Abstract: Disclosed are interconnects in which one substrate having a high melting temperature, lead-free solder column is joined to a second substrate having openings filled with a low melting temperature, lead-free solder such that the high melting temperature, lead-free solder column penetrates into the low melting temperature, lead-free solder so as to obtain a short moment arm of solder.

Abstract: Object marking, and method for producing same, for optical authentication of an object, wherein at least one section of a material piece of a basic material is determined arbitrarily or randomly and the object marking is produced with the at least one section, and wherein the basic material of the material piece has a repeating security feature having optical properties dependent on the viewing angle, the dimensions of said security feature being larger than the dimensions of the section, more particularly larger than the dimensions of the object marking, such that each section is unique and has only a part of the security feature.

Abstract: A rapid effervescent beverage tap produces a downward and tangential flowing beverage along the inside surface of the beverage container and therefore, very little froth. The rapid effervescent beverage tap enables beverage containers to be filled quickly, thereby increasing sales and reducing wait time for the froth to dissipate. The rapid effervescent beverage tap has a downward extension and a coupling portion extending therefrom having a radial angle and radial extension. The rapid effervescent beverage tap comprises a tangent bend in the outlet portion the bends the tangent extension circumferentially from the radial extension. This tangent extension terminates in the outlet opening. The outlet opening in the rapid effervescent beverage tap produces tangential and downward flow of beverage along the inside surface of a beverage container. The beverage swirls or spirals along the inside surface to the bottom of the container and very little froth or head is produced.

Abstract: A module including a first semiconductor device, a second semiconductor device, a bridge support structure and a base substrate. The semiconductor devices each having first bonding pads having a first solder joined with the base substrate and the semiconductor devices each having second and third bonding pads joined to second and third bonding pads on the bridge support structure by a second solder and a third solder, respectively, on the second and third bonding pads; the semiconductor devices positioned adjacent to each other such that the bridge support structure joins to both of the semiconductor devices by the second and third solders wherein the third bonding pads are larger than the second bonding pads and the third bonding pads are at a larger pitch than the second bonding pads.

Abstract: A holder (10) for mounting a camera in a through-opening (12) in the region of a bumper (14) of a vehicle (16) has an outer part (18) that can be mounted on the bumper (14) from an outer face (20) of the bumper and an inner part (22) that can be mounted from an inner face (24) of the bumper (14). A receiving space (26) for receiving the camera is formed between the outer part (18) and the inner part (22) and the outer part (18) is designed for mounting the camera.

Abstract: A multiple chip carrier assembly including a carrier having a first surface and a second surface is attached to a plurality of chips is described. The plurality of chips include a first chip and a second chip. Each of the chips has first surface with a first set of solder balls for connecting to a package and a second set of solder balls for connecting to a high signal density bridge element. A second surface of each chip is bonded to the first surface of the carrier. A package has a first surface which is connected to the first sets of solder balls of the first and second chips. A high signal density bridge element having high signal density wiring on one or more layers is connected to the second sets of solder balls of the first and second chips. The bridge element is disposed between the first surface of the package and the first surfaces of the first and second chips.

Abstract: Method and system for confirming the integrity of a tamper-evident seal based on a comparison of the value of at least one parameter describing the physical structure of a predetermined breaking point provided in the seal, which value is determined from at least one captured image of the seal, with a pre-determined reference parameter value.

Abstract: An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. Because the memory is integrated into the IC chip carrier, prior to the IC chip being attached thereto, reliability concerns that result from attaching the memory to the IC chip carrier affect the IC chip carrier and do not affect the yield of the relatively more expensive IC chip.

Abstract: The invention relates to a method for the quantification of the total gluten content of grains in food samples. Areas of application are primarily the food industry, service laboratories and government test laboratories or biotechnology. The invention aims to quickly and cost-effectively determine the total gluten content in foods with just one measurement. We include a method with which, based on the detection of prolamins and glutelins, all potentially coeliac-relevant gluten protein fractions in food samples are quantified as a total corresponding to their mass. The method is based on the joint use of specific prolamin and glutelin antibodies as a combined conjugate according to the invention for the detection of the total gluten content. In addition, the individual antibody conjugates are thinned so that the contribution of the individual antibodies to the total signal strength corresponds to the proportion of the gluten fraction that they each detect.

Abstract: An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. An access instruction may be sent from the IC chip to the memory through a wiring line of the IC chip carrier. Power potential may be sent from a system board to the memory through a vertical interconnect access (VIA). Alternatively, an access instruction may be sent from a first IC chip to the memory and power potential may be sent from a second IC chip to the memory.

Abstract: A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.

