Abstract: Antimicrobial compositions and methods of making and using the same are disclosed. The disclosed antimicrobial compositions provide persistent, broad spectrum, antimicrobial activity. The antimicrobial compositions may be used in the preparation of antimicrobial articles. The antimicrobial compositions may also be used to inhibit the growth of microorganisms by introducing those compositions onto or into an environment subject to microbial attack.

Abstract: A composition useful for treating fabrics. The composition contains a silver-containing copolymer having polymerized units of a monomer X and a monomer Y; wherein monomer X is an ethylenically unsaturated compound having a substituent group selected from an unsaturated or aromatic heterocyclic group having at least one hetero atom selected from N, O and S; wherein monomer Y is selected from carboxylic acids, carboxylic acid salts, carboxylic acid esters, organosulfuric acids, organosulfuric acid salts, sulfonic acids, sulfonic acid salts, phosphonic acids, phosphonic acid salts, vinyl esters, (meth)acrylamides, C8-C20 aromatic monomers containing at least one exocyclic ethylenic unsaturation and combinations thereof.

Abstract: A method for treating wood to inhibit leaching of copper compounds into the environment. The method comprises treating the wood with a copper-containing wood preservative and a latex copolymer.

Abstract: Treated fiber substrates and methods of making and using the same are disclosed. The disclosed treated fiber substrates provide persistent, durable, broad spectrum, antimicrobial activity. The treated fiber substrates may be used in a variety of materials to impart antimicrobial activity thereto.

Abstract: A latex copolymer composition comprising >5 wt % of polymerized units derived from a monomer X containing an unsaturated heterocycle, wherein the latex copolymer composition comprises ?1,000 ppm of residual monomer X is disclosed. Also disclosed are methods of making and using the latex copolymer compositions.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: A method for disinfecting or sanitizing a surface by applying an antimicrobial composition comprising a metal-polymer complex.

Abstract: Fibers that durably contain antimicrobial materials such that the antimicrobial materials are resistant to being abraided away or washed off during use. The antimicrobial materials contained in the fibers are not prone to the development of resistant strains of bacteria. Also disclosed are methods of making and using the fibers.

Abstract: A method for preserving wood by contacting wood with a composition comprising an aqueous polymer dispersion, at least one surfactant, and a wood preservative.

Abstract: An aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an amphiphilic polymer, the amphiphilic polymer having an ionic hydrophilic portion with a carbon number of 2 to 250 and water.

Abstract: Treated fiber substrates and methods of making and using the same are disclosed. The disclosed treated fiber substrates provide persistent, durable, broad spectrum, antimicrobial activity. The treated fiber substrates may be used in a variety of materials to impart antimicrobial activity thereto.

Abstract: Antimicrobial compositions and methods of making and using the same are disclosed. The disclosed antimicrobial compositions provide persistent, broad spectrum, antimicrobial activity. The antimicrobial compositions may be used in the preparation of antimicrobial articles. The antimicrobial compositions may also be used to inhibit the growth of microorganisms by introducing those compositions onto or into an environment subject to microbial attack.

Abstract: A method for planarizing metal interconnects of a semiconductor wafer includes the steps of polishing the semiconductor wafer with a polishing solution and a polishing pad to planarize the metal interconnects. The polishing solution has by weight percent, 0.15 to 5 benzotriazole, 0 to 1 abrasive, 0 to 10 polymeric particles, 0 to 5 polymer-coated particles and balance water at a pH of less than 5 and a removal rate-pressure sensitivity (dr/dp) of at least 750 (?/min/psi). The polishing simultaneously accelerates removal of projecting metal from the metal interconnects with the polishing pad providing a first pressure that increases removal rate of the projecting metal; and it inhibits removal of recessed metal from the metal interconnects with the polishing pad providing a second pressure that decreases removal of the recessed metal.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: A method for the protection of wood and other wood materials without affecting dimensional stability or surface integrity of the treated material is described. The method involves treating wood material with an iron salt and selected oxidants where the iron salt is preferably complexed with organic chelating ligands. Preferably, a microbicidal agent is also incorporated into the method to provide treated wood products that demonstrate excellent surface integrity, dimensional stability and retention of the infused microbicidal agents for extended periods of time without incurring the detrimental environmental effects of conventional chromium or copper-based inorganic salt preservation methods.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: A method for planarizing metal interconnects of a semiconductor wafer includes the steps of polishing the semiconductor wafer with a polishing solution and a polishing pad to planarize the metal interconnects. The polishing solution has by weight percent, 0.15 to 5 benzotriazole, 0 to 1 abrasive, 0 to 10 polymeric particles, 0 to 5 polymer-coated particles and balance water at a pH of less than 5 and a removal rate-pressure sensitivity (dr/dp) of at least 750 (Å/min/psi). The polishing simultaneously accelerates removal of projecting metal from the metal interconnects with the polishing pad providing a first pressure that increases removal rate of the projecting metal; and it inhibits removal of recessed metal from the metal interconnects with the polishing pad providing a second pressure that decreases removal of the recessed metal.

Abstract: A polishing composition for polishing a semiconductor substrate has a pH of under 5.0 and comprises (a) a carboxylic acid polymer comprising polymerized unsaturated carboxylic acid monomers having a number average molecular weight of about 20,000 to 1,500,000 or blends of high and low number average molecular weight polymers of polymerized unsaturated carboxylic acid monomers, (b) 1 to 15% by weight of an oxidizing agent, (c) up to 3.0% by weight of abrasive particles, (d) 50-5,000 ppm (parts per million) of an inhibitor, (e) up to 3.0% by weight of a complexing agent, such as, malic acid, and (f) 0.1 to 5.0% by weight of a surfactant.

Abstract: High pH aqueous coating compositions containing 3-isothiazolone microbicide that have been stabilized against the degradation of the 3-isothiazolone by the addition of low levels of copper ion are disclosed. In particular, aqueous paint compositions containing pH-adjusting amine compounds, where the pH is above 9.5, are effectively stabilized when 1 to 200 ppm of copper ion is added to the paint composition before the 3-isothiazolone is combined with other paint components or if copper ion is added together with the 3-isothiazolone to the remaining paint components or if the 3-isothiazolone is added no more than 1 hour before copper ion is added to the composition.