Abstract: An optical transmission apparatus includes first and second circuit boards, and a connector. The first circuit board includes an optical transmission processing circuit, a first transmission line electrically coupled to the optical transmission processing circuit, a first pad on one surface of the first circuit board electrically coupled to the first transmission line, and a second pad on the other surface of the first circuit board electrically coupled to the first pad. The second circuit board includes a second transmission line of a layer of a multilayered structure, and a third pad on one surface of the second circuit board electrically coupled to the second transmission line and the second pad. The connector has an electrode disposed in two dimensions at a position to couple with the first pad in the case of the second circuit board is electrically coupled with the first circuit board.

Abstract: A coaxial connector that includes: a first inner conductor and a second inner conductor; a capacitor that is electrically coupled to the first inner conductor and the second inner conductor; an outer conductor that surrounds the first and second inner conductors, and the capacitor; a first support member that fixes the first inner conductor to the outer conductor; a second support member that fixes the second inner conductor to the outer conductor; a first dielectric material that is provided between the outer conductor and the first inner conductor and between the outer conductor and the second inner conductor, and a second dielectric material that is provided between the outer conductor and the capacitor.

Abstract: There is provided a substrate that includes a base substrate, a socket that has a step where the step has a first surface and a second surface, the socket being electrically coupled with the base substrate at the first surface; and a connection substrate that is disposed between the second surface and the base substrate, where the connection substrate is electrically coupled with the socket at the second surface.

Abstract: A radio frequency signal transmission method for transmitting a radio frequency signal through an inner conductor serving as a signal line, the radio frequency signal transmission method including: causing the radio frequency signal to be input to and propagate through the inner conductor, an impedance between the inner conductor and an outer conductor serving as a grounding line being adjusted to a predetermined impedance; and causing a component of the radio frequency signal to propagate through a capacitor provided in a middle of the inner conductor, an impedance at a portion of the capacitor installed being adjusted to match the predetermined impedance by a dielectric material provided around the capacitor.

Abstract: A radio frequency signal transmission method for transmitting a radio frequency signal through an inner conductor serving as a signal line, the radio frequency signal transmission method including: causing the radio frequency signal to be input to and propagate through the inner conductor, an impedance between the inner conductor and an outer conductor serving as a grounding line being adjusted to a predetermined impedance; and causing a component of the radio frequency signal to propagate through a capacitor provided in a middle of the inner conductor, an impedance at a portion of the capacitor installed being adjusted to match the predetermined impedance by a dielectric material provided around the capacitor.

Abstract: A coaxial connector includes a first inner conductor and a second inner conductor. A capacitor connects between the first inner conductor and the second inner conductor. An outer conductor extends along and surrounds the first and second inner conductors and the capacitor. A first dielectric material is filled in a gap between the outer conductor and the first and second inner conductors. A support member supports the first and second inner conductors with respect to the outer conductor. A second dielectric material for impedance matching is provided between the capacitor and the outer conductor.

Abstract: A connection device includes a ground electrode layer that is provided in a substrate, a first transmission path that is provided on the ground electrode layer via a dielectric layer, and a plurality of leads that are connected to the first transmission path and the ground electrode layer or the first transmission path and a plane that is electrically connected to the ground electrode layer. The plurality of leads are fitted into through-holes that are provided in a second transmission path and a ground electrode on a flexible substrate to be electrically connected.

Abstract: A lead terminal includes signal lead pins and GND lead pins. The signal lead pin connects one signal pattern on a flexible substrate and another signal pattern on a rigid substrate. The GND lead pin connects one GND pattern on the flexible substrate and another GND pattern in the rigid substrate. A holding member has an insulating property and holds pairs of the signal lead pins and the GND lead pins at a distance. One main part of the signal lead pin and another main part of the GND lead pin form a microstrip line structure.

Abstract: A substrate for high frequency includes: a dielectric substrate; a transmission line which is formed on a front surface of the dielectric substrate and includes land portions opposite to each other with a gap therebetween; a grounded conductor which is formed on a rear surface of the dielectric substrate and includes an opening portion in a region corresponding to the land portions; and a metal substrate on which the dielectric substrate is disposed in a state where the grounded conductor is in contact with the metal substrate, and also, a through hole is formed at a portion corresponding to the opening portion.

