Abstract: An optical communication module includes: a circuit board; optical communication devices that are provided on an upper surface side of the circuit board; a case that accommodates the circuit board and the optical communication devices; and a heatsink that is attached to the case. The optical communication devices include a first device and a second device. The first device is located closer to an inlet opening for cooling air for cooling the heatsink than the second device is. A height from the circuit board to a top of the first device is greater than a height from the circuit board to a top of the second device. The heatsink is not equipped with a cooling fin in a first region where the first device is provided, and the heatsink is equipped with a cooling fin in a second region where the second device is provided.

Abstract: An optical module includes a case that contains a built-in optical component related to optical communication, a built-in electronic component, and a built-in temperature sensor that detects temperature of at least one of the optical component and the electronic component. Furthermore, the optical module includes a flow channel that is formed on at least one of surfaces of the case, that extends in a longitudinal direction of the case, and through which air flows.

Abstract: An optical module includes: a housing formed of a conductor that is insertable and removable with respect to an opening portion of an apparatus; a substrate arranged in an internal space of the housing; and a blocking unit that divides the internal space in which the substrate is arranged into two spaces. The blocking unit includes: a first conductor pattern formed on one surface of the substrate; a second conductor pattern formed on another surface of the substrate; a plurality of vias that penetrate through the substrate and connect the first conductor pattern and the second conductor pattern; a first auxiliary member formed of a conductor that comes into contact with the first conductor pattern and the housing; and a second auxiliary member formed of a conductor that comes into contact with the second conductor pattern and the housing.

Abstract: An optical communication module includes: a circuit board; optical communication devices that are provided on an upper surface side of the circuit board; a case that accommodates the circuit board and the optical communication devices; and a heatsink that is attached to the case. The optical communication devices include a first device and a second device. The first device is located closer to an inlet opening for cooling air for cooling the heatsink than the second device is. A height from the circuit board to a top of the first device is greater than a height from the circuit board to a top of the second device. The heatsink is not equipped with a cooling fin in a first region where the first device is provided, and the heatsink is equipped with a cooling fin in a second region where the second device is provided.

Abstract: An optical module includes: a housing formed of a conductor that is insertable and removable with respect to an opening portion of an apparatus; a substrate arranged in an internal space of the housing; and a blocking unit that divides the internal space in which the substrate is arranged into two spaces. The blocking unit includes: a first conductor pattern formed on one surface of the substrate; a second conductor pattern formed on another surface of the substrate; a plurality of vias that penetrate through the substrate and connect the first conductor pattern and the second conductor pattern; a first auxiliary member formed of a conductor that comes into contact with the first conductor pattern and the housing; and a second auxiliary member formed of a conductor that comes into contact with the second conductor pattern and the housing.

Abstract: A high-frequency module includes a first board on which an electronic device is mounted, a second board on which at least wiring is formed, and a radio-wave absorber disposed between the first board and the second board. Multiple slits are formed in the radio-wave absorber.

Abstract: A radio-frequency module includes a semiconductor device, a first signal line configured to transmit an electrical signal to the semiconductor device, a ground electrode, and a first discharge unit situated between the first signal line and the ground electrode, wherein the first discharge unit includes a first projection formed on the ground electrode and a second projection formed on the first signal line, and the first projection and the second projection are situated opposite each other, with a predetermined distance therebetween, and wherein when an effective wavelength of the transmitted electrical signal is denoted as ?g, and a length of the first projection is denoted as L, ?g and L are related as: 0<(L/?g)?0.1.

Abstract: A semiconductor module includes a first circuit board, a second circuit board, a first semiconductor device mounted on a first surface of the first circuit board, a second semiconductor device mounted on the second circuit board, and a radio wave absorber disposed between the first circuit board and the second circuit board.

Abstract: An optical waveguide for connection to a ferrule includes a plurality of cores and a cladding covering the cores, wherein the cladding has recesses at an end face of the optical waveguide.

Abstract: A flexible printed circuit board for coupling to a connector having a plurality of contacts includes a flexible film, a plurality of electrodes disposed on at least one face of the film and configured to come in contact with the contacts of the connector, and one or more slits formed in the film between adjacent electrodes among the plurality of electrodes.

Abstract: An optical module includes a board including a first surface and a second surface, a light-receiving element mounted on the first surface of the board, a capacitor mounted on the first surface of the board and connected to the light-receiving element, an optical waveguide attached to the second surface of the board and configured to transmit light, and a housing that covers the board. A recess is formed in an area of the inner surface of the housing to face the capacitor.

Abstract: A high-frequency module includes a first board on which an electronic device is mounted, a second board on which at least wiring is formed, and a radio-wave absorber disposed between the first board and the second board. Multiple slits are formed in the radio-wave absorber.

Abstract: A transimpedance amplifier connectable to a light receiving element includes a bias terminal for suppling bias potential to the light receiving element, an input terminal to receive a signal from the light receiving element and a ground terminal. The bias terminal, the input terminal and the ground terminal are arranged on at one side of the transimpedance amplifier facing the light receiving element.

Abstract: An optical module includes a board, a light emitter disposed on the board, a light receiver disposed on the board, and at least one radio-wave absorber disposed between the light emitter and the light receiver.

Abstract: A flexible printed circuit board for coupling to a connector having a plurality of contacts includes a flexible film, a plurality of electrodes disposed on at least one face of the film and configured to come in contact with the contacts of the connector, and one or more slits formed in the film between adjacent electrodes among the plurality of electrodes.

Abstract: A transimpedance amplifier connectable to a light receiving element includes a bias terminal for suppling bias potential to the light receiving element, an input terminal to receive a signal from the light receiving element and a ground terminal. The bias terminal, the input terminal and the ground terminal are arranged on at one side of the transimpedance amplifier facing the light receiving element.

Abstract: An optical module includes a light-emitting element, an optical waveguide configured to transmit light emitted by the light-emitting element, a temperature sensor, a housing that houses the light-emitting element and the temperature sensor, a first radiator disposed between the light-emitting element and the housing, and a second radiator disposed between the temperature sensor and the housing.

Abstract: An optical module includes a board; a photoelectric transducer disposed on the board; an optical waveguide that is connected to the board and transmits light entering or emitted from the photoelectric transducer; an optical connector including a first end connected to the optical waveguide and a second end to be connected to an optical cable; a housing that houses the board, the photoelectric transducer, the optical waveguide, and the optical connector; and a conductive part that is provided between the optical waveguide and the housing, in contact with the housing, and formed of an elastic conductive material or a radio absorbing material.

Abstract: An optical module includes a board including a first surface and a second surface, a light-receiving element mounted on the first surface of the board, a capacitor mounted on the first surface of the board and connected to the light-receiving element, an optical waveguide attached to the second surface of the board and configured to transmit light, and a housing that covers the board. A recess is formed in an area of the inner surface of the housing to face the capacitor.

Abstract: An optical module includes a board; a photoelectric transducer disposed on the board; an optical waveguide that is connected to the board and transmits light entering or emitted from the photoelectric transducer; an optical connector including a first end connected to the optical waveguide and a second end to be connected to an optical cable; a housing that houses the board, the photoelectric transducer, the optical waveguide, and the optical connector; and a conductive part that is provided between the optical waveguide and the housing, in contact with the housing, and formed of an elastic conductive material or a radio absorbing material.