Abstract: A security device and a method for verifying such a security device are disclosed. The security device has at least two security features. At least one of the security features is a tamper-evident security feature, which is configured to alter irreversibly upon mechanical tampering with the security device. At least one other of the security features is a robust security feature, which is robust against tampering with the security device. The at least two security features can be extracted from at least one image of the security device with a programmable device having a camera at least in an intact state of the security device.

Abstract: Place a first semiconductor chip onto an alignment carrier with protrusions of the semiconductor chip inserted into corresponding cavities of the alignment carrier, so that the protrusions and cavities locate the semiconductor chip with interconnect contacts overlying a window that is formed through the alignment carrier. Place a second semiconductor chip onto the alignment carrier with protrusions of the second semiconductor chip inserted into cavities of the alignment carrier, so that the protrusions and cavities locate the second semiconductor chip with interconnect contacts of the second semiconductor chip adjacent to the interconnect contacts of the first semiconductor chip and overlying the window. Fasten the semiconductor chips to the alignment carrier. Touch contacts of a interconnect bridge against the interconnect contacts of the first and second semiconductor chips by putting the interconnect bridge through the window.

Abstract: Articles and methods including additives in electrochemical cells, are generally provided. As described herein, such electrochemical cells may comprise an anode, a cathode, an electrolyte, and optionally a separator. In some embodiments, at least one of the anode, the cathode, the electrolyte, and/or the optional separator may comprise an additive and/or additive precursor. For instance, in some cases, the electrochemical cell comprises an electrolyte and an additive and/or additive precursor that is soluble with and/or is present in the electrolyte. In some embodiments, the additive precursor comprises a disulfide bond. In certain embodiments, the additive is a carbon disulfide salt. In some cases, the electrolyte may comprise a nitrate.

Abstract: A multiple chip carrier assembly including a carrier having a first surface and a second surface is attached to a plurality of chips is described. The plurality of chips include a first chip and a second chip. Each of the chips has first surface with a first set of solder balls for connecting to a package and a second set of solder balls for connecting to a high signal density bridge element. A second surface of each chip is bonded to the first surface of the carrier. A package has a first surface which is connected to the first sets of solder balls of the first and second chips. A high signal density bridge element having high signal density wiring on one or more layers is connected to the second sets of solder balls of the first and second chips. The bridge element is disposed between the first surface of the package and the first surfaces of the first and second chips.

Abstract: A method and structure for joining a semiconductor device and a laminate substrate or two laminate substrates where the joint is formed with lead free solders and lead free compositions. The various lead free solders and lead free compositions are chosen so that there is a sufficient difference in liquidus temperatures such that some components may be joined to, or removed from, the laminate substrate without disturbing other components on the laminate substrate.

Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.

Abstract: The present invention includes a system for withdrawing body fluids. The system includes a drive unit having a plunger which is moved from a resting position into a lancing position in order to carry out a lancing process and a lancing unit containing a lancet with a needle. The plunger and lancet are coupled together by a form fit in order to carry out a lancing process. The invention additionally concerns a method for temporarily extending a needle from a device for withdrawing body fluid as well as a lancing unit that can be attached to the drive unit.

Abstract: Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly.

Abstract: A lancet magazine for use in a lancing aid is described comprising a plurality of lancets each having a lancet body at the proximal end of the lancet and a lancet tip at the distal end of the lancet, where the proximal end of the lancet points in the direction of the proximal end of the housing of the lancet magazine and the distal end of the lancet is aligned in the direction of the distal end of the housing and the lancets in the unused state are completely surrounded by the housing. Furthermore, an extension unit is movably connected to the housing in such a manner that the housing can be extended by movement of the extension unit in the direction of the distal end of the housing such that the lancet is prevented from emerging from the lancet magazine.

Abstract: A system and method to manage privileges, wherein privileges are assigned to uniquely identifiable objects and a link between a uniquely identifiable object and a uniquely identifiable programmable device is established. The established link allows the uniquely identifiable programmable device to make use of at least a part of the privileges assigned to the uniquely identifiable object. The link is established under a set of preconditions, where at least the precondition of physical proximity between the uniquely identifiable object and the uniquely identifiable programmable device is verified. The uniquely identifiable object includes a irreproducible security device, which is registered to the uniquely identifiable object and can be used to verify physical proximity between the uniquely identifiable object and the uniquely identifiable programmable device by authenticating the irreproducible security device by optical authentication means.

