Abstract: An omnidirectional LED lamp holder assembly includes a heat sink module including a heat sink base and radiation fins around the heat sink base, a lampshade and an electrical connector respectively mounted at opposing top and bottom sides of the heat sink module. The heat sink base is a one-piece extruded member defining a tubular heat-transfer base portion, a broad platform and a hollow protruding mount for holding LED chips at different angles. The broad platform horizontally protrudes over the periphery of the tubular heat-transfer base portion, providing a bearing face. The radiation fins are fastened to respective mounting grooves around the periphery of the tubular heat-transfer base portion. Waste heat produced during operation of the LED chips can be rapidly transferred by the hollow protruding mount to the broad platform and the heat-transfer base portion and then dissipated by the radiation fin into the outside open air.

Abstract: A vapor chamber heat sink includes an upper base having radiation fins formed of a top wall thereof by chipping, and a lower base bonded to a bottom wall of the upper base through a single soldering process, enabling a recessed chamber in the lower base to form an enclosed inner chamber in a vacuum status.

Abstract: A metal heat transfer plate and heat pipe mounting structure includes a metal heat transfer plate and heat pipes embedded in the metal heat transfer plate in a flush manner. The metal heat transfer plate and heat pipe mounting method includes the steps of punching mounting slots in a metal heat transfer plate, processing each mounting slot into a respective flanged hole, reversely stamping each flanged hole to form top and bottom protruding flanges around each mounting slot, stamping each bottom protruding flange to create an insertion chamber, and press-fitting a flat heat pipe into each mounting slot and then stamping each top protruding flange into a respective deformed top protruding flange to wrap about one respective heat pipe and to keep each deformed top protruding flange flush with the top surface of the metal heat transfer plate and each heat pipe.

Abstract: An LED lamp assembly includes a heat-sink base having insertion notches equiangularly and radially located at a flat inner wall thereof, and a plurality of radiation fins arranged in a radial array, each radiation fin having a plug portion disposed at a top side thereof and respectively inserted into one respective insertion notch of the heat-sink base and fixedly secured thereto using a stamping technique, a lampshade fastened to the radiation fins at the top side, and an insulative connector fastened to the radiation fins at the bottom side.

Abstract: A heat dissipation mechanism for handheld electronic apparatus includes a thin metal sheet having one or multiple elongated mounting grooves and an elongated rib extending along each of two opposite lateral sides of each elongated mounting groove, and one or multiple heat pipes respectively press-fitted into one respective elongated mounting groove of the thin metal sheet. After insertion of each heat pipe into one respective elongated mounting groove, the elongated ribs are deformed to wrap about each loaded heat pipe.

Abstract: A heat dissipation mechanism for handheld electronic apparatus includes a thin metal sheet having spaced integral clamping plates, and one or multiple heat pipes attached to the clamping plates and secured thereto. After insertion of each heat pipe into the clamping plates, the clamping plates are deformed to wrap about the loaded heat pipe(s).

Abstract: A method for 3D voltage type TSV signal transmission, comprising transmitting a full swing signal of data with a first voltage through TSVs for each one of a plurality of slave devices to determine a transmission time required for data transmission to a master device. Then, full swing signal is sensed by the master device for reduce the first voltage to be a small swing signal with lower voltage. Logic “0” signals or logic “1” signals with the lower voltage are transmitted through the TSVs by the plurality of slave devices. It is sharing charge and balancing voltage level to a mean value for the logic “1” signals or the logic “0” signals by the master device.

Abstract: A heat sink assembly includes a heat transfer block defining alternatively arranged mounting grooves and spacer ribs, and radiation fins respectively formed by bending one respective thin metal sheet member into a substantially inverted U-shaped profile having two radiation fin walls that have one end connected to each other and an opposite end terminating in a respective outwardly upwardly extending folded portion, each radiation fin wall with the respective outwardly upwardly extending folded portion being inserted into one respective mounting groove of the heat transfer block and fixedly secured thereto through a stamping operation to deform the folded portions of the radiation fin walls of the radiation fins and spacer ribs of the heat transfer block synchronously.

Abstract: The present invention discloses a control scheme for 3D memory IC that includes a master chip and at least one slave chip. The master chip includes a main memory core, a first local timer, an I/O buffer, a first pad and a second pad. The at least one slave chip is stacked with the master chip. Each of the slave chip includes a slave memory core, a second local timer and a third pad. A first TSV is coupled to the first pad and the third pad. A logic control circuit layer includes a logic control circuit and a fourth pad, and the logic control circuit is coupled to the fourth pad. A second TSV is coupled to the second pad and the fourth pad.

Abstract: A three dimensional semiconductor device includes a first memory device, a second memory device and a via. The via connects the first memory device to the second memory device.

Abstract: A heat sink module includes a base block having opposing top wall and bottom wall, insertion grooves located at the top wall, heat pipe grooves located at the bottom wall and rows of equally spaced holes cut through the top and bottom walls in communication between the insertion grooves and the heat pipe grooves and matching the insertion grooves, heat pipes mounted in the heat pipe grooves of the base block, and radiation fins respectively mounted in the insertion grooves of the base block, each radiation fin having heat pipe mating edges respectively inserted into the holes and stopped against the heat pipes for dissipating heat from the heat pipes.