Abstract: Place a first semiconductor chip onto an alignment carrier with protrusions of the semiconductor chip inserted into corresponding cavities of the alignment carrier, so that the protrusions and cavities locate the semiconductor chip with interconnect contacts overlying a window that is formed through the alignment carrier. Place a second semiconductor chip onto the alignment carrier with protrusions of the second semiconductor chip inserted into cavities of the alignment carrier, so that the protrusions and cavities locate the second semiconductor chip with interconnect contacts of the second semiconductor chip adjacent to the interconnect contacts of the first semiconductor chip and overlying the window. Fasten the semiconductor chips to the alignment carrier. Touch contacts of a interconnect bridge against the interconnect contacts of the first and second semiconductor chips by putting the interconnect bridge through the window.

Abstract: A vehicle component (100) having an exhaust-gas tailpipe device (1) for an exhaust-gas system of a motor vehicle includes at least one exhaust-gas tailpipe (2) and an exhaust-gas tailpipe trim (3) that, in a crash situation, can be pushed at least in sections onto the exhaust-gas tailpipe (2). The exhaust-gas tailpipe device (1) has at least one shield element (4) that is designed for noise optimization and that is fastened in front of the exhaust-gas tailpipe trim (3) by means of at least one predetermined breaking device (5). Thus, in the crash situation, the shield element (4) can be pushed at least in sections onto the exhaust-gas tailpipe (2).

Abstract: A method for producing a high-voltage energy storage device which is designed for storing electric energy, for a motor vehicle, in which storage modules are at least partially arranged in a receptacle space of a storage box of the high-voltage energy storage device, having the following steps: providing a base cooling structure of the storage box wherein the base cooling structure includes two cover elements spaced apart from one another and cooling ducts, which extend between the cover elements and through which a coolant fluid can flow.

Abstract: The invention relates to methods for producing gold nanoparticles functionalised with a telomerase substrate, or a linker nucleic acid having a region complementary to a nucleic acid comprising a telomerase substrate, for use in detecting telomerase activity. Functionalised gold nanoparticle solutions and functionalised gold nanoparticles obtained using the method are also provided for. The invention further relates to a functionalised gold nanoparticle complex, comprising gold nanoparticles coupled to a linker nucleic acid which is hybridised to a nucleic acid comprising a telomerase substrate. Telomerase assays using the functionalised gold nanoparticles or functionalised gold nanoparticle complexes of the invention and kits for detecting telomerase activity in a cell, comprising the functionalised gold nanoparticles or functionalised gold nanoparticle complexes of the invention are also provided for.

Abstract: A multi-die integrated circuit device and a method of fabricating the multi-die integrated circuit device involve a substrate. Two or more dice include components that implement functionality of the multi-die integrated circuit. The components include logic gates. The multi-die integrated circuit device also includes a spacer disposed between the substrate and each of the two or more dice. Each of the two or more dice makes direct electrical contact with the substrate without making direct electrical contact with the spacer through holes in the spacer.

Abstract: Disclosed are interconnects in which one substrate having a high melting temperature, lead-free solder column is joined to a second substrate having openings filled with a low melting temperature, lead-free solder such that the high melting temperature, lead-free solder column penetrates into the low melting temperature, lead-free solder so as to obtain a short moment arm of solder.

Abstract: The invention relates to a bending machine (1) for metal sheets (3). The bending machine (1) comprises a machine frame (4) and a support device (15) which is designed to hold the metal sheet (3) to be bent, a support surface (16) of the support device (15) being arranged in a horizontal plane with the support surface (7) of a clamping base (5). The support device (15) has at least a first support module (17) and a second support module (18) having a first support surface (19) and a second support surface (20). At least one of the support modules (17, 18) is horizontally displaceable in the longitudinal direction (21) of the bending machine (1) and as a result a first gap (22) extending at right angles to the blank-holder edge (12) can be set between the two support modules (17, 18).

Abstract: Membrane comprising a block copolymer comprising polyarylene ether blocks and polyalkylene oxide blocks, wherein said polyalkylene oxide blocks comprise at least one polyethylene oxide segment and at least one segment of at least one polyalkylene oxide that is different from polyethylene oxide.

Abstract: An IC device carrier includes organic substrate layers and wiring line layers therein. To reduce stain of the organic substrate layers and to provide decoupling capacitance, one or more decoupling capacitor stiffeners (DCS) are applied to the top side metallization (TSM) surface of the IC device carrier. The DCS(s) reduce the amount of curvature of the IC device carrier and reduce the strain seen by the organic substrate layers, thereby mitigating the risk for cracks forming and expanding or other damage within the carrier. The DCS(s) also include two or more capacitor plates and provides capacitance to electrically decouple electrical subsystems of the system of which the DCS is apart.