Abstract: A chemical mechanical polishing composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The chemical mechanical polishing composition comprises an inhibitor for the nonferrous metal; a copolymer of poly(ethylene glycol)methyl ether (meth)acrylate and 1-vinylimidazole; and water.

Abstract: A biocidal composition comprising 2,2-dibromomalonamide and a metal selected from silver, copper, and mixtures thereof, and its use for the control of microorganisms in aqueous and water-containing systems.

Abstract: The present invention provides an aqueous composition useful for treating fabric comprising (i) a complex of silver ion with a copolymer and (ii) a dispersed amine-functional softener, wherein said copolymer comprises (a) 60-95 wt % polymerized units of one or more monomer X, wherein said monomer X is an ethylenically unsaturated compound having a substituent group selected from an unsaturated or aromatic heterocyclic group having at least one nitrogen atom; and (b) 5-40 wt % polymerized units of one or more monomer Y, wherein said monomer Y is an ethylenically unsaturated compound selected from carboxylic acids, organosulfuric acids, sulfonic acids, phosphonic acids, esters comprising polymerized units of ethylene oxide, and mixtures thereof. Also provided is a method of treating fabric comprising contacting said fabric with the composition of claim 1 at pH from 3 to 7.

Abstract: There is provided an antimicrobial composition for treating fabric, wherein said antimicrobial composition is a liquid and wherein said antimicrobial composition comprises water and a metal/polymer complex, wherein the pH of said composition is 6.5 or lower; wherein the concentration of said metal/polymer complex is from 0.005% to 0.1% by weight based on the weight of said composition; wherein said metal is selected from copper, silver, gold, tin, zinc, and combinations thereof. Also provided is a method of finishing fabric using an exhaustion process with the composition of the present invention.

Abstract: There is provided a coating composition comprising (a) one or more microbicide, (b) one or more soluble polymer comprising, as polymerized units, one or more monomer with one or more pendant heterocycle, wherein said heterocycle has one or more hetero atom selected from the group consisting of N, O, S, and combinations thereof, and wherein said polymer has no anionic groups, and (c) solvent, wherein said polymer is dissolved in said solvent; wherein said composition contains no polymeric biguanide; and wherein 50% or more of said microbicide, by weight based on the total weight of microbicide, is not covalently bonded to any polymer.

Abstract: A composition useful for treating fabrics. The composition contains a silver-containing copolymer having polymerized units of a monomer X and a monomer Y; wherein monomer X is an ethylenically unsaturated compound having a substituent group selected from an unsaturated or aromatic heterocyclic group having at least one nitrogen atom; wherein monomer Y is selected from carboxylic acids, carboxylic acid salts, carboxylic acid esters, organosulfuric acids, organosulfuric acid salts, sulfonic acids, sulfonic acid salts, phosphonic acids, phosphonic acid salts, vinyl esters, (meth)acrylamides, C8-C20 aromatic monomers containing at least one exocyclic ethylenic unsaturation and combinations thereof.

Abstract: A composition useful for treating fabrics. The composition contains a silver-containing copolymer having polymerized units of a monomer X which is an ethylenically unsaturated compound having a substituent group selected from an unsaturated or aromatic heterocyclic group having at least one nitrogen atom and polymerized units of a monomer Y which is an ethylenically unsaturated compound selected from carboxylic acids, organosulfuric acids, sulfonic acids, phosphonic acids and esters comprising polymerized units of ethylene oxide.

Abstract: The aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition includes an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an acidic polymer, and water. The acidic polymer has a methacrylic acid portion having a carbon number of 4 to 250. The methacrylic acid portion includes either methacrylic acid or an acrylic acid/methacrylic acid copolymer. The acidic polymer including a segment from a mercapto-carboxylic acid chain transfer agent.