Abstract: A heat pipe mounting method and a heat pipe assembly thereof are disclosed. The method includes the step of providing a heat-transfer block and a plurality of heat pipes. A plurality of heat pipe grooves is formed on the heat-transfer block. The heat pipes are then press-fitted to respective heat pipe grooves. During the press-fitting step, the heat pipes are flattened to force the flattened part of one heat pipe into abutment against the flattened part of another heat pipe in a flushed manner. Thereby, the heat pipes are abutted to each other with no separation therebetween. Hence, the heat transfer performance is increased.

Abstract: A heat sink includes one or two heat transfer blocks, and corrugated radiation fins fastened to the heat transfer block(s). Each corrugated radiation fin has a large area corrugated radiation fin body to provide an extended heat dissipation surface area, and a plug portion located at the bottom side of the large area corrugated radiation fin body and press-fitted into one respective mounting groove of the heat transfer block(s).

Abstract: An LED lamp bulb includes a heat sink carrying LEDs, a radiation fin set including multiple radiation fins radially arranged around the heat sink, an insulative lamp bulb base affixed to the bottom side of the radiation fin set, a light-transmission bulb shell having retaining lugs equiangularly spaced around the bottom open side thereof, and a retainer rim set between the radiation fin set and the light-transmission bulb shell and having protruding strips equiangularly spaced around an inner perimeter of a front wall thereof and respectively plugged into the gaps between each two adjacent ones of the radiation fins and retaining notches equiangularly spaced around an outer perimeter of a back wall thereof and respectively forced into engagement with respective retaining lugs of the light transmission bulb shell.

Abstract: A heat pipe mounting method and a heat pipe assembly thereof are disclosed. The method includes the step of providing a heat-transfer block and a plurality of heat pipes. A plurality of heat pipe grooves is formed on the heat-transfer block. The heat pipes are then press-fitted to respective heat pipe grooves. During the press-fitting step, the heat pipes are flattened to force the flattened part of one heat pipe into abutment against the flattened part of another heat pipe in a flushed manner. Thereby, the heat pipes are abutted to each other with no separation therebetween. Hence, the heat transfer performance is increased.

Abstract: An omnidirectional LED lamp holder assembly includes a heat sink module including a heat sink base and radiation fins around the heat sink base, a lampshade and an electrical connector respectively mounted at opposing top and bottom sides of the heat sink module. The heat sink base is a one-piece extruded member defining a tubular heat-transfer base portion, a broad platform and a hollow protruding mount for holding LED chips at different angles. The broad platform horizontally protrudes over the periphery of the tubular heat-transfer base portion, providing a bearing face. The radiation fins are fastened to respective mounting grooves around the periphery of the tubular heat-transfer base portion. Waste heat produced during operation of the LED chips can be rapidly transferred by the hollow protruding mount to the broad platform and the heat-transfer base portion and then dissipated by the radiation fin into the outside open air.

Abstract: A non-bottom block heat sink includes a radiation module formed of a rack of radiation fins, each radiation fin having a plurality of locating notches located on one peripheral edge thereof and a supporting rib disposed between each two adjacent locating notches, and a plurality of heat pipes each having heat receiving end press-fitted into the locating notches of the radiation fins and engaged with the supporting ribs and peripherally abutted against one another in flush the associating peripheral edge of each radiation fin and a heat discharging end extended from the heat receiving end and fastenable to the radiation fins or an external radiation fin module.

Abstract: A heat pipe mounting method and a heat pipe assembly thereof are disclosed. The method includes the step of providing a heat-transfer block and a plurality of heat pipes. A plurality of heat pipe grooves is formed on the heat-transfer block. The heat pipes are then press-fitted to respective heat pipe grooves. During the press-fitting step, the heat pipes are flattened to force the flattened part of one heat pipe into abutment against the flattened part of another heat pipe in a flushed manner. Thereby, the heat pipes are abutted to each other with no separation therebetween. Hence, the heat transfer performance is increased.

Abstract: A heat sink module includes a base block having opposing top wall and bottom wall, insertion grooves located at the top wall, heat pipe grooves located at the bottom wall and rows of equally spaced holes cut through the top and bottom walls in communication between the insertion grooves and the heat pipe grooves and matching the insertion grooves, heat pipes mounted in the heat pipe grooves of the base block, and radiation fins respectively mounted in the insertion grooves of the base block, each radiation fin having heat pipe mating edges respectively inserted into the holes and stopped against the heat pipes for dissipating heat from the heat pipes.

Abstract: An LED lamp bulb includes a heat sink carrying LEDs, a radiation fin set including multiple radiation fins radially arranged around the heat sink, an insulative lamp bulb base affixed to the bottom side of the radiation fin set, a light-transmission bulb shell having retaining lugs equiangularly spaced around the bottom open side thereof, and a retainer rim set between the radiation fin set and the light-transmission bulb shell and having protruding strips equiangularly spaced around an inner perimeter of a front wall thereof and respectively plugged into the gaps between each two adjacent ones of the radiation fins and retaining notches equiangularly spaced around an outer perimeter of a back wall thereof and respectively forced into engagement with respective retaining lugs of the light transmission bulb shell.