Abstract: A composite needle of a knitting machine, comprises: a needle body having at a tip end a hook; a slider formed by superposing two blades, wherein the composite needle of the knitting machine is formed such that a blade groove provided in the needle body supports the blades of the slider when the needle body and the slider can separately slide in forward and backward directions; and a dust-collecting plate that is seperately formed from the needle body and that extends, when viewed from a side, from the blade groove of the needle body in an upward direction and to a hook side of the needle such that the dust-collecting plate is provided at a tip end of the slider proximate to the hook.

Abstract: A tongue (67) is provided, at a front end thereof, with a drop-loop preventing step (79), and the hook (11) is provided, on an outer edge portion thereof extending from a sharp-pointed tip (27) of the hook to a top (29) of the hook, with a loop escape surface (31) to hide the drop-loop preventing step (79) when the hook (11) is closed by the tongue (67). In addition, the front end of the tongue is lowered so that a height between a bottom of the needle body and a top of the drop-loop preventing step (79) is lowered more when the slider is in a knock-over position than before the slider arrives at the knock-over position and also the top of the drop-loop preventing step (79) positioned at the knocked-over position can be positioned at a lower level than the top (29) of the hook. This can allow can allow a further smooth knock-over of the loop without negative effects on the yarn feed requirements for the capture of the yarn by the needle hook.

Abstract: A semiconductor device comprising a plurality of wires for electrically connecting a plurality of electrode pads arranged on a main surface of a semiconductor chip along one side of the semiconductor chip to a plurality of connecting portions arranged on the main surface of a wiring substrate along one side of the semiconductor chip, respectively, wherein second wires out of the plural wires consisting of first and second wires adjacent to each other have a larger loop height than the first wires, one end portions of the second wires are connected to the electrode pads at positions farther from one side of the semiconductor chip than the one end portions of the first wires, and the other end portions of the second wires are connected to the connecting portions at positions farther from one side of the semiconductor chip than the other end portions of the first wires.

Abstract: A semiconductor device comprising a plurality of wires for electrically connecting a plurality of electrode pads arranged on a main surface of a semiconductor chip along one side of the semiconductor chip to a plurality of connecting portions arranged on the main surface of a wiring substrate along one side of the semiconductor chip, respectively, wherein second wires out of the plural wires consisting of first and second wires adjacent to each other have a larger loop height than the first wires, one end portions of the second wires are connected to the electrode pads at positions farther from one side of the semiconductor chip than the one end portions of the first wires, and the other end portions of the second wires are connected to the connecting portions at positions farther from one side of the semiconductor chip than the other end portions of the first wires.

Abstract: A yarn carrier 1 is capable of being engaged with a pin 4 protruding from a carriage 3 at two engagement points 8, 9 separated by a delay amount ?L with respect to a center 1a, respectively. Assuming that the carriage 3 approaches from the right with the pin 4 protruding in order to select and haul the yarn carrier 1 stationary on a yarn guide rail 2, the tip of the pin 4 is guided on a guide portion 11b of an oscillating piece 11, and a tip portion 11c prevents engagement with the engagement point 9 by making oscillation displacement about a shaft 11a. The pin 4 is guided to the engagement point 8 by guide portions 13a, 12a of oscillating plates 13, 12, and abuts on a tip portion 10c of an oscillating piece 10, which is engaged with the front side of the pin 4. The oscillating plate 12 also departs from the pin 4, and a tip portion 12c ascends to be engaged with the rear side of the pin 4.

Abstract: The impact strength resistance of a solder joint portion of a semiconductor device is improved. The semiconductor device has a joint structure wherein a jointing layer which does not contain sulfur substantially is arranged between an underlying conductive layer and a lead-free solder layer and further between the jointing layer and the lead-free solder layer is formed an alloy layer comprising elements of these layers.

Abstract: A method is provided to improve adhesion between bonding pads and ball portions of gold wires to improve reliability of a semiconductor device. About 1 wt. % of Pd is contained in gold wires for connection between electrode pads formed on a wiring substrate and electrode pads (exposed areas of a top layer wiring formed mainly of Al) formed on a semiconductor chip. In bonded portions between the electrode and ball portions of the gold wires, an interdiffusion of Au and Al is suppressed to prevent the formation of Au4A1 after POT (Pressure Cooker Test). Thus, a desired bonding strength is obtained even when the pitch of the electrode pads is smaller than 65 pin and the diameter of the ball portion is smaller than 55 pm or the diameter of the wire portion of each gold wire is not larger than 25 pin.

Abstract: A composite needle of a knitting machine, comprising: a needle body having at the tip end a hook; a slider formed by superposing two blades, wherein the composite needle of the knitting machine is formed such that a blade groove provided in the needle body supports the blades of the slider when the needle body and the slider can separately slide in the forward and backward directions, and a dust-collecting plate that is separately formed from the needle body and that extrudes, when viewed from the side, from the blade groove of the needle body in the upward direction and to the hook side of the needle such that the dust-collecting plate is provided at the tip end of the slider proximate to the needle hook.

Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.

Abstract: In a loop length controller for a flat knitting machine adapted to set a loop length of a knitting fabric by raising or lowering, via a raising and lowering device, a stitch cam attached to a carriage that slides on a needle bed to slidably operate knitting needles forward and backward, the raising and lowering device is provided with a driving motor and a converting mechanism for converting rotational motion of the driving motor into ascent and descent of the stitch cam, wherein the converting mechanism is configured such that the ascending and descending amount of the stitch cam with respect to the rotational amount of the driving motor differs between a side for a larger drawing-in amount of knitting needles for loops of longer length and a side for a smaller drawing-in amount of knitting needles for loops of shorter length.

