Abstract: An object of the invention is to be capable of easily acquiring a fabric having a desired feeling using a stretch yarn. A knitting controller (20) controls a carriage (5), and the like, according to knitting data and control data stored in a memory (21). Data representing relationships between a gauge texture and a stitch loop length being obtained after kitting and the relationships between these gauge texture and stitch loop length and the length and tension of the stretch yarn (2) being fed at the time of knitting are collected previously and stored in the memory (21) in the form of table data. The knitting controller (20) sets control target values of the length and tension of the stretch yarn (2) for a yarn feed controller (23) such that a gauge texture and a stitch loop length being specified by an input unit (22) can be attained, with reference to the table data stored in the memory (21).

Abstract: An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electronic part to each other, the method comprises the step of bonding both the electrodes through a metal layer made up of aggregated particles of at least one kind of metal. Then, the metal particles have an average particle size of 1 to 50 nm. Preferably, the metal particles form a metal layer having a thickness of 5 to 100 ?m.

Abstract: Provided is a weft knitting machine having movable sinkers capable of securing a large space at a needle bed near a knitted fabric knitting area and making a pause in the state of stopping action on the knitted fabric knitting area. A sinker operation cam mechanism (10) installed in a carriage acts on the butt (12c) of a sinker jack (12) to move the sinker jack (12) backward from a needle bed gap (2) so that an operation portion (8c) of the movable sinker (8) can retract from the needle bed gap (2). The sinker jack (12) is interlocked at a backward position by an interlock mechanism (16). Since a wire (17) passed through a needle plate (5) is utilized to interlock the sinker jack (12) in the interlock mechanism (16), the interlock mechanism (16) can be reduced in size.

Abstract: A printing apparatus which includes a printer body having a setting surface on which a printing surface of a printing medium is set horizontally, a carriage beam 23 which is attached to the printer body and extends in the direction along the setting surface, and a carriage 5 provided so as to be movable in the beam lengthwise direction with respect to the carriage beam 23, and further includes an ink head 6 equipped with a nozzle for discharging ink provided in the carriage, comprises: a carriage supporting means 7 which supports the carriage 5 onto the carriage beam 23 in a manner enabling it to move up and down, an ink receiving part 8 which receives ink that is discharged from the ink head 6, and a receiving part supporting means 9 which supports the ink receiving part 8 on the carriage 5 in a manner enabling it to move to an ink receiving part below the ink head and a withdrawing position separated from the ink head 6.

Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.

Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.

Abstract: A semiconductor device with improved the adhesion between bonding pads and ball portions of gold wires is provided to improve the reliability of a semiconductor device. About 1 wt. % of Pd is contained in gold wires for connection between electrode pads formed on a wiring substrate and electrode pads (exposed areas of a top layer wiring formed mainly of Al) formed on a semiconductor chip. In bonded portions between the electrode and ball portions of the gold wires, an interdiffusion of Au and Al is suppressed to prevent the formation of Au4Al after PCT (Pressure Cooker Test). Thus, a desired bonding strength is obtained even when the pitch of the electrode pads is smaller than 65 ?m and the diameter of the ball portion is smaller than 55 ?m or the diameter of the wire portion of each gold wire is not larger than 25 ?m.

Abstract: A stitch presser in a weft knitting machine installed on a carriage that slides in a reciprocating fashion on a needle bed and configured such that a presser bar fitted through a presser bar supporting arm joined to a rotation shaft of a motor is advanced into a mouth portion of the weft knitting machine with an electric power supplied to the motor driving the predetermined presser bar in conjunction with the directional switching of the reciprocating motion of the carriage, including a rotation energizing mechanism for rotating the rotating shaft of the motor to a side retracting the presser bar of the weft knitting machine when the electric power is not supplied to the motor for driving the presser bar advanced into the mouth portion.

