Abstract: An optical module include a first substrate including a first surface over which a light emitting element is mounted, an optical waveguide provided with a second surface of the first substrate, a mirror configured to reflect output light of the light emitting element to the optical waveguide, a second substrate, and a light receiving element configured to receive leakage light produced when the output light from the light emitting element is transmitted through the mirror disposed in the optical waveguide, the light receiving element being mounted over the second substrate different from the first substrate.

Abstract: An optical module includes: a first circuit board on which a connector socket is mounted, an optical transceiver module that is electrically connected to the first circuit board via the connector socket; a heat sink; and a heat dissipating sheet. The optical transceiver module includes: a second circuit board on which an E/O converter, a drive circuit for the E/O converter, an O/E converter, and a current-to-voltage conversion circuit for the O/E converter are mounted; and an optical waveguide that guides an optical signal generated by the E/O converter to an output end of the optical transceiver module, and that guides an input optical signal to the O/E converter. The heat sink is thermally coupled to the E/O converter, the drive circuit, the O/E converter, and the current-to-voltage conversion circuit via the heat dissipating sheet, and presses the optical transceiver module onto the first circuit board.

Abstract: An optical module includes: a first circuit board that has a first edge connector and a connector socket; and an optical transceiver module that is electrically connected to the first circuit board via the connector socket. The optical transceiver module includes a second circuit board on which an E/O converter, a drive circuit that drives the E/O converter, an O/E converter, and a current-to-voltage conversion circuit that converts an output current of the O/E converter into a voltage signal are mounted. The second circuit board has a second edge connector corresponding to the connector socket mounted on the first circuit board. Signal lines of the drive circuit are pulled out from the drive circuit in a first direction. Signal lines of the current-to-voltage conversion circuit are pulled out from the current-to-voltage conversion circuit in a second direction that is substantially opposite to the first direction.

Abstract: A connector includes a housing, first and second terminals, and a third terminal. The housing accommodates an end portion of a circuit board, the first and second terminals respectively contact first and second contacts among a plurality of contacts arranged side by side on a first side of the end portion of the circuit board. The third terminal contacts a third contact on a second side of the end portion of the circuit board opposite to the first side, and the third contact is arranged at a position facing the first contact with the circuit board therebetween. A support body of dielectric material supports a position on the second side facing the second contact with the circuit board therebetween.

Abstract: A connector includes an electrode sheet, a cover, and a resistor sheet. A plurality of electrodes are attached on a side of the electrode sheet. The electrode sheet is an insulator. The cover covers the electrode sheet. The resistor sheet is provided between the cover and the electrode sheet and has electrical resistivity.

Abstract: An optical module includes first optical elements disposed on a first surface side of optical waveguides, first signal wirings disposed on the first surface side in parallel with each other in a direction intersecting with a transmission direction of an electrical signal transmitted by a first signal wiring, second optical elements disposed on a second surface side of the optical waveguides, and second signal wirings disposed on the second surface side in parallel with each other in a direction intersecting with a transmission direction of an electrical signal transmitted by a second signal wirings, the optical waveguides being disposed in parallel with each other in a direction intersecting with an optical waveguide direction of an optical signal guided by an optical waveguide at an interval which is narrower than an interval between the adjacent first signal wirings and narrower than an interval between the adjacent second signal wirings.

Abstract: An optical module includes: a light-receiving element configured to receive an optical signal and convert the optical signal to an electrical signal; a transmission line configured to transmit an electrical signal; and an amplifier element configured to amplify an electrical signal that is output from the light-receiving element and transmitted through the transmission line, wherein characteristic impedance of the transmission line connecting the light-receiving element and the amplifier element is higher than input impedance of the amplifier element.

Abstract: An optical transmission system including a transmitting unit to transmit an optical main signal, a receiving unit to receive the optical main signal, and a transmission line through which the optical main signal is transmitted, the optical transmission system includes: an optical transmitter unit configured to be activated or inactivated based on a control signal so as to transmit the control signal, the optical transmitter being included in the transmitting; and an optical receiver configured to receive light with the activate state or the inactivate state of the optical transmitter the optical receiver being included in the receiving unit, wherein the receiving unit regenerates the control signal, based on a power of the received light.

Abstract: A connection device includes a ground electrode layer that is provided in a substrate, a first transmission path that is provided on the ground electrode layer via a dielectric layer, and a plurality of leads that are connected to the first transmission path and the ground electrode layer or the first transmission path and a plane that is electrically connected to the ground electrode layer. The plurality of leads are fitted into through-holes that are provided in a second transmission path and a ground electrode on a flexible substrate to be electrically connected.

