Abstract: A liquid-cooling block, a liquid-cooling block assembly, and a liquid-cooling heat dissipation device are disclosed. The liquid-cooling block includes a reservoir and a thermally conductive sheet. The reservoir has a liquid inlet, a first liquid outlet, a second liquid outlet, and a flow-dividing channel located inside the reservoir. A liquid inlet end of the flow-dividing channel is in communication with the liquid inlet. A liquid outlet end of the flow-dividing channel has a first flow-dividing opening and a second flow-dividing opening. The thermally conductive sheet is hermetically fixed to the reservoir to form a closed accommodating chamber therebetween. The thermally conductive sheet is integrally formed with a plurality of fins located in the accommodating chamber.

Abstract: Provided is a pharmaceutical composition including an active pharmaceutical ingredient, a toll-like receptor (TLR) agonist, a stimulator of interferon genes (STING) agonist, and a pharmaceutically acceptable carrier. Also provided are a method for inducing immune response and a method for treating or preventing cancer or an infectious disease, including administering an effective amount of the pharmaceutical composition to a subject in need thereof.

Abstract: A tight-fit riveting structure for a clustered radiation fin set and a heat pipe and a riveting method include a radiation fin set formed by locking a plurality of radiation fins together and at least one heat pipe. The radiation fin set has an accommodation slot for accommodating the heat pipe. The heat pipe is positioned in the accommodation slot for a tight fit by subjecting two sides of the accommodation slot of the radiation fin set to a riveting operation. First riveting and deforming portions defined on two sides of a communication mouth of the accommodation slot are riveted towards a surface of the heat pipe, which causes the deformation of the first riveting and deforming portions whereby the heat pipe is clamped in a tight fit manner.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: A method for removing a heavy metal from water includes subjecting a microbial solution containing a liquid culture of a urease-producing bacterial strain and a reaction solution containing a manganese compound and urea to a microbial-induced precipitation reaction, so as to obtain biomineralized manganese carbonate (MnCO3) particles, admixing the biomineralized MnCO3 particles with water containing a heavy metal, so that the biomineralized MnCO3 particles adsorb the heavy metal in the water to form a precipitate, and removing the precipitate from the water.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: An electrochromic composition including: a first oxidizable compound; a reducible compound; an electrolyte; and a solvent, wherein the first oxidizable compound is represented by the following formula: wherein X1, and X2 are independently substituted or unsubstituted aliphatic hydrocarbon groups, or substituted or unsubstituted aromatic hydrocarbon groups, wherein the aromatic hydrocarbon groups include: wherein each Rx is independently hydrogen, a C1-C16 alkyl group, a C1-C16 alkoxy group, a C1-C16 haloalkyl group, or halogen.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A double-sided expanded plate riveting structure and a double-sided expanded plate riveting method are disclosed. By providing an upright portion, a bottom end of the upright portion is bent toward at least one side to form a folded portion, and at least one side of the folded portion partially extends beyond a plane corresponding to an outer side of an expanded structure for a press head to perform a pressing operation, which effectively avoids a bend and deformation of a double-sided expanded plate in the riveting process.

Abstract: A memory device including a first memory cell, a first tracking cell, a tracking bit line, a second tracking cell and a word line driver. The first memory cell is configured to receive a first word line signal. The first tracking cell is configured to emulate the first memory cell. The tracking bit line is configured to transmit a tracking bit line signal to the first tracking cell. The second tracking cell is configured to adjust the tracking bit line signal according to the first word line signal. The word line driver is configured to adjust the first word line signal according to the tracking bit line signal and a first distance between the second tracking cell and a common node on the tracking bit line.

Abstract: A water-cooling heat dissipation device includes a water-cooling radiator. The water-cooling radiator includes a radiating pipe unit, a water outlet reservoir, and a water inlet reservoir. The water-cooling radiator is provided with a first water pump and a second water pump. Each water pump is configured to pump cold water in a corresponding water outlet chamber to a corresponding water-cooling block to exchange heat and become hot water, hot water flows back to a corresponding water inlet chamber and flows into the corresponding radiating pipe unit to be cooled by radiating fins, and then cold water flows into the corresponding water outlet chamber.

Abstract: A water-cooling radiator includes a first water collection box, a second water collection box and a plurality of radiating pipes. A water pump chamber is disposed in a box body, and is in cooperation with a water pump, an impeller and a water pump cover to form a water pump structure with good airtightness, so that the water pump and the first water collection box are effectively combined. The flow speed of water in the water-cooling radiator is effectively accelerated, which improves the heat dissipation efficiency. The overall heat dissipation effect of the product is very good.