Abstract: A method and structure for joining a semiconductor device and a laminate substrate or two laminate substrates where the joint is formed with lead free solders and lead free compositions. The various lead free solders and lead free compositions are chosen so that there is a sufficient difference in liquidus temperatures such that some components may be joined to, or removed from, the laminate substrate without disturbing other components on the laminate substrate.

Abstract: A holder (10) for mounting a camera in a through-opening (12) in the region of a bumper (14) of a vehicle (16) has an outer part (18) that can be mounted on the bumper (14) from an outer face (20) of the bumper and an inner part (22) that can be mounted from an inner face (24) of the bumper (14). A receiving space (26) for receiving the camera is formed between the outer part (18) and the inner part (22) and the outer part (18) is designed for mounting the camera.

Abstract: Articles and methods including additives in electrochemical cells, are generally provided. As described herein, such electrochemical cells may comprise an anode, a cathode, an electrolyte, and optionally a separator. In some embodiments, at least one of the anode, the cathode, the electrolyte, and/or the optional separator may comprise an additive and/or additive precursor. For instance, in some cases, the electrochemical cell comprises an electrolyte and an additive and/or additive precursor that is soluble with and/or is present in the electrolyte. In some embodiments, the additive precursor comprises a disulfide bond. In certain embodiments, the additive is a carbon disulfide salt. In some cases, the electrolyte may comprise a nitrate.

Abstract: An insertion device including an insertion needle holder and a drive mechanism for linearly moving the insertion needle holder in a puncturing direction. The insertion needle holder also includes at least one actuating element for actuating a drive mechanism. The drive mechanism converts a driving motion of the actuating element, which extends transversely or opposite to the puncturing direction, into a puncturing motion of the insertion needle holder.

Abstract: A security foil including at least a carrier layer, a protection layer and a functional layer. The functional layer has at least one clearance. The security foil includes a printed layer arranged within and partially filling the clearance and adjacent to and non-overlapping with the functional layer. The printed layer represents a marking. Also disclosed is a method for producing such a security foil from an original foil by selectively removing parts of the functional layer of the original foil to produce the clearance in the functional layer and by printing a marking within the clearance to produce the printed layer adjacent to and non-overlapping with the functional layer.

Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.

Abstract: At least one plating pen is brought into aligned relationship with at least one hole defined in a board. The pen includes a central retractable protrusion, a first shell surrounding the protrusion and defining a first annular channel therewith, and a second shell surrounding the first shell and defining a second annular channel therewith. The protrusion is lowered to block the hole and plating material is flowed down the first channel to a surface of the board and up into the second channel, to form an initial deposit on the board surface. The protrusion is raised to unblock the hole, and plating material is flowed down the first annular channel to side walls of the hole and up into the second annular channel, to deposit the material on the side walls of the hole.

Abstract: An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. Because the memory is integrated into the IC chip carrier, prior to the IC chip being attached thereto, reliability concerns that result from attaching the memory to the IC chip carrier affect the IC chip carrier and do not affect the yield of the relatively more expensive IC chip.

Abstract: An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. An access instruction may be sent from the IC chip to the memory through a wiring line of the IC chip carrier. Power potential may be sent from a system board to the memory through a vertical interconnect access (VIA). Alternatively, an access instruction may be sent from a first IC chip to the memory and power potential may be sent from a second IC chip to the memory.

Abstract: Articles and methods involving protected electrode structures are generally provided. In some embodiments, a protected electrode structure includes an electrode comprising an alkali metal and a protective structure directly adjacent the electrode. In some embodiments, the protective structure comprises elemental carbon and intercalated ions. In some embodiments, the protective structure is a composite protective structure. The composite structure may comprise an alloy comprising an alkali metal, an oxide of an alkali metal, and/or a fluoride salt of an alkali metal.