Abstract: A sheet metal processing plant includes a conveyor defining a receiving surface for a workpiece and a conveying direction in a conveying plane and being embodied for conveying the workpiece, the workpiece having a bottom side and a top side, and a turning unit embodied for turning the workpiece received on the receiving surface from the bottom side to the top side. The turning unit includes a manipulator embodied to lift the bottom side of the workpiece off the receiving surface, to perform a turning operation of the workpiece and to place the top side of the workpiece on the receiving surface of the conveyor.

Abstract: Sheet-like product and method for authenticating a security tag including a section of the sheet-like product. The sheet-like product includes at least one security feature having optical properties that change with the viewing angle and, and at least one marker, wherein each marker is uniquely attributable to a position on the sheet-like product. The position of the at least one security feature on the sheet-like product is predetermined relative to the position of the at least one marker on the sheet-like product.

Abstract: Articles and methods including additives in electrochemical cells, are generally provided. As described herein, such electrochemical cells may comprise an anode, a cathode, an electrolyte, and optionally a separator. In some embodiments, at least one of the anode, the cathode, the electrolyte, and/or the optional separator may comprise an additive and/or additive precursor. For instance, in some cases, the electrochemical cell comprises an electrolyte and an additive and/or additive precursor that is soluble with and/or is present in the electrolyte. In some embodiments, the additive precursor comprises a disulfide bond. In certain embodiments, the additive is a carbon disulfide salt. In some cases, the electrolyte may comprise a nitrate.

Abstract: A multi-die integrated circuit device and a method of fabricating the multi-die integrated circuit device involve a substrate. Two or more dice include components that implement functionality of the multi-die integrated circuit. The components include logic gates. The multi-die integrated circuit device also includes a spacer disposed between the substrate and each of the two or more dice. Each of the two or more dice makes direct electrical contact with the substrate without making direct electrical contact with the spacer through holes in the spacer.

Abstract: A method for producing a high-voltage energy storage device which is designed for storing electric energy, for a motor vehicle, in which storage modules are at least partially arranged in a receptacle space of a storage box of the high-voltage energy storage device, having the following steps: providing a base cooling structure of the storage box wherein the base cooling structure includes two cover elements spaced apart from one another and cooling ducts, which extend between the cover elements and through which a coolant fluid can flow.

Abstract: A method for mounting vehicle elements of a motor vehicle rear end of a motor vehicle. The motor vehicle has a body on which a rear-end covering, rear lights and a trim are mounted. The mounting sequence is chosen in such a way that first of all the rear-end covering is arranged and fastened on the body, then the rear lights are arranged with orientation on the rear-end covering and then the trim is arranged with orientation on the rear-end covering and on the rear lights.

Abstract: Described herein is a method of using aqueous polymer dispersions, which are obtainable by radical aqueous emulsion polymerization in the presence of a degraded starch as an opacifier in liquid formulations. Also described herein is a process for producing the aqueous polymer dispersions. Also described herein are liquid formulations, such as detergent formulations and liquid cosmetic preparations, which contain at least one aqueous polymer dispersion.

Abstract: Object marking, and method for producing same, for optical authentication of an object, wherein at least one section of a material piece of a basic material is determined arbitrarily or randomly and the object marking is produced with the at least one section, and wherein the basic material of the material piece has a repeating security feature having optical properties dependent on the viewing angle, the dimensions of said security feature being larger than the dimensions of the section, more particularly larger than the dimensions of the object marking, such that each section is unique and has only a part of the security feature.

Abstract: Embodiments of the invention relate to a grate bar front section and a matching grate bar rear section and to a grate bar including the grate bar front section and/or the grate bar rear section configured such that, by releasably connecting the grate bar front section to the grate bar rear section, manufacture and maintenance costs are reduced.

Abstract: Object marking, and method for producing same, for optical authentication of an object, wherein at least one section of a material piece of a basic material is determined arbitrarily or randomly and the object marking is produced with the at least one section, and wherein the basic material of the material piece has a repeating security feature having optical properties dependent on the viewing angle, the dimensions of said security feature being larger than the dimensions of the section, more particularly larger than the dimensions of the object marking, such that each section is unique and has only a part of the security feature.

Abstract: An alignment carrier, assembly and methods that enable the precise alignment and assembly of two or more semiconductor die using an interconnect bridge. The alignment carrier includes a substrate composed of a material that has a coefficient of thermal expansion that substantially matches that of an interconnect bridge. The alignment carrier further includes a plurality of solder balls located on the substrate and configured for alignment of two or more semiconductor die.

Abstract: An object marking including a first security element and at least a second security element, wherein each security element is associated with a set of data segments and each security element exhibits depending on the capturing conditions, in particular the viewing angle and/or the direction of illumination, a code segment which is an optoelectronically readable representation of one of the data segments of the set associated with the respective security element, wherein different distinct data segments are represented by different code segments and that the set associated with the first security element and the set associated with the second security element differ in at least one data segment; method for producing and method for authenticating the same.

Abstract: A battery arrangement having a housing lower part and a housing cover arranged on the housing lower part, and at least one battery module which is arranged in the battery arrangement and which has at least one battery cell. The at least one battery module has a first side defining an upper side and is arranged in the battery arrangement in such a way that the upper side of the battery module faces toward the housing cover and is at a distance from the housing cover in at least one region of the upper side. Furthermore, between the upper side of the battery module and the housing cover, a heat-conducting compound that completely fills a space between the at least one region of the upper side and the housing cover is arranged.

Abstract: LRP/LR for use in the treatment and/or prevention of Parkinson's disease (PD). Pharmaceutical compositions comprising LRP/LR for use in the treatment of Parkinson's Disease (PD), and a method of maintaining concentration levels of dopamine within a human or animal body.

Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.

Abstract: The present invention relates to a compound for use in the treatment or prevention of a liver disease, wherein the compound is a amyloid beta related protein, the amyloid beta related protein being selected from the group consisting of amyloid beta protein, a amyloid beta peptide derived therefrom, amyloid precursor protein (APP), a compound involved in the generation of an amyloid beta peptide from APP, or a compound inhibiting the degradation of the amyloid beta protein or of amyloid peptides derived therefrom.

Abstract: An electrical device includes an electrically insulating body having an insulating body surface and a conductive pad array, a small conductive pad arranged on the insulating body surface and within the conductive pad array, and an enlarged conductive pad. The enlarged conductive pad is arranged on the insulating body and within the conductive pad array, wherein the enlarged conductive pad is spaced apart from the small conductive pad and is larger than the small conductive pad. C4 assemblies and methods of making C4 assemblies including the electrical device are also described.

Abstract: A security device and a method for verifying such a security device are disclosed. The security device has at least two security features. At least one of the security features is a tamper-evident security feature, which is configured to alter irreversibly upon mechanical tampering with the security device. At least one other of the security features is a robust security feature, which is robust against tampering with the security device. The at least two security features can be extracted from at least one image of the security device with a programmable device having a camera at least in an intact state of the security device.

Abstract: A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.

Abstract: Disclosed are embodiments of forming porous copper on the end of a copper pillar. The embodiments may be used to remove solder from selected locations on a chip or laminate substrate.