Abstract: A liquid-cooling heat dissipation apparatus includes a water distribution box, a water collection box, a first radiating pipe, a second radiating pipe, a third radiating pipe, a fourth radiating pipe, and a pumping device. The channels in the liquid-cooling heat dissipation apparatus are connected in sequence to form a circuitous configuration. This allows the water to travel a longer distance in the liquid-cooling heat dissipation apparatus, so that the liquid-cooling heat dissipation apparatus can effectively cool the water and dissipate heat.

Abstract: A riveting structure for a thin heat sink fin and a thin cover plate is disclosed. The riveting structure includes a plurality of thin heat sink fins and a thin cover plate. The top of each thin heat sink fin is provided with a raised portion, the thin cover plate is formed with a plurality of cover plate riveting holes, and the raised portion is pressed and deformed by a rolling device in a rolling manner to fill the space of a corresponding one of the cover plate riveting holes, thereby fixing the raised portion. It is suitable for a “thin” design, improves the assembly efficiency greatly, reduces the labor cost, and reduces the product defect rate effectively.

Abstract: A method of making a semiconductor device includes forming a first memory device, connecting a first word line to the first memory device, forming at least a first via, forming a second memory device, connecting a second word line to the second memory device, connecting a bit line to the first memory device and connecting the bit line to the second memory device by the first via. The first and second memory devices are separated by an inter-layer dielectric, and the first via connects the first memory device and the second memory device.

Abstract: A method of making a semiconductor device includes forming a first memory device, connecting a first word line to the first memory device, forming at least a first via, forming a second memory device, connecting a second word line to the second memory device, connecting a bit line to the first memory device and connecting the bit line to the second memory device by the first via. The first and second memory devices are separated by an inter-layer dielectric, and the first via connects the first memory device and the second memory device.

Abstract: A double-sided expanded plate riveting structure and a double-sided expanded plate riveting method are disclosed. By providing an upright portion, a bottom end of the upright portion is bent toward at least one side to form a folded portion, and at least one side of the folded portion partially extends beyond a plane corresponding to an outer side of an expanded structure for a press head to perform a pressing operation, which effectively avoids a bend and deformation of a double-sided expanded plate in the riveting process.

Abstract: A heat sink having a press-riveting structure includes a base and a heat sink fin. The heat sink fin is formed with a connecting portion, and the connecting portion is in contact with a contact surface of the base. One side of the heat sink fin can be stably supported, and it is easy for a press head to thrust a folded insertion portion of the heat sink fin, so that the heat sink fin is combined with the base more reliably, and the height of the heat sink fin is reduced. The heat sink fin won't be bent and deformed easily.

Abstract: A high-efficiency water-cooled heat dissipation device includes a heat sink base, an inner cover, an impeller, a lower casing and a motor that are arranged from bottom to top. By providing the inner cover, the inner cover covers a fin portion of the heat sink base. When in use, a cold liquid flows into the inner cover from first perforations and is evenly distributed on the fin portion, and then flows out of a liquid outlet chamber from second perforations, so that the cold liquid can be effectively drained to avoid the mixing of the cold liquid and the hot liquid, thereby fully utilizing the cold liquid for heat absorption to improve the heat dissipation effect.

Abstract: A high-efficiency heat sink includes a base and a plurality of heat sink fins A folded portion of each heat sink fin is formed by folding after being pressed and thinned, so that the thickness of the folded portion is less than the thickness of an insertion end of each heat sink fin. The thickness of the portion where the heat sink fin is inserted into a groove of the base is less than twice the thickness of the heat sink fin. It is beneficial to reduce the distance between two adjacent heat sink fins on the base, so that the heat sink fins can be arranged more densely, thereby improving the heat dissipation effect of the entire heat sink effectively.

Abstract: The present disclosure provides a cable assembly and a cable indication system. The cable assembly includes a cable, a first connector, and a second connector. The cable includes a jacket defining a first cavity and a second cavity, the first cavity includes at least one electrical wire extending through the first cavity, and the second cavity includes a light bar extending through the second cavity. The first connector is electrically coupled to a first end of the cable, and includes a first interface for connecting with a first device. The second connector is electrically coupled to a second end of the cable, and includes a second interface for connecting with a second device.

