Abstract: An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric substrate. A second signal line connected to an outside connection electrode and a second ground conductor are formed on a second surface of the dielectric substrate. The first ground conductor and the second ground conductor are connected by a plurality of ground conductor via-holes. A substrate-buried signal line connected to the first signal line and the second signal line is provided inside of the dielectric substrate so as to be put between the first ground conductor and the second ground conductor above and below and between the ground conductor via-holes on the right and left.

Abstract: An inductor circuit board that is made compatible with broadband by reducing parasitic capacitance of an inductor. The inductor circuit board is comprised of a flexible substrate made of a material, such as polyimide or liquid polymer, a transmission line formed on the flexible substrate, and an inductor. The inductor has a three-dimensional conical structure in which component inductors having different inductances are continuously connected to each other, with one end thereof connected to a portion of the transmission line between an input end and an output end thereof, and is formed according to a transmission line pattern by wiring on a plurality of surface layers of the flexible substrate and connecting portions wired on the surface layers by vias that connect between the layer surfaces of the substrate, such that the inductor is expanded in a fan-like manner as it is farther from the one end connected to the transmission line.

Abstract: In a receiver, a skew detector detects a skew between two synchronization symbols having different wavelengths among synchronization symbols included in received signals. A skew rough adjustment calculator calculates a delay compensation amount for each received signal based on the skew and a signal delay characteristic in a transmission path. A variable delay processor deskews the received signals based on the delay compensation amount.

Abstract: A coaxial connector is configured to be connected to a flexible printed circuit board on which a signal line is formed. An inner conductor is configured to be connected to the signal line. An outer conductor surrounds the inner conductor and serves as a connector body. At least one slit is provided to the outer conductor so that a portion of the flexible printed circuit board is inserted therein.

Abstract: An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric substrate. A second signal line connected to an outside connection electrode and a second ground conductor are formed on a second surface of the dielectric substrate. The first ground conductor and the second ground conductor are connected by a plurality of ground conductor via-holes. A substrate-buried signal line connected to the first signal line and the second signal line is provided inside of the dielectric substrate so as to be put between the first ground conductor and the second ground conductor above and below and between the ground conductor via-holes on the right and left.

Abstract: A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.

Abstract: A substrate module includes a first substrate and a second substrate. The first substrate comprises a base material; a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material; a ground pattern on the rear surface of the base material; and an exposed portion in which the ground pattern on the substrate surface is exposed by partially cutting out the base material and the ground pattern on the substrate rear surface. The second substrate comprises a base material and a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material. In connecting a transmission line of the first substrate and that of the second substrate, the ground patterns of the first and second substrates are fused with each other at the exposed portion and fixed.

Abstract: In the direct current cut structure of the present invention, two capacitors are provided in parallel between signal transmission line patterns facing each other on a substrate, and each of the two capacitors is electrically connected to each surface of each transmission line pattern that is exposed through a hole part provided on the substrate. It is preferable for the two capacitors to have different capacity. If there is no need to cover such a broad band, only one capacitor can also connected to either side of each transmission line pattern exposed through the hole part.

Abstract: In the direct current cut structure of the present invention, two capacitors are provided in parallel between signal transmission line patterns facing each other on a substrate, and each of the two capacitors is electrically connected to each surface of each transmission line pattern that is exposed through a hole part provided on the substrate. It is preferable for the two capacitors to have different capacity. If there is no need to cover such a broad band, only one capacitor can also connected to either side of each transmission line pattern exposed through the hole part.