Abstract: An optical transmission apparatus includes first and second circuit boards, and a connector. The first circuit board includes an optical transmission processing circuit, a first transmission line electrically coupled to the optical transmission processing circuit, a first pad on one surface of the first circuit board electrically coupled to the first transmission line, and a second pad on the other surface of the first circuit board electrically coupled to the first pad. The second circuit board includes a second transmission line of a layer of a multilayered structure, and a third pad on one surface of the second circuit board electrically coupled to the second transmission line and the second pad. The connector has an electrode disposed in two dimensions at a position to couple with the first pad in the case of the second circuit board is electrically coupled with the first circuit board.

Abstract: A lead terminal includes signal lead pins and GND lead pins. The signal lead pin connects one signal pattern on a flexible substrate and another signal pattern on a rigid substrate. The GND lead pin connects one GND pattern on the flexible substrate and another GND pattern in the rigid substrate. A holding member has an insulating property and holds pairs of the signal lead pins and the GND lead pins at a distance. One main part of the signal lead pin and another main part of the GND lead pin form a microstrip line structure.

Abstract: A lead terminal includes signal lead pins and GND lead pins. The signal lead pin connects one signal pattern on a flexible substrate and another signal pattern on a rigid substrate. The GND lead pin connects one GND pattern on the flexible substrate and another GND pattern in the rigid substrate. A holding member has an insulating property and holds pairs of the signal lead pins and the GND lead pins at a distance. One main part of the signal lead pin and another main part of the GND lead pin form a microstrip line structure.

Abstract: According to an aspect of an embodiment, a flexible circuit board for connecting a first device and a second device, the flexible circuit board comprises: a base material comprising a flexible material having a first end adapted to connect with the first apparatus, a second end adapted to connect with the second apparatus and a hollow arranged between the first end and the second end; a signal line arranged on a surface of the base material, the signal line capable of electrically connecting the first apparatus and the second apparatus, the signal line having a constant characteristic impedance along the signal line in association with the base material; and a line arranged on the base material and over the hollow, the line capable of electrically connecting the first apparatus and the second apparatus.

Abstract: A coaxial connector that includes: a first inner conductor and a second inner conductor; a capacitor that is electrically coupled to the first inner conductor and the second inner conductor; an outer conductor that surrounds the first and second inner conductors, and the capacitor; a first support member that fixes the first inner conductor to the outer conductor; a second support member that fixes the second inner conductor to the outer conductor; a first dielectric material that is provided between the outer conductor and the first inner conductor and between the outer conductor and the second inner conductor, and a second dielectric material that is provided between the outer conductor and the capacitor.

Abstract: A lead terminal includes signal lead pins and GND lead pins. The signal lead pin connects one signal pattern on a flexible substrate and another signal pattern on a rigid substrate. The GND lead pin connects one GND pattern on the flexible substrate and another GND pattern in the rigid substrate. A holding member has an insulating property and holds pairs of the signal lead pins and the GND lead pins at a distance. One main part of the signal lead pin and another main part of the GND lead pin form a microstrip line structure.

Abstract: A circuit board has a multilayer substrate having a surface earth pattern and a signal line on a surface of the multilayer substrate and an inner earth pattern in the multilayer substrate. A connecting conductor pattern is arranged at an end of the inner earth pattern and on a side face of the multilayer substrate. The connecting conductor pattern electrically connects the surface earth pattern with the inner earth pattern. A connector has an inner conductor and an outer conductor, with the inner conductor electrically connected with the signal line, and the outer conductor electrically connected with the connecting conductor pattern.

Abstract: A substrate for high frequency includes: a dielectric substrate; a transmission line which is formed on a front surface of the dielectric substrate and includes land portions opposite to each other with a gap therebetween; a grounded conductor which is formed on a rear surface of the dielectric substrate and includes an opening portion in a region corresponding to the land portions; and a metal substrate on which the dielectric substrate is disposed in a state where the grounded conductor is in contact with the metal substrate, and also, a through hole is formed at a portion corresponding to the opening portion.

Abstract: There is provided an optical receiver. The optical receiver includes a board to be coupled with an optical transmission line array, an optical diode array disposed on the board, and the optical diode array including a plurality of photo diodes each of which receives light from a corresponding optical transmission line in the optical transmission array. Further bias suppliers, conversion circuits, and capacitors are provided on the board or a real side of the board. Each of the photo diodes includes a first electrode and second electrodes, the first electrode receives a bias voltage supplied by a bias supplier, a current signal flowing through the second electrode is converted by a conversion circuit into a voltage signal, and one end of a capacitor is coupled to the first electrode and the other is grounded.

Abstract: An electronic component package includes a film board where an electronic component is mounted, and a lid part mounted on the film board so as to cover a surface of the film board. The electronic component is provided in a cavity formed by the film board and the lid part, and the electronic component is connected to a signal wiring conductor formed at the film board.

Abstract: A connector includes an electrode sheet, a cover, and a resistor sheet. A plurality of electrodes are attached on a side of the electrode sheet. The electrode sheet is an insulator. The cover covers the electrode sheet. The resistor sheet is provided between the cover and the electrode sheet and has electrical resistivity.