Abstract: A riveting structure for a thin heat sink fin and a thin cover plate is disclosed. The riveting structure includes a plurality of thin heat sink fins and a thin cover plate. The top of each thin heat sink fin is provided with a raised portion, the thin cover plate is formed with a plurality of riveting holes, and the raised portion is riveted and fixed to a corresponding one of the riveting holes in a rolling manner by a rolling device, instead of the traditional manual welding method. This improves the assembly efficiency greatly, reduces the labor cost, and reduces the product defect rate effectively.

Abstract: A high-efficiency water-cooled heat dissipation device includes a heat sink base, an inner cover, an impeller, a lower casing and a motor that are arranged from bottom to top. By providing the inner cover, the inner cover covers a fin portion of the heat sink base. When in use, a cold liquid flows into the inner cover from first perforations and is evenly distributed on the fin portion, and then flows out of a liquid outlet chamber from second perforations, so that the cold liquid can be effectively drained to avoid the mixing of the cold liquid and the hot liquid, thereby fully utilizing the cold liquid for heat absorption to improve the heat dissipation effect.

Abstract: A liquid cooling radiator with impurities filtering includes a radiation fin module, a top cover and a bottom cover respectively enclosed at two opposite ends of the radiation fin module, liquid cooling heat dissipation pipes tightly inserted through the radiation fin module in communication between an enclosed top chamber in the top cover and an enclosed bottom chamber in the bottom cover for coolant circulation, and wire gauge filters individually mounted in the liquid cooling heat dissipation pipes for removing impurities from the circulating coolant and slowing down the flowing speed of the circulating coolant.

Abstract: A liquid cooling radiator with impurities filtering includes a radiation fin module, a top cover and a bottom cover respectively enclosed at two opposite ends of the radiation fin module, liquid cooling heat pipes tightly inserted through the radiation fin module in communication between an enclosed top chamber in the top cover and an enclosed bottom chamber in the bottom cover for coolant circulation, and wire gauge filters individually mounted in the liquid cooling heat pipes for removing impurities from the circulating coolant and slowing down the flowing speed of the circulating coolant.

Abstract: A sense amplify enable (SAE) signal is generated on a SAE line by receiving a trigger signal at a first circuit portion coupled to a first domain power supply and a second circuit portion coupled to a second domain power supply. The second domain power supply is separate and distinct from the first domain power supply. The first circuit portion and the second circuit portion are each further coupled to the SAE line for carrying the SAE signal. For a first period of time, a first portion of the SAE signal is generated based on the first domain power supply using the first circuit portion. And, for second period of time, a second portion of the SAE signal is generated based on the second domain power supply using a second circuit portion.

Abstract: A method of making a semiconductor device includes forming a first memory device, connecting a first word line to the first memory device, forming at least a first via, forming a second memory device, connecting a second word line to the second memory device, connecting a bit line to the first memory device and connecting the bit line to the second memory device by the first via. The first and second memory devices are separated by an inter-layer dielectric, and the first via connects the first memory device and the second memory device.

Abstract: A three-dimensional integrated circuit includes a first transistor, a word line, a first via, a second transistor, and a second via. The first transistor is on a first level and the second transistor is on a second level. The second level is different from the first level. The word line and the first via are coupled to the first transistor. The second via is coupled between the first transistor and the second transistor.

Abstract: A sense amplify enable (SAE) signal is generated on a SAE line by receiving a trigger signal at a first circuit portion coupled to a first domain power supply and a second circuit portion coupled to a second domain power supply. The second domain power supply is separate and distinct from the first domain power supply. The first circuit portion and the second circuit portion are each further coupled to the SAE line for carrying the SAE signal. For a first period of time, a first portion of the SAE signal is generated based on the first domain power supply using the first circuit portion. And, for second period of time, a second portion of the SAE signal is generated based on the second domain power supply using a second circuit portion.

Abstract: A heat sink assembly includes a base block having a straight mounting groove on the middle and two U-shaped mounting grooves at two opposite lateral sides, cooling fins installed in the top wall of the base block, each cooling fin having multiple tight-fit mounting holes, a U-shaped heat pipe having a lower segment peripherally press-fitted into the straight mounting groove in flush with the bottom wall of the base block and an upper segment tightly inserted into one respective tight-fit mounting hole of each cooling fin, and two symmetrical, curved heat pipes with respective U-shaped lower segments thereof respectively and peripherally press-fitted into the U-shaped mounting grooves in flush with the bottom wall of the base block and respective upper segments thereof tightly inserted into respective tight-fit mounting holes of each cooling fin. Thus, heat can be drawn upwards from a heat source and evenly distributed through the cooling fins.