Abstract: The present invention relates to a surgical clip, comprising a first clamping arm, a second clamping arm, and a biasing element, which first clamping arm defines a first clamping surface, which second clamping arm defines a second clamping surface, and which biasing element holds the first clamping surface and the second clamping surface against each other in a basic position, in particular under bias, wherein the first and the second clamping arm are pivotable against each other counter to the action of the biasing element, wherein the biasing element is configured in the form of a coil spring which defines a coil spring longitudinal axis and has a first coil spring end and a second coil spring end, wherein the coil spring comprises between the first coil spring end and the second coil spring end at least one winding extending over a circumferential angle of more than 360°.

Abstract: A surgical gripping/holding instrument having two instrument branches which are coupled pivotably with respect to one another. Each branch has a distal gripping/holding portion, a proximal instrument actuating portion, and an intermediate region which connects the distal and proximal portions preferably integrally, and having an instrument lock, of which the locking elements which can be brought into latching engagement with one another are arranged or formed on the instrument branches. The actuation of the instrument for opening and closing is functionally separated from actuation of the instrument for locking and unlocking the instrument by the positioning of the instrument lock in the intermediate region of the instrument. Therefore, each actuation can be carried out individually.

Abstract: A surgical clip of branch-crossed design has two Z-shaped clip branches connected to each other at a proximal end of each of the clip branches by a spring-elastic connection piece. Each of the clip branches has a jaw part at a distal section with a gripping surface. In an assembled position of the clip, the clip branches cross and the gripping surfaces are opposite each other and are held in contact on one another by a closing force of the spring-elastic connection piece. At least one first clip branch has a groove in which the second clip branch is held and/or guided, at least in sections, such that a displacement of the clip branches in a transverse direction of the clip branches is prevented.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to partitioned substrates with interconnect bridge structures and methods of manufacture. The structure includes: a plurality of substrates; at least one chip bonded and electrically connected to each of the plurality of substrates; and an interconnect bridge that physically connects the plurality of substrates and electrically connects each of the plurality of chips bonded to each of the plurality of substrates.

Abstract: A surgical gripping/holding instrument having two instrument branches which are coupled pivotably with respect to one another. Each branch has a distal gripping/holding portion, a proximal instrument actuating portion, and an intermediate region which connects the distal and proximal portions preferably integrally, and having an instrument lock, of which the locking elements which can be brought into latching engagement with one another are arranged or formed on the instrument branches. The actuation of the instrument for opening and closing is functionally separated from actuation of the instrument for locking and unlocking the instrument by the positioning of the instrument lock in the intermediate region of the instrument. Therefore, each actuation can be carried out individually.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to partitioned substrates with interconnect bridge structures and methods of manufacture. The structure includes: a plurality of substrates; at least one chip bonded and electrically connected to each of the plurality of substrates; and an interconnect bridge that physically connects the plurality of substrates and electrically connects each of the plurality of chips bonded to each of the plurality of substrates.

Abstract: A surgical clip includes two clip branches which are spring-elastically joined and pretensioned at proximal ends by a first spring element which can be rotated about a spring pivot point formed by the first spring element. The distal free ends of the clip branches are held in parallel against one another in a resting position of the surgical clip via the closing force of the first spring element. The surgical clip has a conversion device which reduces a ratio of opening force, applied to a force-guiding path for opening the clip branches, to opening angle, from a predetermined opening angle of the distal free ends of the two clip branches. A method for opening the clip includes the step of applying pressure to the clip branches on a force-guiding path formed between crossing portions and the first spring element.

Abstract: The present invention relates to a surgical clip, comprising a first clamping arm, a second clamping arm, and a biasing element, which first clamping arm defines a first clamping surface, which second clamping arm defines a second clamping surface, and which biasing element holds the first clamping surface and the second clamping surface against each other in a basic position, in particular under bias, wherein the first and the second clamping arm are pivotable against each other counter to the action of the biasing element, wherein the biasing element is configured in the form of a coil spring which defines a coil spring longitudinal axis and has a first coil spring end and a second coil spring end, wherein the coil spring comprises between the first coil spring end and the second coil spring end at least one winding extending over a circumferential angle of more than 360°.

Abstract: A pillar-type connection includes a first conductive layer that includes a hollow core. A second conductive layer is connected to the first conductive layer defining a conductive pillar that includes a top surface defining a recess aligned with the hollow core.

Abstract: A surgical clip of branch-crossed design has two Z-shaped clip branches connected to each other at a proximal end of each of the clip branches by a spring-elastic connection piece. Each of the clip branches has a jaw part at a distal section with a gripping surface. In an assembled position of the clip, the clip branches cross and the gripping surfaces are opposite each other and are held in contact on one another by a closing force of the spring-elastic connection piece. At least one first clip branch has a groove in which the second clip branch is held and/or guided, at least in sections, such that a displacement of the clip branches in a transverse direction of the clip branches is prevented.