Abstract: A flat knitting machine (1) comprising a number of needles (15) arranged in needle grooves (13) formed on needle beds (5, 6) in such a manner as to be freely advanced or retracted; sinkers (41, 123), arranged between the needles (15, 15), to work to form loops; and at least a pair of front and back needle beds having a front edge portion (53, 121) and arranged to confront each other across a needle bed gap, wherein the sinker (41, 123) and the front edge portion (53, 121) of the needle bed are both supported on the needle bed in such a manner as to be movable in an advancing and retracting direction of the needle and also control means (60, 151) is provided for controlling an advanced or retracted motion of both of the sinker (41, 123) and the front edge portion (53, 121) of the needle bed, to adjust a dimension of the needle bed gap between the front and back needle beds (5, 6).

Abstract: A semiconductor device includes a semiconductor chip and a printed circuit board. Metal electrodes of the semiconductor chip and the internal connection terminals of the printed circuit board are electrically connected through the metallic joining via precious metal bumps. A melting point of a metal material constituting each of the metallic joining parts is equal to or higher than 275 degrees, and a space defined between the chip and the board is filled with resin (under fill) containing 50 vol % or more inorganic fillers.

Abstract: In a semiconductor device in which an LSI chip comprising electrodes with a 100 &mgr;m pitch or less and 50 or more pins is mounted directly on an organic substrate, a mounting structure and a manufacturing method thereof are provided excellent in the solder resistant reflow property, temperature cycle reliability and high temperature/high humidity reliability of the semiconductor device. Electrode Au bumps of the chip and an Au film at the uppermost surface of connection terminals of the substrate are directly flip-chip bonded by Au/Au metal bonding and the elongation of the bonded portion of the Au bump is 2 &mgr;m or more. The method of obtaining the bonded structure involves a process of supersonically bonding both of the bonding surfaces within 10 min after sputter cleaning, under the bonding conditions selected from room temperature on the side of the substrate, room temperature to 150° C.

Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.

Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.

Abstract: Provided is a semiconductor device comprising a first metal film formed above a semiconductor chip, a ball portion formed over said first metal film and made of a second metal, and an alloy layer of said first metal and said second metal which alloy layer is formed between said first metal film and said ball portion, wherein said alloy layer reaches the bottom of said first metal film, and said ball portion is covered with a resin; and a manufacturing method thereof. The present invention makes it possible to improve adhesion between the bonding pad portion and ball portion of a bonding wire over an interconnect, thereby improving the reliability of the semiconductor device.

Abstract: A tongue (67) is provided, at a front end thereof, with a drop-loop preventing step (79), and the hook (11) is provided, on an outer edge portion thereof extending from a sharp-pointed tip (27) of the hook to a top (29) of the hook, with a loop escape surface (31) to hide the drop-loop preventing step (79) when the hook (11) is closed by the tongue (67). In addition, the front end of the tongue is lowered so that a height between a bottom of the needle body and a top of the drop-loop preventing step (79) is lowered more when the slider is in a knock-over position than before the slider arrives at the knock-over position and also the top of the drop-loop preventing step (79) positioned at the knocked-over position can be positioned at a lower level than the top (29) of the hook. This can allow can allow a further smooth knock-over of the loop without negative effects on the yarn feed requirements for the capture of the yarn by the needle hook.

Abstract: A yarn carrier 1 is capable of being engaged with a pin 4 protruding from a carriage 3 at two engagement points 8, 9 separated by a delay amount &Dgr;L with respect to a center 1a, respectively. Assuming that the carriage 3 approaches from the right with the pin 4 protruding in order to select and haul the yarn carrier 1 stationary on a yarn guide rail 2, the tip of the pin 4 is guided on a guide portion 11b of an oscillating piece 11, and a tip portion 11c prevents engagement with the engagement point 9 by making oscillation displacement about a shaft 11a. The pin 4 is guided to the engagement point 8 by guide portions 13a, 12a of oscillating plates 13, 12, and abuts on a tip portion 10c of an oscillating piece 10, which is engaged with the front side of the pin 4. The oscillating plate 12 also departs from the pin 4, and a tip portion 12c ascends to be engaged with the rear side of the pin 4.

Abstract: In a loop length controller for a flat knitting machine adapted to set adapted to set the loop length of a knitting fabric by raising or lowering, by a raising and lowering means, a stitch cam attached to a carriage that slides on a needle bed to slidably operate knitting needles forward and backward, the raising and lowering means is provided with a driving motor and a converting mechanism for converting the rotational motion of the driving motor into ascent and descent of the stitch cam, wherein the converting mechanism is configured such that the ascending and descending amount of the stitch cam with respect to the rotational amount of the driving motor differs between a side for a larger drawing-in amount of knitting needles for loops of longer length and a side for a smaller drawing-in amount of knitting needles for loops of shorter length.

Abstract: A flat knitting machine (1) comprising a number of needles (15) arranged in needle grooves (13) formed on needle beds (5, 6) in such a manner as to be freely advanced or retracted; sinkers (41, 123), arranged between the needles (15, 15), to work to form loops; and at least a pair of front and back needle beds having a front edge portion (53, 121) and arranged to confront each other across a needle bed gap, wherein the sinker (41, 123) and the front edge portion (53, 121) of the needle bed are both supported on the needle bed in such a manner as to be movable in an advancing and retracting direction of the needle and also control means (60, 151) is provided for controlling an advanced or retracted motion of both of the sinker (41, 123) and the front edge portion (53, 121) of the needle bed, to adjust a dimension of the needle bed gap between the front and back needle beds (5, 6).