Abstract: A semiconductor device comprising a plurality of wires for electrically connecting a plurality of electrode pads arranged on a main surface of a semiconductor chip along one side of the semiconductor chip to a plurality of connecting portions arranged on the main surface of a wiring substrate along one side of the semiconductor chip, respectively, wherein second wires out of the plural wires consisting of first and second wires adjacent to each other have a larger loop height than the first wires, one end portions of the second wires are connected to the electrode pads at positions farther from one side of the semiconductor chip than the one end portions of the first wires, and the other end portions of the second wires are connected to the connecting portions at positions farther from one side of the semiconductor chip than the other end portions of the first wires.

Abstract: To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 &mgr;m or larger exists in an interface formed by the composite metal plate and the metal layer.

Abstract: The impact strength resistance of a solder joint portion of a semiconductor device is improved. The semiconductor device has a joint structure wherein a jointing layer which does not contain sulfur substantially is arranged between an underlying conductive layer and a lead-free solder layer and further between the jointing layer and the lead-free solder layer is formed an alloy layer comprising elements of these layers.

Abstract: A flat bed knitting machine having an oil feeding device is disclosed. Lubricant oil is fed, just when needed, to knitting members, such as needles, jacks and sinkers. The numbers of operations of knitting members are counted, and when a counted number exceeds a predetermined value, lubricant oil will be sprayed from a jet-type nozzle to the relevant knitting member.

Abstract: Provided is a semiconductor device comprising a first metal film formed above a semiconductor chip, a ball portion formed over said first metal film and made of a second metal, and an alloy layer of said first metal and said second metal which alloy layer is formed between said first metal film and said ball portion, wherein said alloy layer reaches the bottom of said first metal film, and said ball portion is covered with a resin; and a manufacturing method thereof. The present invention makes it possible to improve adhesion between the bonding pad portion and ball portion of a bonding wire over an interconnect, thereby improving the reliability of the semiconductor device.

Abstract: A flat knitting machine comprising a transfer jack bed (9) holding transfer jacks (7) in such a manner as to freely advance and retract, wherein when a loop is transferred from the transfer jack (7) to the needle (19), the loop retaining portion (53) of the transfer jack (7) put in its advanced position is moved down to its lowered position, first; then, a back side (39b) of a needle hook of the needle (19) is made to go into the loop (111) retained on the loop retaining portion (53) of the transfer jack (7); then the loop retaining portion (53) is raised up to its raised position; and thereafter, a front side (39a) of the needle hook of the needle is made to go into the loop, whereby the transfer of loop can be ensured with a reduced burden on the loop in the transfer of loop through the use of a common track for the needles of the front bed (13a) and for the needles of the back bed (13b).

Abstract: A flat bed knitting machine having an oil feeding device is disclosed. Lubricant oil is fed, just when needed, to knitting members, such as needles, jacks and sinkers. The numbers of operations of knitting members are counted, and when a counted number exceeds a predetermined value, lubricant oil will be sprayed from a jet-type nozzle to the relevant knitting member.

Abstract: In a semiconductor device in which an LSI chip comprising electrodes with a 100 &mgr;m pitch or less and 50 or more pins is mounted directly on an organic substrate, a mounting structure and a manufacturing method thereof are provided excellent in the solder resistant reflow property, temperature cycle reliability and high temperature/high humidity reliability of the semiconductor device. Electrode Au bumps of the chip and an Au film at the uppermost surface of connection terminals of the substrate are directly flip-chip bonded by Au/Au metal bonding and the elongation of the bonded portion of the Au bump is 2 &mgr;m or more. The method of obtaining the bonded structure involves a process of supersonically bonding both of the bonding surfaces within 10 min after sputter cleaning, under the bonding conditions selected from room temperature on the side of the substrate, room temperature to 150° C.

Abstract: To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 &mgr;m or larger exists in an interface formed by the composite metal plate and the metal layer.

Abstract: A sinker device comprises a sinker jack 50 which can be freely advanced and retracted with respect to a needle bed gap 4 and a sinker 30 supported on an upper surface of the sinker jack formed as a supporting surface in a freely swingable manner. The sinker 30 and the sinker jack 50 have sliding contact surfaces sidably contactable with each other which are each formed at a front side thereof with respect to a swinging pivot point. When the sinker jack 50 is advanced toward the needle bed gap 4 to move relative to the sinker 30, the sinker 30 takes the swinging attitude controlled by the sliding contact relation between the respective sliding contact surfaces of the sinker and the sinker jack, so that the sinker 30 is controllably swung to at least a knitted loop pushing level, a knitted loop releasing level and a stitch forming level.