Abstract: An object of the invention is to be provide a yarn feeding apparatus of a flat knitting machine capable of accurately predicting a required amount of a knitting yarn and knitting a fabric while supplying knitting yarn necessary for knitting. The knitting yarn is fed out based on an idea shown in a solid line in consideration of a yarn speed corresponding to the requirement for knitting yarn produced according to the movement of a yarn feeding member as shown by chain lines in FIG. 6(b). A knitting yarn is stored on a buffer rod at a start of knitting because the speed of a motor such as a servo motor for feeding a knitting yarn lags behind the yarn speed. A knitting yarn that runs short at the time of deceleration at an end of knitting is also fed out in advance.

Abstract: A method is provided to improve the adhesion between bonding pads and ball portions of gold wires to improve the reliability of a semiconductor device. About 1 wt. % of Pd is contained in gold wires for connection between electrode pads formed on a wiring substrate and electrode pads (exposed areas of a top layer wiring formed mainly of Al) formed on a semiconductor chip. In bonded portions between the electrode and ball portions of the gold wires, an interdiffusion of Au and Al is suppressed to prevent the formation of Au4Al after PCT (Pressure Cooker Test). Thus, a desired bonding strength is obtained even when the pitch of the electrode pads is smaller than 65 ?m and the diameter of the ball portion is smaller than 55 ?m or the diameter of the wire portion of each gold wire is not larger than 25 ?m.

Abstract: An object of the invention is to be provide a yarn feeding apparatus of a flat knitting machine capable of accurately predicting a required amount of a knitting yarn and knitting a fabric while supplying knitting yarn necessary for knitting. The knitting yarn is fed out based on an idea shown in a solid line in consideration of a yarn speed corresponding to the requirement for knitting yarn produced according to the movement of a yarn feeding member as shown by chain lines in FIG. 6(b). A knitting yarn is stored on a buffer rod at a start of knitting because the speed of a motor such as a servo motor for feeding a knitting yarn lags behind the yarn speed. A knitting yarn that runs short at the time of deceleration at an end of knitting is also fed out in advance.

Abstract: A stitch presser in a weft knitting machine installed on a carriage that slides in a reciprocating fashion on a needle bed and configured such that a presser bar fitted through a presser bar supporting arm joined to a rotation shaft of a motor is advanced into a mouth portion of the weft knitting machine with an electric power supplied to the motor driving the predetermined presser bar in conjunction with the directional switching of the reciprocating motion of the carriage, including a rotation energizing mechanism for rotating the rotating shaft of the motor to a side retracting the presser bar of the weft knitting machine when the electric power is not supplied to the motor for driving the presser bar advanced into the mouth portion.

Abstract: The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first and second wiring layers of each arm are respectively formed on insulating substrates, and one face of the switching device is fixed to the first wiring layer, and the second wiring layer and the other face of the switching device are electrically connected by a laminal conductor, and the laminal conductor has a first and a second connection, and the first connection of the laminal conductor is fixed to the other face of the switching device, and the second connection of the laminal conductor is fixed to the second wiring layer. Thereby, a large current of the inverter can be realized and the assembly capacity of the inverter or the vehicle drive unit will be improved.

Abstract: Provided is a semiconductor device comprising a first metal film formed above a semiconductor chip, a ball portion formed over said first metal film and made of a second metal, and an alloy layer of said first metal and said second metal which alloy layer is formed between said first metal film and said ball portion, wherein said alloy layer reaches the bottom of said first metal film, and said ball portion is covered with a resin; and a manufacturing method thereof. The present invention makes it possible to improve adhesion between the bonding pad portion and ball portion of a bonding wire over an interconnect, thereby improving the reliability of the semiconductor device.

Abstract: A semiconductor device which uses a semiconductor element having main current input/output electrodes, one and the other of which are extended up to a one surface and a remaining surface of a semiconductor chip respectively for causing one of the input/output electrodes to be contacted with a conductive layer of a insulating substrate, whereby the semiconductor element is supported on or above the insulating substrate. A conductive strip which is made of a composite material of carbon and aluminum or a composite material of carbon and copper is used for connection between the remaining input/output electrode of the semiconductor chip and the conductive layer of the insulating substrate.