Abstract: Disclosed is a multi-chip module (MCM) with redundant chip-to-chip communication connection(s) to minimize the need to discard a chip-mounting layer due to defective signal traces. The MCM includes at least first and second chips mounted on the chip-mounting layer. The chip-mounting layer includes signal traces that are electrically connected between first and second links on the first and second chips, respectively, to form communication connections including at least one redundant communication connection. Instead of being directly connected to the chip-to-chip communication connections, first and second interfaces on the first and second chips are connected via first and second multiplexors, respectively, to selected ones of multiple chip-to-chip communication connections. By employing the multiplexors and the redundant chip-to-chip communication connection(s), chip-to-chip communication connection(s) with defective signal trace(s) can be bypassed.

Abstract: An IC chip structure including a plurality of IC chips electrically connected to one another in back-end-of-line (BEOL) interconnect layer of the structure is disclosed. The IC structure may include openings in crack-stop structures surrounding the IC chips and a interconnect wire extending between the IC chips through the openings. A packaging structure for utilizing the IC structure where at least one IC chip is inoperable is also disclosed. The structure may include a first bond pad array on a top surface of a packaging substrate including operable bond pads connected to an operable IC chip and structural support bond pads connected to the inoperable IC chip; a second bond pad array on a bottom surface of the substrate including operable bond pads connected to a single IC chip printed circuit board; and an interconnect structure for connecting the operable bond pads of the first and second bond pad arrays.

Abstract: A gas-permeable filter system for a sterile container includes a filter element and a seal portion that sealingly surrounds a gas exchange opening provided in a sterile container wall section in such a manner that the seal portion rests against the sterile container wall section so that a sterile flow path is formed through the gas exchange opening and the filter element. A temperature-sensitive adjusting section releases at least the seal portion from the sterile container wall section when a specified temperature is reached or exceeded such that a non-sterile flow path is formed which allows fluid to be supplied or discharged via the gas exchange opening while bypassing the filter element. The sterile container includes a base and walls that define a receiving space. The sterile container also includes a cover for closing the receiving space. At least one filter system is preferably secured to the sterile container base.

Abstract: A method of manufacturing a bond pad structure may include depositing an aluminum-copper (Al—Cu) layer over a dielectric layer; and depositing an aluminum-chromium (Al—Cr) layer directly over the Al—Cu layer.

Abstract: A pillar-type connection includes a first conductive layer that includes a hollow core. A second conductive layer is connected to the first conductive layer defining a conductive pillar that includes a top surface defining a recess aligned with the hollow core. A conductive via terminates at a top surface of the first conductive layer.

Abstract: A pillar-type connection includes a first conductive layer that includes a hollow core. A second conductive layer is connected to the first conductive layer defining a conductive pillar that includes a top surface defining a recess aligned with the hollow core.

Abstract: A panel assembly is configured with individual laminates to connect processors in parallel. The individual laminates may be arranged in rows and columns and separated by gaps on adjacent sides. This arrangement forms a placement area comprising a portion of the individual laminates resident in both neighboring rows and neighboring columns. A chip may be disposed on the substrate, the chip spanning the gaps to contact the portion of the individual laminates found in the placement area.

Abstract: A multi-chip module, and method of fabricating the multi-chip module. The multi-chip module includes: a substrate containing multiple wiring layers, each wiring layer having first pads on a top surface of the substrate and second pads on a bottom surface of the substrate, wherein the second pads include split pad and a conventional pad; a first solder ball in direct physical contact with a contiguous bottom surface of the conventional pad and connected to a next level of packaging under the conventional pad, wherein the first solder ball has a first height; and a second solder ball in direct physical contact with first and second sections of the split pad separated by a gap, wherein the second solder ball has a second height that is sufficiently less than the first height such that the second solder ball is not connected to the next level of packaging.

Abstract: An IC chip structure including a plurality of IC chips electrically connected to one another in back-end-of-line (BEOL) interconnect layer of the structure is disclosed. The IC structure may include openings in crack-stop structures surrounding the IC chips and a interconnect wire extending between the IC chips through the openings. A packaging structure for utilizing the IC structure where at least one IC chip is inoperable is also disclosed. The structure may include a first bond pad array on a top surface of a packaging substrate including operable bond pads connected to an operable IC chip and structural support bond pads connected to the inoperable IC chip; a second bond pad array on a bottom surface of the substrate including operable bond pads connected to a single IC chip printed circuit board; and an interconnect structure for connecting the operable bond pads of the first and second bond pad arrays.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.