Abstract: An integrally-formed liquid collecting box structure and a method for manufacturing the same are presented. The integrally-formed liquid collecting box structure includes an integrally-formed liquid collecting box, a screw, and a leak-proof sealing ring. The leak-proof sealing ring is located between a nut portion of the screw and an inner end face of a stepped hole. The screw is screwed into an internal threaded hole. When the screw is tightened, the nut portion squeezes the leak-proof sealing ring so that the leak-proof sealing ring is deformed and clamped between the nut portion and the inner end face of the stepped hole, so as to prevent leakage.

Abstract: A memory device is disclosed. The memory device includes word lines, a tracking bit line and a word line driver. The word lines are configured to transmit word line signals to memory cells. The tracking bit line is coupled to a first plurality of tracking cells that are arranged in rows. The word line driver is coupled to the word lines and a control circuit that is coupled through the tracking bit line to the word lines. The word line driver is configured to control a falling edge of each of the word line signals, by receiving each corresponding tracking bit line signal of tracking bit line signals transmitted from the tracking bit line, based on a resistance of a length of the tracking bit line. The length is substantially distanced from each corresponding row of the rows to the control circuit. A method is also disclosed herein.

Abstract: A method of making a semiconductor device includes forming a first memory device, connecting a first word line to the first memory device, forming at least a first via, forming a second memory device, connecting a second word line to the second memory device, connecting a bit line to the first memory device and connecting the bit line to the second memory device by the first via. The first and second memory devices are separated by an inter-layer dielectric, and the first via connects the first memory device and the second memory device.

Abstract: A tight-fit riveting structure for a clustered radiation fin set and a heat pipe and a riveting method include a radiation fin set formed by locking a plurality of radiation fins together and at least one heat pipe. The radiation fin set has an accommodation slot for accommodating the heat pipe. The heat pipe is positioned in the accommodation slot for a tight fit by subjecting two sides of the accommodation slot of the radiation fin set to a riveting operation. First riveting and deforming portions defined on two sides of a communication mouth of the accommodation slot are riveted towards a surface of the heat pipe, which causes the deformation of the first riveting and deforming portions whereby the heat pipe is clamped in a tight fit manner.

Abstract: A tight-fit riveting structure for a heat dissipation aluminum base and a heat pipe includes a heat dissipation aluminum base, a heat pipe, and a holder. When the heat dissipation aluminum base is to be manufactured, an upper surface of a thin aluminum plate is pressed downward to form an arched portion. The arched portion protrudes below the thin aluminum plate. A cavity is defined in the arched portion. The cavity has an upper end opening. The cavity has an inner width corresponding to an outer width of the heat pipe. The cavity has a depth greater than a thickness of the heat pipe.

Abstract: A water-cooling heat dissipation device includes a water-cooling radiator. The water-cooling radiator includes a radiating pipe unit, a water outlet reservoir, and a water inlet reservoir. The water-cooling radiator is provided with a first water pump and a second water pump. Each water pump is configured to pump cold water in a corresponding water outlet chamber to a corresponding water-cooling block to exchange heat and become hot water, hot water flows back to a corresponding water inlet chamber and flows into the corresponding radiating pipe unit to be cooled by radiating fins, and then cold water flows into the corresponding water outlet chamber.

Abstract: A liquid-cooling pump and a flow channel structure thereof are disclosed. The flow channel structure includes a liquid pump mounting chamber. A bottom of the liquid pump mounting chamber is centrally formed with a liquid inlet. A peripheral side of the liquid pump mounting chamber is formed with a liquid outlet. An inner wall of the peripheral side of the liquid pump mounting chamber is convexly provided with a protruding boss corresponding to one side of the liquid outlet and surrounding an impeller, and is concavely provided with a guide groove corresponding to another side of the liquid outlet and surrounding the impeller. The protruding boss is gradually thinned along a rotating direction of the impeller. The guide groove is gradually deepened along the rotating direction of the impeller and communicates with the liquid outlet.

Abstract: A liquid-cooling radiator includes liquid pipes, heat-dissipating fins arranged on the liquid pipes, two reservoirs, a liquid-collecting box, a liquid pump, and a heat-dissipating base. The two reservoirs are mounted to two ends of the liquid pipes, respectively. The reservoir at one end is partitioned into a first cold liquid reservoir and a second cold liquid reservoir, and the reservoir at the other end is partitioned into a first hot liquid reservoir and a second hot liquid reservoir, thereby forming a bilateral circulation.