Abstract: Fibers that durably contain antimicrobial materials such that the antimicrobial materials are resistant to being abraided away or washed off during use. The antimicrobial materials contained in the fibers are not prone to the development of resistant strains of bacteria. Also disclosed are methods of making and using the fibers.

Abstract: A method for treating wood to inhibit leaching of copper compounds into the environment. The method comprises treating the wood with a copper-containing wood preservative and a latex copolymer.

Abstract: A latex copolymer composition comprising >5 wt % of polymerized units derived from a monomer X containing an unsaturated heterocycle, wherein the latex copolymer composition comprises ?1,000 ppm of residual monomer X is disclosed. Also disclosed are methods of making and using the latex copolymer compositions.

Abstract: A composition useful for treating fabrics. The composition contains a silver-containing copolymer having polymerized units of a monomer X and a monomer Y; wherein monomer X is an ethylenically unsaturated compound having a substituent group selected from an unsaturated or aromatic heterocyclic group having at least one nitrogen atom; wherein monomer Y is selected from carboxylic acids, carboxylic acid salts, carboxylic acid esters, organosulfuric acids, organosulfuric acid salts, sulfonic acids, sulfonic acid salts, phosphonic acids, phosphonic acid salts, vinyl esters, (meth)acrylamides, C8-C20 aromatic monomers containing at least one exocyclic ethylenic unsaturation and combinations thereof.

Abstract: A composition useful for treating fabrics. The composition contains a silver-containing copolymer having polymerized units of a monomer X which is an ethylenically unsaturated compound having a substituent group selected from an unsaturated or aromatic heterocyclic group having at least one nitrogen atom and polymerized units of a monomer Y which is an ethylenically unsaturated compound selected from carboxylic acids, organosulfuric acids, sulfonic acids, phosphonic acids and esters comprising polymerized units of ethylene oxide.

Abstract: Fibers that durably contain antimicrobial materials such that the antimicrobial materials are resistant to being abraided away or washed off during use. The antimicrobial materials contained in the fibers are not prone to the development of resistant strains of bacteria. Also disclosed are methods of making and using the fibers.

Abstract: A method for preserving wood by contacting wood with a composition comprising an aqueous polymer dispersion, at least one surfactant, and a wood preservative.

Abstract: There is provided a coating composition comprising (a) one or more microbicide, (b) one or more soluble polymer comprising, as polymerized units, one or more monomer with one or more pendant heterocycle, wherein said heterocycle has one or more hetero atom selected from the group consisting of N, O, S, and combinations thereof, and wherein said polymer has no anionic groups, and (c) solvent, wherein said polymer is dissolved in said solvent; wherein said composition contains no polymeric biguanide; and wherein 50% or more of said microbicide, by weight based on the total weight of microbicide, is not covalently bonded to any polymer.

Abstract: A chemical mechanical polishing composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The chemical mechanical polishing composition comprises an inhibitor for the nonferrous metal; a copolymer of poly(ethylene glycol)methyl ether (meth)acrylate and 1-vinylimidazole; and water.

Abstract: An aqueous composition comprising polymer particles of one or more multistage aqueous emulsion, at least one of which is a multistage aqueous emulsion copolymer comprising polymerized units derived from monomer X in at least one stage, wherein monomer X is selected from polymerizable derivatives of imidazole, imidazoline, amidine, pyridine, pyrrole, pyrrolidine, pyrrolidinone, caprolactam, and combinations thereof. Also disclosed are methods of making and using the compositions.

Abstract: An aqueous composition comprising polymer particles of one or more aqueous emulsion copolymer and a homopolymer comprising polymerized units derived from monomer X, wherein monomer X is selected from polymerizable derivatives of imidazole, imidazoline, amidine, pyridine, pyrrole, pyrrolidine, pyrrolidinone, caprolactam, and combinations thereof. Also disclosed are methods of making and using the compositions.

Abstract: An aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an amphiphilic polymer, the amphiphilic polymer having an ionic hydrophilic portion with a carbon number of 2 to 250 and water.