Abstract: In a receiver, a skew detector detects a skew between two synchronization symbols having different wavelengths among synchronization symbols included in received signals. A skew rough adjustment calculator calculates a delay compensation amount for each received signal based on the skew and a signal delay characteristic in a transmission path. A variable delay processor deskews the received signals based on the delay compensation amount.

Abstract: According to an aspect of an embodiment, a substrate for connecting circuit boards comprises: a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other; a first signal line formed on the first surface of the first end; a second signal line formed on the second surface of the second end; a third signal line connecting the first signal line with the second signal line; a first ground plane arranged on the first surface and surrounding the first signal line; and a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.

Abstract: A substrate module includes a first substrate and a second substrate. The first substrate comprises a base material; a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material; a ground pattern on the rear surface of the base material; and an exposed portion in which the ground pattern on the substrate surface is exposed by partially cutting out the base material and the ground pattern on the substrate rear surface. The second substrate comprises a base material and a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material. In connecting a transmission line of the first substrate and that of the second substrate, the ground patterns of the first and second substrates are fused with each other at the exposed portion and fixed.

Abstract: A coaxial connector includes a first inner conductor and a second inner conductor. A capacitor connects between the first inner conductor and the second inner conductor. An outer conductor extends along and surrounds the first and second inner conductors and the capacitor. A first dielectric material is filled in a gap between the outer conductor and the first and second inner conductors. A support member supports the first and second inner conductors with respect to the outer conductor. A second dielectric material for impedance matching is provided between the capacitor and the outer conductor.

Abstract: A circuit board has a multilayer substrate having a surface earth pattern and signal line on a surface of the multilayer substrate and an inner earth pattern in the multilayer substrate; a connecting conductor pattern arranged at an end of the inner earth pattern and an side face of the multilayer substrate, the connecting conductor pattern electricity connecting with the surface earth pattern with the inner earth pattern; and a connector having an inner conductor and an outer conductor, the inner conductor electrically connected with the signal line, the outer conductor electrically connected with the connecting conductor pattern.

Abstract: A coaxial connector is configured to be connected to a flexible printed circuit board on which a signal line is formed. An inner conductor is configured to be connected to the signal line. An outer conductor surrounds the inner conductor and serves as a connector body. At least one slit is provided to the outer conductor so that a portion of the flexible printed circuit board is inserted therein.

Abstract: According to an aspect of an embodiment, a substrate for connecting circuit boards comprises: a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other; a first signal line formed on the first surface of the first end; a second signal line formed on the second surface of the second end; a third signal line connecting the first signal line with the second signal line; a first ground plane arranged on the first surface and surrounding the first signal line; and a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.

Abstract: According to an aspect of an embodiment, a flexible circuit board for connecting a first device and a second device, the flexible circuit board comprises: a base material comprising a flexible material having a first end adapted to connect with the first apparatus, a second end adapted to connect with the second apparatus and a hollow arranged between the first end and the second end; a signal line arranged on a surface of the base material, the signal line capable of electrically connecting the first apparatus and the second apparatus, the signal line having a constant characteristic impedance along the signal line in association with the base material; and a line arranged on the base material and over the hollow, the line capable of electrically connecting the first apparatus and the second apparatus.

Abstract: An electronic component package includes a film board where an electronic component is mounted, and a lid part mounted on the film board so as to cover a surface of the film board. The electronic component is provided in a cavity formed by the film board and the lid part, and the electronic component is connected to a signal wiring conductor formed at the film board.

Abstract: An inductor circuit board that is made compatible with broadband by reducing parasitic capacitance of an inductor. The inductor circuit board is comprised of a flexible substrate made of a material, such as polyimide or liquid polymer, a transmission line formed on the flexible substrate, and an inductor. The inductor has a three-dimensional conical structure in which component inductors having different inductances are continuously connected to each other, with one end thereof connected to a portion of the transmission line between an input end and an output end thereof, and is formed according to a transmission line pattern by wiring on a plurality of surface layers of the flexible substrate and connecting portions wired on the surface layers by vias that connect between the layer surfaces of the substrate, such that the inductor is expanded in a fan-like manner as it is farther from the one end connected to the transmission line.

Abstract: A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.