Abstract: A semiconductor device comprising a first supply voltage, a second supply voltage, different from the first supply voltage; and a switching circuit. The switching circuit comprises an input configured to receive an input signal corresponding to the first supply voltage and an output configured to output an output signal corresponding to the second supply voltage. The switching circuit is a combined latch with a built-in level shifter that provides latching functionality and level shifting functionality and a leakage path is cut-off when the switching circuit is providing latching functionality.

Abstract: A heat sink assembly includes a base block having a straight mounting groove on the middle and two U-shaped mounting grooves at two opposite lateral sides, cooling fins installed in the top wall of the base block, each cooling fin having multiple tight-fit mounting holes, a U-shaped heat pipe having a lower segment peripherally press-fitted into the straight mounting groove in flush with the bottom wall of the base block and an upper segment tightly inserted into one respective tight-fit mounting hole of each cooling fin, and two symmetrical, curved heat pipes with respective U-shaped lower segments thereof respectively and peripherally press-fitted into the U-shaped mounting grooves in flush with the bottom wall of the base block and respective upper segments thereof tightly inserted into respective tight-fit mounting holes of each cooling fin. Thus, heat can be drawn upwards from a heat source and evenly distributed through the cooling fins.

Abstract: A semiconductor device comprising a first supply voltage, a second supply voltage, different from the first supply voltage; and a switching circuit. The switching circuit comprises an input configured to receive an input signal corresponding to the first supply voltage and an output configured to output an output signal corresponding to the second supply voltage. The switching circuit is a combined latch with a built-in level shifter that provides latching functionality and level shifting functionality and a leakage path is cut-off when the switching circuit is providing latching functionality.

Abstract: A combination heat sink base and heat pipe assembly includes a top base plate having multiple female engagement members symmetrically located on a bottom wall thereof at two opposite lateral sides, heat pipe grooves located on the bottom wall and multiple mounting ribs and mounting grooves alternatively located on the bottom wall; a bottom base plate having multiple heat pipe grooves located on a top wall thereof to cooperate with the heat pipe grooves of the top base plate, multiple male engagement members symmetrically located on the top wall and respectively forced into engagement with the female engagement members of the top base plate and multiple mounting grooves and mounting ribs alternatively located on the top wall and respectively forced into engagement with the respective mounting ribs and mounting grooves of the top base plate; and heat pipes mounted and secured in the heat pipe grooves.

Abstract: A heat sink assembly includes a base block having a straight mounting groove on the middle and two U-shaped mounting grooves at two opposite lateral sides, cooling fins installed in the top wall of the base block, each cooling fin having multiple tight-fit mounting holes, a U-shaped heat pipe having a lower segment peripherally press-fitted into the straight mounting groove in flush with the bottom wall of the base block and an upper segment tightly inserted into one respective tight-fit mounting hole of each cooling fin, and two symmetrical, curved heat pipes with respective U-shaped lower segments thereof respectively and peripherally press-fitted into the U-shaped mounting grooves in flush with the bottom wall of the base block and respective upper segments thereof tightly inserted into respective tight-fit mounting holes of each cooling fin. Thus, heat can be drawn upwards from a heat source and evenly distributed through the cooling fins.

Abstract: An aluminum pipe and heat pipe package is formed by inserting a heat pipe into a hollow aluminum pipe, and then processing the combination of the heat pipe and hollow aluminum pipe through a series of extrusion molding steps. The extrusion molding steps are performed by means of opposing top and bottom extrusion dies and opposing left and right necking dies to reduce the gap between the hollow aluminum pipe and the heat pipe. Consequently, the hollow aluminum pipe and the heat pipe are peripherally tightly fitted together, and the two opposite open ends of the hollow aluminum pipe are completely blocked up.

Abstract: A metal heat transfer plate and heat pipe mounting structure includes a metal heat transfer plate and heat pipes embedded in the metal heat transfer plate in a flush manner. The metal heat transfer plate and heat pipe mounting method includes the steps of punching mounting slots in a metal heat transfer plate, processing each mounting slot into a respective flanged hole, reversely stamping each flanged hole to form top and bottom protruding flanges around each mounting slot, stamping each bottom protruding flange to create an insertion chamber, and press-fitting a flat heat pipe into each mounting slot and then stamping each top protruding flange into a respective deformed top protruding flange to wrap about one respective heat pipe and to keep each deformed top protruding flange flush with the top surface of the metal heat transfer plate and each heat pipe.

Abstract: A heat sink assembly includes a base block having a straight mounting groove on the middle and two U-shaped mounting grooves at two opposite lateral sides, cooling fins installed in the top wall of the base block, each cooling fin having multiple tight-fit mounting holes, a U-shaped heat pipe having a lower segment peripherally press-fitted into the straight mounting groove in flush with the bottom wall of the base block and an upper segment tightly inserted into one respective tight-fit mounting hole of each cooling fin, and two symmetrical, curved heat pipes with respective U-shaped lower segments thereof respectively and peripherally press-fitted into the U-shaped mounting grooves in flush with the bottom wall of the base block and respective upper segments thereof tightly inserted into respective tight-fit mounting holes of each cooling fin. Thus, heat can be drawn upwards from a heat source and evenly distributed through the cooling fins.