Abstract: A weft knitting machine with a movable sinker device capable of preventing yarn from being worn caused by repeatedly striking the yarn with a sinker energized by a spring to push down knitting fabric, wherein a stroke to which a yarn locking part (2a) at the tip of a sinker plate (2) is moved to a tooth port (6) by the energization of the spring (4) is increased at a first stage shown in (a) and decreased at a second stage shown in (b), the stroke is limited in (b) by locking a holding locking part (12a) of a holding member (12) to the holding locking part (2d) of the sinker plate (2), and a stage is switched to a second stage at a knitting portion where the yarn locking part (2a) repeatedly strikes the yarn to prevent the yarn from being thinned and fluffed.

Abstract: There is provided a thinner high frequency power module structure having reduced the mounting area. An insulated board is provided with a composite metal board in which the Cu2O powder particles are dispersed into a matrix metal (Cu) (amount of addition of Cu2O: 20 vol %; thermal expansion coefficient: 10.0 ppm/° C.; thermal conductivity: 280 W/m•K; thickness: 1 mm; size: 42.4×85 mm), a silicon nitride board (thermal expansion coefficient: 3.4 ppm/° C.; thermal conductivity: 90 W/m•K; thickness: 0.3 mm; size: 30×50 mm) deposited with Ag-system bonding metal layer to one principal surface of the composite metal board, and a wiring metal board formed of copper or copper alloy provided to the other principal surface of the ceramics insulated board. For example, the bonding metal layer is adjusted in the thickness to 50 ?m, while the wiring metal board is also adjusted in the thickness to 0.4 mm.

Abstract: A semiconductor device having both high strength and high thermal radiation that is capable of being applied to mounting on automobiles experiencing many thermal cycles, and a manufacturing method thereof are provided. A circuit board 1a for a resin encapsulated semiconductor module device has a configuration where a silicon nitride plate 2 with a thickness of 0.635 mm has copper plates of 1.0 mm and 0.8 mm bonded to both sides thereof via active metal. A copper plate 3a is bonded to the surface side of the silicon nitride plate 2, and a prescribed circuit pattern is formed on the copper plate 3a. Tin-silver-copper cream solder layers 4a and 4b with a thickness of 200 ?m are formed at a prescribed location on the circuit pattern 3a on which a semiconductor element 6 is mounted and at a prescribed location of a base plate 1 on which the circuit board 1a is disposed.

Abstract: A printing apparatus which includes a printer body having a setting surface on which a printing surface of a printing medium is set horizontally, a carriage beam 23 which is attached to the printer body and extends in the direction along the setting surface, and a carriage 5 provided so as to be movable in the beam lengthwise direction with respect to the carriage beam 23, and further includes an ink head 6 equipped with a nozzle for discharging ink provided in the carriage, comprises: a carriage supporting means 7 which supports the carriage 5 onto the carriage beam 23 in a manner enabling it to move up and down, an ink receiving part 8 which receives ink that is discharged from the ink head 6, and a receiving part supporting means 9 which supports the ink receiving part 8 on the carriage 5 in a manner enabling it to move to an ink receiving part below the ink head and a withdrawing position separated from the ink head 6.

Abstract: A weft knitting machine with a movable sinker device capable of preventing yarn from being worn caused by repeatedly striking the yarn with a sinker energized by a spring to push down knitting fabric, wherein a stroke to which a yarn locking part (2a) at the tip of a sinker plate (2) is moved to a tooth port (6) by the energization of the spring (4) is increased at a first stage shown in (a) and decreased at a second stage shown in (b), the stroke is limited in (b) by locking a holding locking part (12a) of a holding member (12) to the holding locking part (2d) of the sinker plate (2), and a stage is switched to a second stage at a knitting portion where the yarn locking part (2a) repeatedly strikes the yarn to prevent the yarn from being thinned and fluffed.