Abstract: In some embodiments, connecting a component to a substrate by adhesion to an oxidized solder surface includes: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; adhering the component to an oxidized surface of a solder portion applied to the substrate.

Abstract: Articles and methods including additives in electrochemical cells, are generally provided. As described herein, such electrochemical cells may comprise an anode, a cathode, an electrolyte, and optionally a separator. In some embodiments, at least one of the anode, the cathode, the electrolyte, and/or the optional separator may comprise an additive and/or additive precursor. For instance, in some cases, the electrochemical cell comprises an electrolyte and an additive and/or additive precursor that is soluble with and/or is present in the electrolyte. In some embodiments, the additive precursor comprises a disulfide bond. In certain embodiments, the additive is a carbon disulfide salt. In some cases, the electrolyte may comprise a nitrate.

Abstract: Articles and methods involving protected electrode structures are generally provided. In some embodiments, a protected electrode structure includes an electrode comprising an alkali metal and a protective structure directly adjacent the electrode. In some embodiments, the protective structure comprises elemental carbon and intercalated ions. In some embodiments, the protective structure is a composite protective structure. The composite structure may comprise an alloy comprising an alkali metal, an oxide of an alkali metal, and/or a fluoride salt of an alkali metal.

Abstract: At least one plating pen is brought into aligned relationship with at least one hole defined in a board. The pen includes a central retractable protrusion, a first shell surrounding the protrusion and defining a first annular channel therewith, and a second shell surrounding the first shell and defining a second annular channel therewith. The protrusion is lowered to block the hole and plating material is flowed down the first channel to a surface of the board and up into the second channel, to form an initial deposit on the board surface. The protrusion is raised to unblock the hole, and plating material is flowed down the first annular channel to side walls of the hole and up into the second annular channel, to deposit the material on the side walls of the hole.

Abstract: An electrical device includes an electrically insulating body having an insulating body surface and a conductive pad array, a small conductive pad arranged on the insulating body surface and within the conductive pad array, and an enlarged conductive pad. The enlarged conductive pad is arranged on the insulating body and within the conductive pad array, wherein the enlarged conductive pad is spaced apart from the small conductive pad and is larger than the small conductive pad. C4 assemblies and methods of making C4 assemblies including the electrical device are also described.

Abstract: Disclosed are embodiments of forming porous copper on the end of a copper pillar. The embodiments may be used to remove solder from selected locations on a chip or laminate substrate.

Abstract: A forming operation on a workpiece clamps the workpiece between a first clamping jaw with a first shaping edge, and an adjustable second clamping jaw with a second shaping edge so that a portion projects between the shaping edges and afterwards a bending edge of an adjustable bending bar is guided at a distance past the shaping edges, whereby the portion of the workpiece is angled away in relation to the part of the workpiece that is clamped between the clamping jaws. The bending edge is guided on angling along a straight path of movement of the bending edge, and after the bending edge has passed the shaping edges, the shaping edges are adjusted along an adjustment path which approaches the path of movement of the bending edge.

Abstract: A biopharmaceutical agent including a 37 kDa/67 kDa laminin receptor precursor/high affinity laminin receptor (LRP/LR) and/or a fragment thereof for use in treatment and/or prevention of atherosclerosis and/or obesity and/or insulin resistance and/or diabetes. The biopharmaceutical agent may be encapsulated by functionalized or non-functionalized nanoparticles, and further may be formulated to include a carrier to provide a pharmaceutical composition for parental or non-parental administration. In use, the biopharmaceutical agent reduces lipid content in target cells. Also, a method of decreasing lipid concentration in a target cell of a human or animal subject.

Abstract: Sheet-like product and method for authenticating a security tag including a section of the sheet-like product. The sheet-like product includes at least one security feature having optical properties that change with the viewing angle and, and at least one marker, wherein each marker is uniquely attributable to a position on the sheet-like product. The position of the at least one security feature on the sheet-like product is predetermined relative to the position of the at least one marker on the sheet-like product.