Abstract: A first knitting member 5 has a fork portion 38 extending forwardly formed in an upper portion of a side wall(s) of the first knitting member at an accommodation groove forming portion 33 thereof where the accommodation groove 32 for accommodating the second knitting member 7 is formed, while also the second knitting member 7 has a guiding portion 55 formed to be curved outwardly so that its upper surface can confront a lower surface of the fork portion 38 formed on the side wall(s) of the first knitting member 5, so that while the second knitting member 7 is moved relative to the first knitting member 5, the guiding portion 55 of the second knitting member 7 is guided into a space formed under the fork portion 38 of the first knitting member 5 and supported by the fork portion 38 during at least part of the relative movement.

Abstract: A flat knitting machine comprising a transfer jack bed (9) holding transfer jacks (7) in such a manner as to freely advance and retract, wherein when a loop is transferred from the transfer jack (7) to the needle (19), the loop retaining portion (53) of the transfer jack (7) put in its advanced position is moved down to its lowered position, first; then, a back side (39b) of a needle hook of the needle (19) is made to go into the loop (111) retained on the loop retaining portion (53) of the transfer jack (7); then the loop retaining portion (53) is raised up to its raised position; and thereafter, a front side (39a) of the needle hook of the needle is made to go into the loop, whereby the transfer of loop can be ensured with a reduced burden on the loop in the transfer of loop through the use of a common track for the needles of the front bed (13a) and for the needles of the back bed (13b).

Abstract: A semiconductor chip and an organic substrate are bonded together in an atmosphere having a reduced moisture content through Au bumps which have been subjected to a cleaning treatment therebetween. Using this bonding technique, a semiconductor chip and an organic substrate can be bonded together in a sufficiently high strength with use of Au bumps having a diameter of not larger than 300 &mgr;m, a height of not smaller than 50 &mgr;m, and a height/diameter ratio of not lower than 1/5, thus indicating a reduced strain.

Abstract: To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 &mgr;m or larger exists in an interface formed by the composite metal plate and the metal layer.

Abstract: A compound needle has blades of a slider having tongues formed by two superposed blades accommodated in a blade accommodating groove formed in a needle body. The blades are provided with bends to bring side surfaces of the blades accommodated in the blade groove in the needle body into press-contact with side walls of the groove. Front end portions of the blades can thus be held in positions that are equally divided to the right and left with respect to the widthwise direction of the blade groove from a widthwise center of the groove to more reliably center the blades in the blade groove.

Abstract: A semiconductor device includes a semiconductor chip and a printed circuit board. Metal electrodes of the semiconductor chip and the internal connection terminals of the printed circuit board are electrically connected through the metallic joining via precious metal bumps. A melting point of a metal material constituting each of the metallic joining parts is equal to or higher than 275 degrees, and a space defined between the chip and the board is filled with resin (under fill) containing 50 vol % or more inorganic fillers.

Abstract: A compound needle comprises a closing element with two closing element springs. These are designed to be asymmetrical relative to each other or at least provided with clearances or openings which, during the operation of the compound needle, are made to overlap with a corresponding cutout or other openings in the basic compound needle member, so that deposits can be removed to the needle channel. An asymmetric design of the closing element springs prevents the closing element from being wedged into the closing element channel, even if the deposit removal is incomplete. As a result, the compound needle wear is reduced considerably and the operational safety is increased.

Abstract: An end yarn inserting device that is so constructed that an end yarn hook can be put into action only when necessary but otherwise be retreated to such a position in the vicinity of a needle bed gap as to avoid interfering with knitting members including a yarn feeder and knitting needles.

Abstract: A flat knitting machine has a blower that is connected to a nozzle via a plastic tube, a base duct and a joint. The base duct is mounted on a rear cover of the flat knitting machine parallel to a needle bed and is rectangular in section. A long slit covered by a belt is provided on top of the base duct. The joint has three rollers, two of which make the belt contact the slit. The third roller peels the belt from the slit to connect the nozzle and the base duct. When the nozzle is connected to the carriage and travels over the needle beds, the needle beds are cleaned.