Abstract: A new class of polymeric corrosion inhibiting compositions incorporating pendant heterocyclic groups which are surprisingly effective copper corrosion inhibitors are disclosed. The polymers form a protective barrier on metallic components to aqueous systems and remain substantive on metallic surfaces over a wide pH range. Moreover, the polymers are resistant to oxidizing biocides, and are substantially impervious to repeated or prolonged exposure to corrosive agents.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: Disclosed are compositions containing biologically active compounds that slowly release the biologically active compound. These compositions may be directly incorporated into the locus to be protected or may be applied to a structure in a coating.

Abstract: A method of polishing a semiconductor substrate by adjusting the polishing composition with a BTA concentration that raises the metal removal rate when polishing at a relatively high polishing pressure, and that minimizes the metal removal rate when polishing metal in trough at a lower polishing pressure; and adjusting the polishing pressure on metal in each trough to a level that removes metal from trough at a minimized removal rate, while simultaneously polishing the excess metal with a higher polishing pressure.

Abstract: A method for the protection of wood and other wood materials without affecting dimensional stability or surface integrity of the treated material is described. The method involves treating wood material with an iron salt and selected oxidants where the iron salt is preferably complexed with organic chelating ligands. Preferably, a microbicidal agent is also incorporated into the method to provide treated wood products that demonstrate excellent surface integrity, dimensional stability and retention of the infused microbicidal agents for extended periods of time without incurring the detrimental environmental effects of conventional chromium or copper-based inorganic salt preservation methods.

Abstract: The use of polymeric corrosion inhibiting compositions incorporating heterocyclic groups is disclosed. The polymers form a protective barrier on metallic components to aqueous systems and remain substantive on metallic surfaces over a wide pH range. Moreover, the polymers are resistant to oxidizing biocides, and are substantially impervious to repeated or prolonged exposure to corrosive agents.

Abstract: The use of a new class of polymeric corrosion inhibiting compositions incorporating pendant heterocyclic groups is disclosed. The polymers form a protective barrier on metallic components to aqueous systems and remain substantive on metallic surfaces over a wide pH range. Moreover, the polymers are resistant to oxidizing biocides, and are substantially impervious to repeated or prolonged exposure to corrosive agents.

Abstract: A new class of polymeric corrosion inhibiting compositions incorporating pendant heterocyclic groups which are surprisingly effective copper corrosion inhibitors are disclosed. The polymers form a protective barrier on metallic components to aqueous systems and remain substantive on metallic surfaces over a wide pH range. Moreover, the polymers are resistant to oxidizing biocides, and are substantially impervious to repeated or prolonged exposure to corrosive agents.

Abstract: Novel antimicrobial compounds based on 5-substituted 3-isothiazolones, where the 5-substituent is an aryl or heterocyclic ether/thioether group, are disclosed. These 5-substituted 3-isothiazolones provide enhanced antimicrobial activity over that of related 3-isothiazolones, particularly when the 5-substituent is a substituted pyridinyl thioether group.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: A polishing composition for removing metal by CMP comprises, a metal oxidizer, an oxide inhibitor, a complexing agent, and an engineered copolymer comprising, molecules of a first moiety having hydrophilic functional groups forming bonds with the metal, and molecules of a second moiety having hydrophobic functional groups.

Abstract: A polishing composition for polishing a semiconductor substrate has a pH of under 5.

Abstract: A method of polishing a semiconductor substrate by adjusting the polishing composition with a BTA concentration that raises the metal removal rate when polishing at a relatively high polishing pressure, and that minimizes the metal removal rate when polishing metal in trough at a lower polishing pressure; and adjusting the polishing pressure on metal in each trough to a level that removes metal from trough at a minimized removal rate, while simultaneously polishing the excess metal with a higher polishing pressure.

Abstract: A polishing composition for chemical mechanical polishing of semiconductor wafers having a copper metal circuit includes, an aqueous composition having a pH of under 5.0, and polyacrylic acid having a number average molecular weight of about 20,000-150,000, or blends of high and low number average molecular weight polyacrylic acids.

Abstract: A polishing composition for polishing with a polishing pad to remove a metal layer from a semiconductor wafer having the metal layer and further having recessed metal in trenches, the composition having a concentration of BTA selected to maximize the rate of change in the removal rate of a metal layer with increases in downforce exerted by a polishing pad during polishing, which maximizes a difference between the removal rate of the metal layer and the removal rate of the recessed metal in trenches.

Abstract: Disclosed are compositions containing biologically active compounds that slowly release the biologically active compound. These compositions may be directly incorporated into the locus to be protected or may be applied to a structure in a coating.

Abstract: Disclosed are stable microbicidal compositions of 3-isothiazolone compounds and azobiscarbonyl compounds. Also disclosed are methods of stabilizing 3-isothiazolone compounds against chemical decomposition by combining with the 3-isothiazolones a stabilizing amount of an azobiscarbonyl compound.

Abstract: Disclosed are solid compositions containing biocidal compounds that do not rapidly release the biocidal compounds when added to a locus to be protected and methods of controlling or inhibiting the growth of microorganisms in a locus comprising introducing into or onto the locus an effective amount of the solid compositions.

Abstract: Disclosed are compositions containing biologically active compounds that slowly release the biologically active compound. These compositions may be directly incorporated into the locus to be protected or may be applied to a structure in a coating.

Abstract: The present invention provides a method of stabilizing non-halogenated 3-isothiazolones in aggressive systems with pH above 8.5. The invention also discloses compositions with pH above 8.5, containing non-halogenated 3-isothiazolones and an effective stabilizing amount of a iodine-containing stabilizer.