Abstract: Articles and methods including additives in electrochemical cells, are generally provided. As described herein, such electrochemical cells may comprise an anode, a cathode, an electrolyte, and optionally a separator. In some embodiments, at least one of the anode, the cathode, the electrolyte, and/or the optional separator may comprise an additive and/or additive precursor. For instance, in some cases, the electrochemical cell comprises an electrolyte and an additive and/or additive precursor that is soluble with and/or is present in the electrolyte. In some embodiments, the additive precursor comprises a disulfide bond. In certain embodiments, the additive is a carbon disulfide salt. In some cases, the electrolyte may comprise a nitrate.

Abstract: A method for producing a security device includes providing at least one stochastic selector, generating a coupling between an identifier and one particular combination of security features from a finite set of distinct combinations of security features based on the at least one stochastic selector, registering the coupling in a database, and applying an identification element including the identifier and a non-printable security element including the particular combination of security features according to the coupling to a substrate to produce a security device.

Abstract: A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.

Abstract: This disclosure teaches a disposable inserter which includes a housing having arranged in a displaceable configuration an inserter assembly comprising a cannula assembly with a cannula, a manually operable member for displacing the inserter assembly from a retracted position to an advanced position in order to manually insert the cannula into the skin of a patient, a locking element for blocking or enabling displacement of the inserter assembly, and a coupling arrangement for coupling the disposable inserter to a reusable inserter for automatically displacing the inserter assembly from the retracted position to the advanced position in order to automatically insert the cannula into the skin of the patient.

Abstract: The invention relates to compounds for use in the treatment of telomere related diseases and/or telomere related medical conditions, particularly wherein said telomere related diseases and/or telomere related medical conditions are cancer and cellular ageing. Particularly, herein is disclosed 37 kDa/67 kDa laminin receptor precursor/high affinity laminin receptor (LRP/LR) and/or a fragment thereof for use in the treatment and/or prevention of cellular ageing.

Abstract: A multi-die integrated circuit device and a method of fabricating the multi-die integrated circuit device involve a substrate. Two or more dice include components that implement functionality of the multi-die integrated circuit. The components include logic gates. The multi-die integrated circuit device also includes a spacer disposed between the substrate and each of the two or more dice. Each of the two or more dice makes direct electrical contact with the substrate without making direct electrical contact with the spacer through holes in the spacer.

Abstract: Sheet-like product and method for authenticating a security tag including a section of the sheet-like product. The sheet-like product includes at least one security feature having optical properties that change with the viewing angle and, and at least one marker, wherein each marker is uniquely attributable to a position on the sheet-like product. The position of the at least one security feature on the sheet-like product is predetermined relative to the position of the at least one marker on the sheet-like product.

Abstract: A multi-die integrated circuit device and a method of fabricating the multi-die integrated circuit device involve a substrate. Two or more dice include components that implement functionality of the multi-die integrated circuit. The components include logic gates. The multi-die integrated circuit device also includes a spacer disposed between the substrate and each of the two or more dice. Each of the two or more dice makes direct electrical contact with the substrate without making direct electrical contact with the spacer through holes in the spacer.

Abstract: A rail vehicle has a bogie, which is covered in such a way that a bogie cavity exists, which is formed in the under floor region of the rail vehicle by a cover assembly and walls adjacent to the bogie. A device for producing pressurized air is connected, with respect to flow, to an air inlet device in the walls of the bogie cavity in such a way that the air can be blown into the bogie cavity.

Abstract: An alignment carrier, assembly and methods that enable the precise alignment and assembly of two or more semiconductor die using an interconnect bridge. The alignment carrier includes a substrate composed of a material that has a coefficient of thermal expansion that substantially matches that of an interconnect bridge. The alignment carrier further includes a plurality of solder balls located on the substrate and configured for alignment of two or more semiconductor die.

Abstract: A module including a first semiconductor device, a second semiconductor device, a bridge support structure and a base substrate. The semiconductor devices each having first bonding pads having a first solder joined with the base substrate and the semiconductor devices each having second and third bonding pads joined to second and third bonding pads on the bridge support structure by a second solder and a third solder, respectively, on the second and third bonding pads; the semiconductor devices positioned adjacent to each other such that the bridge support structure joins to both of the semiconductor devices by the second and third solders wherein the third bonding pads are larger than the second bonding pads and the third bonding pads are at a larger pitch than the second bonding pads.