive layer.

Abstract: A female terminal includes a terminal body, comprised of a first material having excellent corrosion resistance and an elastic piece, comprised of a second material having excellent spring properties, and the elastic piece mounting on the terminal body. An engagement portion is formed on the terminal body. A retaining portion is formed on the elastic piece. The retaining portion is engaged with the engagement portion so that the elastic piece is mounted on the terminal body.

Abstract: In this method, a ground wire 2 is overlaid on a shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between an upper resin tip 13 and a lower resin tip 14. By executing a first ultrasonic oscillation while inserting a projection 7a of an ultrasonic horn 7 into a through hole 13b of the tip 13, outside rinds 1d, 2b of the wires 1, 2 are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal 15 and a resin piece 16 on a contact between the braided wire 1c and the core line 2a and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips 13, 14.

Abstract: There is provided a spread illuminating apparatus to improve a coupling efficiency between a light conductive member and a spot-like light source. A claw (23) of an upper frame (21) is fitted to a recess (20) of an LED (6), and generates a spring force in a direction of a light conductive member (4) (a spring force in a longitudinal direction of the light conductive member (4)) in a fitted condition to press the LED (6) toward the light conductive member (4). Thus, the light conductive member (4) and the LED are excellently and tightly attached to each other, and surely positioned, and the coupling efficiency of the light conductive member (4) with the LED is excellent.

Abstract: A magnetic tape comprising a substrate having on one side thereof a magnetic layer serving as a recording surface and on the other side thereof a resin layer serving as a non-recording surface, wherein said magnetic tape has a region on the side of the non-recording surface along the longitudinal direction of the tape in which a regular pattern for servo tracking having different optical properties from the other major region of the side of the non-recording surface is to be formed, and said magnetic tape has a thickness of 7 &mgr;m or less.

Abstract: There is provided a spread illuminating apparatus to improve the coupling efficiency between members constituting a light source. The light source comprises a bar-like light conductive member and spot-like light sources. The spot-like light sources are mounted and soldered on an FPC, the light conductive member is fitted between the spot-like light sources, and ends of the light conductive member face light emitting surfaces of the spot-like light sources. The FPC has a deformed portion shaped U and forming an open area. An elastic force is generated in the longitudinal direction when the open area is expanded, by inserting the light conductive member whose length is larger than a distance between the spot-like light sources, between the spot-like light sources. This elastic force makes the light emitting surfaces of the spot-like source press on the ends of the light conductive member, and the coupling efficiency therebetween is improved.

Abstract: A method for producing a fuse element having a fusible portion and any other portion which are made of different kinds of metal. The method comprises the steps of boring through-hole in a substrate made of first metal, forming an element plate by fusion-bonding a second metal to the through-hole and integrally stamping a pair of substrate portion made of the first metal and a low-melting-point portion made of the second metal. The second metal is made of a metal whose melting point is lower than that of the first metal. Further, the pair of substrate portion is connected together by the low-melting-point portion so that the fuse element is formed.

Abstract: A magnetic tape (1) characterized by having a backcoating layer (5) which comprises a binder and fine particles having been dispersed in the binder and being capable of irreversibly changing in color on oxidation reaction, and has a sufficient number of microvoids of sufficient size to supply sufficient oxygen to cause the oxidation reaction.

Abstract: At least two coated electric wires W1 and W2 are superposed. Resin chips 53 and 55 are disposed above and below the superposed connection portion S. These resin chips 53 and 55 have been compressed from above and below and ultrasonic vibration has been applied thereto, thereby melting resin coats 3 in the coated electric wires W1 and W2 to pressure weld conductive wires 1. The resin chips 53 and 55 and the resin coats 3 have been melted and joined to each other, and the resin chips 53 and 55 have also been joined to each other by melting. A pair of resin sealings 4 are provided between the upper resin chip 53 and the coated electric wires W1 and W2 and between the lower resin chip 55 and the coated electric wires W1 and W2. Each resin sealing 4 has rubber elasticity and is formed such as to annularly surround conductive wires 1, which are exposed from the resin coats 3 and pressure welded.

Abstract: There is provided a spread illuminating apparatus to improve a light coupling efficiency between a light conductive member and a transparent substrate. In the spread illuminating apparatus, an FPC mounting section of a frame is set to be lower than a substrate mounting section by the thickness of an FPC, and an extension provided at an FPC main body is let through an opening formed at a stepped part of the frame so as to be disposed on a reverse side of the frame, whereby an upper surface of the light conductive member is adapted to be flush with an upper surface of the transparent substrate while prevention of the deviation in the thickness direction between the light conductive member and the transparent substrate is not obstructed even when the extension is provided, which results in improving the light coupling efficiency.

Abstract: A wafer holder for a semiconductor manufacturing apparatus has a high heat conductivity. The wafer holder includes a sintered ceramic piece, a conductive layer such as a heater circuit pattern which can be formed with high precision on at least one surface of the sintered ceramic piece, and a protective layer formed over the conductive layer on the sintered ceramic piece so as to cover a surface of the conductive layer. The protective layer may contain a glass, a non-oxide ceramic such as aluminum nitride or silicon nitride, an oxide of ytterbium, neodymium and calcium, or an oxide of yttrium and aluminum. In a method of manufacturing the wafer holder, a paste containing metal particles is applied on a surface of the sintered ceramic piece and is fired to form a heater circuit pattern as the conductive layer. Then the protective layer is formed on the sintered ceramic piece to cover the surface of the conductive layer.

Abstract: A magnetic tape (1) characterized by having a backcoating layer (5) which comprises a binder and fine particles having been dispersed in the binder and being capable of irreversibly changing in color on oxidation reaction, and has a sufficient number of microvoids of sufficient size to supply sufficient oxygen to cause the oxidation reaction.

Abstract: A wafer holder for a semiconductor manufacturing apparatus that has a high heat conductivity and includes a conductive layer such as heater circuit pattern which can be formed with a high precision pattern, a method of manufacturing the wafer holder, and a semiconductor manufacturing apparatus having therein the wafer holder are provided. On a surface of a sintered aluminum nitride piece, paste containing metal particles is applied and fired to form a heater circuit pattern as a conductive layer. Between the surface of the sintered aluminum nitride piece having the heater circuit pattern formed thereon and another sintered aluminum nitride piece, a glass layer is provided as a joint layer to be heated for joining the sintered aluminum nitride pieces together.

Abstract: In a joining method of first and second conductive members together, at least one of the first and second members is a covered wire having an outer periphery of a conductor wire portion covered by a resin-made covering portion, first, connection portion of the first and second members are pinched between resinous chips. At least a part of the conductor wire portion of the covered wire is covered beforehand by a low-melting-point metal layer having a significant value of thickness. Next, the covering portions corresponding to the connection portions are eliminated by heating and pressurization. And both of the resinous chips are then welded to each other, whereby the connection portions are hermetically sealed. The first and second members are electrically conductively connected together by the welding of the low-melting-point metal layer.

Abstract: A conveyor chain comprises first and second links connected together articulately. The first links each comprise a link body, an article loading portion, and a pair of overhanging slats. The second links each comprise a link body and an article loading portion. The first and second links are connected together in an alternate manner at an equal pitch. The overhanging slats of each of the first links extend longitudinally of the conveyor chain along both side edges of the associated second link so as to surround the side edges of the second link. Articles easy to fall down can be conveyed and delivered stably in a crossed delivery conveyor.