Abstract: A heat sink and mounting bracket arrangement includes a radiation fin module including a stack of radiation fins and an insertion hole located in one end of the stack of radiation fins, and a mounting bracket made from a metal plate sheet by stamping and including a bottom panel clamped on a bottom wall of the stack of radiation fins, an angled mounting panel rearwardly extending from one end of the bottom panel, a mounting slot cut through opposing top and bottom surfaces of the mounting panel for the mounting of a fastening member to affix the mounting bracket to an external substrate, and an angled plug plate forwardly extending from the bottom panel and tightly press-fitted into the insertion hole of the radiation fin module.

Abstract: A three-dimensional integrated circuit includes a first transistor, a word line, a first via, a second transistor, and a second via. The first transistor is on a first level and the second transistor is on a second level. The second level is different from the first level. The word line and the first via are coupled to the first transistor. The second via is coupled between the first transistor and the second transistor.

Abstract: A metal heat transfer plate and heat pipe mounting structure includes a metal heat transfer plate and heat pipes embedded in the metal heat transfer plate in a flush manner. The metal heat transfer plate and heat pipe mounting method includes the steps of punching mounting slots in a metal heat transfer plate, processing each mounting slot into a respective flanged hole, reversely stamping each flanged hole to form top and bottom protruding flanges around each mounting slot, stamping each bottom protruding flange to create an insertion chamber, and press-fitting a flat heat pipe into each mounting slot and then stamping each top protruding flange into a respective deformed top protruding flange to wrap about one respective heat pipe and to keep each deformed top protruding flange flush with the top surface of the metal heat transfer plate and each heat pipe.

Abstract: A three dimensional semiconductor device includes a first memory device, a second memory device and a via. The via connects the first memory device to the second memory device.

Abstract: An aluminum pipe and heat pipe package formed by inserting a heat pipe into a hollow aluminum pipe, and then processing the combination of the heat pipe and hollow aluminum pipe through a series of extrusion molding steps by means of opposing top and bottom extrusion dies and opposing left and right necking dies to reduce the gap between the hollow aluminum pipe and the heat pipe, and to have the hollow aluminum pipe and the heat pipe to be peripherally tightly fitted together, and the two opposite open ends of the hollow aluminum pipe to be completely blocked up.

Abstract: A heat sink and mounting bracket arrangement includes a radiation fin module including a stack of radiation fins and an insertion hole located in one end of the stack of radiation fins, and a mounting bracket made from a metal plate sheet by stamping and including a bottom panel clamped on a bottom wall of the stack of radiation fins, an angled mounting panel rearwardly extending from one end of the bottom panel, a mounting slot cut through opposing top and bottom walls of the mounting panel for the mounting of a fastening member to affix the mounting bracket to an external substrate, and an angled plug plate forwardly extending from the bottom panel and tightly press-fitted into the insertion hole of the radiation fin module.

Abstract: A method for 3D voltage type TSV signal transmission, comprising transmitting a full swing signal of data with a first voltage through TSVs for each one of a plurality of slave devices to determine a transmission time required for data transmission to a master device. Then, full swing signal is sensed by the master device for reduce the first voltage to be a small swing signal with lower voltage. Logic “0” signals or logic “1” signals with the lower voltage are transmitted through the TSVs by the plurality of slave devices. It is sharing charge and balancing voltage level to a mean value for the logic “1” signals or the logic “0” signals by the master device.

Abstract: A heat sink assembly includes a heat transfer block defining alternatively arranged mounting grooves and spacer ribs, and radiation fins respectively formed by bending one respective thin metal sheet member into a substantially inverted U-shaped profile having two radiation fin walls that have one end connected to each other and an opposite end terminating in a respective outwardly upwardly extending folded portion, each radiation fin wall with the respective outwardly upwardly extending folded portion being inserted into one respective mounting groove of the heat transfer block and fixedly secured thereto through a stamping operation to deform the folded portions of the radiation fin walls of the radiation fins and spacer ribs of the heat transfer block synchronously.

Abstract: An LED lamp assembly includes a heat-sink base having insertion notches equiangularly and radially located at a flat inner wall thereof, a plurality of radiation fins arranged in a radial array, each radiation fin having a plug portion disposed at a top side thereof and respectively inserted into one respective insertion notch of the heat-sink base and fixedly secured thereto using a stamping technique, a lampshade fastened to the radiation fins at the top side, an inner tube press-fitted into a center opening in the radiation fin set and affixed to the bottom side of the heat-sink base, and an insulative connector affixed to the bottom end of the inner tube.

Abstract: A heat sink assembly includes a heat pipe, a plurality of metal support members, and a mounting spring plate. The heat pipe has a first heat-receiving surface. Each metal support member has a second heat-receiving surface. The mounting spring plate has a heat pipe mounting portion for press-fitting therein the heat pipe without using solder, a plurality of support portions affixed to respective metal support members, and a plurality of mounting portions for securing to a base of a heat source. After the heat pipe is secured to the mounting spring plate, the first heat-receiving surface of the heat pipe would be protruded from the mounting spring plate. The second heat-receiving surfaces of the metal support members are flush with the first heat-receiving surface of the heat pipe. By adopting the solder-less press-fitting, the manufacturing cost and process can be lowered and simplified respectively.

Abstract: A combination fin and heat pipe assembly includes a heat pipe, and a plurality of radiation fins each including a fin plate, a mounting through hole in the fin plate that receives the heat pipe, an annular flange extending from one side of the fin plate around the mounting through hole and two opposing arched slots each cut through a part of the fin plate adjacent to a peripheral wall of the annular flange to partially separate the annular flange from the respective fin plate. The annular flange has the peripheral wall deformed on two opposite sides corresponding to the arched slots and forced into tight engagement with the periphery of the heat pipe.