Abstract: Disclosed is a curable composition comprising an elastomer (A), an epoxy resin (B) and a latent curing agent (C), wherein the latent curing agent (C) comprises a combination of two or more latent curing agents.

Abstract: Disclosed is a curable composition comprising an elastomer (A), an epoxy resin (B) and a latent curing agent (C), wherein the latent curing agent (C) comprises a combination of two or more latent curing agents.

Abstract: A pressure resistant device includes a tubular main body portion, a lid portion having a wall portion joined to the main body portion, a positioning portion provided to oppose an inner peripheral surfaces of the main body portion and the wall portion, and a groove portion formed on the inner peripheral surface, and the positioning portion is provided to oppose an edge of the groove portion.

Abstract: A pressure resistant device includes a tubular main body portion, a lid portion having a wall portion joined to the main body portion, a positioning portion provided to oppose an inner peripheral surfaces of the main body portion and the wall portion, and a groove portion formed on the inner peripheral surface, and the positioning portion is provided to oppose an edge of the groove portion.

Abstract: A pressure resistant apparatus includes a cylindrical body portion, and a lid portion having an annular wall portion, end portions of the body portion and the wall portion being joined to each other to close an opening of the body portion by the lid portion, wherein an annular first groove portion is formed to extend in a peripheral direction on at least one of inner peripheral surfaces of the body portion and the wall portion, and an inner diameter of the first groove portion is larger than inner diameters of the body portion and the end portion of the wall portion.

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract: A fluid pressure cylinder includes a cylinder tube, a piston rod, and a displacement sensor. A bottom portion of the cylinder tube has: a pin hole formed in a direction orthogonal to a center axis; and a through hole penetrating the bottom portion through the pin hole. The displacement sensor has: a sensor body disposed on inner side of the pin hole in the through hole; a sensor rod provided so as to extend from the sensor body; and an annular magnet relatively movable with respect to the sensor rod. The through hole has: a reduced-diameter portion; and a female screw portion that has a female screw formed on an inner circumference of the female screw portion. The sensor body is fixed by being pressed by a plug that is screwed into the female screw portion and by being engaged with the reduced-diameter portion.

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract: The present invention provides a refrigerator with improved refrigerator box strength and high heat insulating performance, which is configured such that external deformation due to entry of air into a vacuum heat insulating material, the entry of air being caused by aging degradation, is prevented. The present invention includes: a heat-insulated box including an inner casing and an outer casing, in which space between the inner casing and the outer casing is filled with a foamed heat insulating material; and a vacuum heat insulating material disposed in at least a side wall of the heat-insulated box together with the foamed heat insulating material, the vacuum heat insulating material including an outer skin material, the outer skin material including at least a core material and being decompression-sealed. The vacuum heat insulating material includes a gas adsorbent.

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract: A wiring substrate includes a heat radiation plate and a substrate provided on the heat radiation plate interposed by an adhesive layer. The substrate includes a first surface on which the adhesive layer is provided and a second surface on an opposite side of the first surface. The wiring substrate also includes a wiring provided on the second surface of the substrate, and a notch part that penetrates the substrate in a thickness direction of the substrate, with the notch part being formed by notching the wiring substrate inward from an outer edge part of the substrate from a plan view. The adhesive layer covers an end surface of the substrate that is exposed in an inner wall surface of the notch part.

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract: A fluid pressure cylinder includes a cylinder tube, a piston rod, and a displacement sensor. A bottom portion of the cylinder tube has: a pin hole formed in a direction orthogonal to a center axis; and a through hole penetrating the bottom portion through the pin hole. The displacement sensor has: a sensor body disposed on inner side of the pin hole in the through hole; a sensor rod provided so as to extend from the sensor body; and an annular magnet relatively movable with respect to the sensor rod. The through hole has: a reduced-diameter portion; and a female screw portion that has a female screw formed on an inner circumference of the female screw portion. The sensor body is fixed by being pressed by a plug that is screwed into the female screw portion and by being engaged with the reduced-diameter portion.

Abstract: The vacuum insulation panel according to the present invention includes: a core material (2) containing an inorganic fiber, a first film laminate (4a) having a first heat-sealing layer (5a) on the joining side, and a second film laminate (4b) having a second heat-sealing layer (5b) on the joining side, the density of the first heat-sealing layer (5a) being lower than the density of the second heat-sealing layer (5b).

Abstract: A plurality of thin-wall parts (9a) of a sealant layer (7) are formed in a portion continuously changed in the interval of one sealing part (8) and a gas barrier layer (6) of other laminate film (4). At the inner circumferential side between the adjacent thin-wall parts (9a) and the thin-wall part (9a) at the innermost circumferential side and at the outer circumferential side of the thin-wall part (9a) of the outermost circumferential side, a thick-wall part (9b) of the sealant layer (7) is formed. All of the opposing sealant layers (7) between the two adjacent thin-wall parts (9a) are mutually heated and fused, so that an excellent adiabatic performance is maintained for a long period.

Abstract: A wiring substrate includes a heat radiation plate and a substrate provided on the heat radiation plate interposed by an adhesive layer. The substrate includes a first surface on which the adhesive layer is provided and a second surface on an opposite side of the first surface. The wiring substrate also includes a wiring provided on the second surface of the substrate, and a notch part that penetrates the substrate in a thickness direction of the substrate, with the notch part being formed by notching the wiring substrate inward from an outer edge part of the substrate from a plan view. The adhesive layer covers an end surface of the substrate that is exposed in an inner wall surface of the notch part.

Abstract: A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of the insulating resin layer.

Abstract: A package includes: a leadframe made of conductive material and on which the plurality of electronic components are to be mounted, the leadframe including a first surface and a second surface opposite to the first surface and including a plurality of elongate portions arranged in parallel to each other with a gap interposed between the adjacent elongate portions; a heat sink including a first surface and a second surface opposite to the first surface, wherein the leadframe is disposed above the heat sink such that the second surface of the leadframe faces the first surface of the heat sink; and a resin portion, wherein the leadframe and the heat sink are embedded in the resin portion such that the first surface of the leadframe and the second surface of the heat sink are exposed from the resin portion, respectively.

Abstract: A package for mounting a light emitting element includes a housing and a flat plate-shaped electrode. The electrode is exposed from a lower surface of the housing. An upper surface of the electrode includes a mounting area on which the light emitting element is mounted. An insulator is arranged on the upper surface of the electrode. An element connector is connected to the insulator. A tubular reflective portion extends from the element connector to a height corresponding to the upper surface of the housing. A terminal is arranged on the side surface of the housing and connected to the reflective portion. A recess accommodates the light emitting element. The recess is formed in an upper portion of the housing, and the recess is formed by the upper surface of the electrode, the element connector, and the reflective portion.